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    • 8. 发明授权
    • Wrestling shoe with separated outer soles
    • 摔跤鞋与分离的外底
    • US07325336B2
    • 2008-02-05
    • US10990064
    • 2004-11-16
    • Yoshio YamashitaHidenori YamashitaYasuhiro Morikawa
    • Yoshio YamashitaHidenori YamashitaYasuhiro Morikawa
    • A43B5/00
    • A43B5/00A43B13/16A43B13/188
    • The wrestling shoe according to the present invention comprises outer soles 1F and 1B separated forward and rearward on the side of a grounding surface of the shoe. The fore and rear outer soles 1F and 1B essentially protrude downward further than an outer skin 3, thereby to support the foot in a fore foot part and a rear foot part, respectively, when landing on the ground. The fore and rear outer soles 1F and 1B are made of an outer sole material of rubber and/or resin. The outer skin 3 is formed of a laminated body where an outer surface layer 30 and a cushion layer 31 are laminated. The outer surface layer 30 is exposed in a mid foot part M and made of substantially flexible sheet-like material, and the cushion layer 31 is laminated on the inner side of the outer surface layer 30 and made of substantially flexible rubber foam or resin foam. The outer skin 3 is formed so that a bottom portion 32 and medial and lateral roll-up portions 33 that roll up from the bottom portion 32 along an upper 2 are integrally formed.
    • 根据本发明的摔跤鞋包括在鞋的接地面的前侧和后方分开的外鞋底1F和1B。 前后外底1F和1B基本上比外皮3向下进一步向下延伸,从而当着陆在地面上时分别将脚支撑在前脚部和后脚部中。 前外鞋底1F和1B由橡胶和/或树脂的外底材料制成。 外皮3由叠层体形成,层叠体层叠有外表面层30和缓冲层31。 外表面层30暴露在中间部分M中,由基本上柔性的片状材料制成,并且缓冲层31层压在外表面层30的内侧上,并由基本上柔性的橡胶泡沫或树脂发泡体 。 外皮3形成为一体地形成从底部32沿着上部2卷起的底部32和内侧卷边部33。
    • 9. 发明申请
    • Shoe with slip preventive member
    • 鞋防滑成员
    • US20060059716A1
    • 2006-03-23
    • US10542039
    • 2004-11-15
    • Yoshio YamashitaYasuhiro MorikawaYutaka Nagai
    • Yoshio YamashitaYasuhiro MorikawaYutaka Nagai
    • A43C15/00
    • A43B13/223A43B13/14
    • An object of the present invention is to enhance durability of the non-slip member of the shoe where a lot of non-slip protuberances are fixed to the surface of a base fabric. The shoe of the present invention comprises an upper 20 that covers an instep of a foot, a sole 21 having a ground contact surface and a non-slip member 1 provided on an outer surface of the upper 20 and/or the sole 21. The non-slip member 1 comprises a base fabric 12 composed of a knitted fabric of a multilayer structure, the base fabric including an external knitted fabric layer 123 having a first surface 121 exposed to the outside and an internal knitted fabric layer 124 having a second surface 122 on a opposite side of the first surface 121 and a plurality of resin or rubber non-slip protuberances 1 that are fixed to the base fabric 12 and protrude from the first surface 121 of the external knitted fabric layer 123. A yarn constituting the external knitted fabric layer 123 is thicker than a yarn constituting the internal knitted fabric layer 124.
    • 本发明的一个目的是提高鞋子的防滑部件的耐用性,其中许多防滑突起固定在基底织物的表面上。 本发明的鞋包括覆盖脚背的上部20,具有接地表面的鞋底21和设置在鞋面20和/或鞋底21的外表面上的防滑构件1。 防滑构件1包括由多层结构的针织物构成的基底织物12,该基底织物包括具有暴露于外部的第一表面121的外部编织物层123和具有第二表面的内部针织物层124 122和多个树脂或橡胶防滑突起1,其固定到基底织物12并从外针织物层123的第一表面121突出。构成外部织物的纱线 针织物层123比构成内部编织物层124的纱线厚。
    • 10. 发明授权
    • Resists and method of manufacturing semiconductor elements by using the
same
    • 通过使用它们制造半导体元件的方法和方法
    • US4278754A
    • 1981-07-14
    • US58814
    • 1979-07-17
    • Yoshio YamashitaMitsumasa KunishiRyuji Kawazu
    • Yoshio YamashitaMitsumasa KunishiRyuji Kawazu
    • G03F7/004G03F7/039G03F7/40G03C5/00
    • G03F7/039Y10S430/143
    • A resist utilized to prepare semiconductor elements or the like comprises a copolymer of, for example, 2,3 dibromo-n-propyl methacrylate and methylmethacrylate. The resist is applied onto a substrate to form a copolymer resist layer, the copolymer resist layer is irradiated with ionizing radiations, the irradiated portions of the copolymer resist layer are dissolved to form a positive pattern, the positive pattern is heated in inert atmosphere to cause crosslinking reaction of reactive radicals remaining in the copolymer resist, and then the assembly is etched with a liquid etchant to form an etched pattern on the substrate. Alternatively, the positive pattern and the underlying substrate are treated with plasma or ions to cause a crosslinking reaction of reactive radicals remaining in the copolymer resist to simultaneously etch portions of the substrate not covered by the positive pattern.
    • 用于制备半导体元件等的抗蚀剂包括例如甲基丙烯酸2,3-二溴正丙酯和甲基丙烯酸甲酯的共聚物。 将抗蚀剂施加到基板上以形成共聚物抗蚀剂层,共聚物抗蚀剂层被电离辐射照射,共聚物抗蚀剂层的照射部分被溶解以形成正图案,阳性图案在惰性气氛中加热, 残留在共聚物抗蚀剂中的反应性基团的交联反应,然后用液体蚀刻剂蚀刻组合物以在基底上形成蚀刻图案。 或者,用等离子体或离子处理阳性图案和下面的底物以引起残留在共聚物抗蚀剂中的反应性基团的交联反应,以同时蚀刻未被阳图案覆盖的衬底的部分。