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    • 1. 发明授权
    • Automated semiconductor probing device
    • 自动半导体探测装置
    • US06825680B1
    • 2004-11-30
    • US09885362
    • 2001-06-20
    • Yakov KoganParviz TayebatiDaryoosh Vakhshoori
    • Yakov KoganParviz TayebatiDaryoosh Vakhshoori
    • G01R3102
    • G01R31/2887
    • Apparatus and methods are provided for automated semiconductor device probing. The apparatus includes a probe assembly; a machine vision system; and a semiconductor support fixture. A method includes providing apparatus for automated semiconductor device probing; locating the semiconductor device positioned on the semiconductor support fixture with the machine vision system; guiding the movement of at least one of the probe assembly and the semiconductor support fixture so as to position a contact portion of the semiconductor device and the electrical probe in alignment with one another; and moving at least one of the probe assembly and the semiconductor support fixture toward the other of the at least one of the probe assembly and the semiconductor support fixture so as to position the electrical probe and the contact portion of the semiconductor device in electrical connection with one another.
    • 提供了用于自动半导体器件探测的装置和方法。 该装置包括探针组件; 机器视觉系统; 和半导体支架。 一种方法包括提供用于自动半导体器件探测的装置; 利用机器视觉系统定位位于半导体支架上的半导体器件; 引导所述探针组件和所述半导体支撑固定装置中的至少一个的移动,以使所述半导体器件和所述电探针的接触部分彼此对齐; 以及将所述探针组件和所述半导体支撑固定件中的至少一个移动到所述探针组件和所述半导体支撑固定装置中的所述至少一个探针组件和所述半导体支撑固定装置中的另一个,以便将所述电探针和所述半导体器件的接触部分 另一个。
    • 5. 发明授权
    • Method and apparatus for precision three-dimensional opto-mechanical assembly
    • 精密三维光机械装配方法与装置
    • US06441895B1
    • 2002-08-27
    • US09789020
    • 2001-02-20
    • Yakov KoganDaryoosh Vakhshoori
    • Yakov KoganDaryoosh Vakhshoori
    • G01B900
    • G02B6/4225G02B6/4227
    • A method for achieving three-dimensional alignment of a pair of optical components, and apparatus for supporting such method, is initiated by fixing one of the optical components at a selected location on a semiconductor substrate. Subsequently, the other optical component and its associated submount are attached to a pair of coupled motion stages. A reference signal, to which the first optical component has been aligned, is transmitted to the other component and to a detector. That detector is positioned to measure changes in a selected characteristic of the reference signal, such as changes in optical power, as the position of the second optical component and its submount are manipulated. Through the use of a feedback loop, the second component and submount are moved in a pattern until an optimal alignment is converged upon.
    • 一种用于实现一对光学部件的三维对准的方法以及用于支持这种方法的装置是通过将一个光学部件固定在半导体衬底上的选定位置来启动的。 随后,另一个光学部件及其相关联的基座被附接到一对耦合的运动级。 已经对准第一光学部件的参考信号被传输到另一部件和检测器。 该检测器定位成测量参考信号的选定特性的变化,例如光功率的变化,因为第二光学部件及其副安装座的位置被操纵。 通过使用反馈回路,第二组件和底座以模式移动,直到最佳对准收敛为止。