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1. 发明申请

US20130000880A1 HEAT DISSIPATION DEVICE WITH GOOD APPEARANCE 审中-公开
标题翻译：具有良好外观的散热装置
公开(公告)号：US20130000880A1
公开(公告)日：2013-01-03
申请号：US13239286
申请日：2011-09-21
申请人： YI-QIANG WU , XUE-WEN PENG , CHUN-CHI CHEN
发明人： YI-QIANG WU , XUE-WEN PENG , CHUN-CHI CHEN
IPC分类号： F28F7/00
CPC分类号： H01L23/467 , F28F3/02 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device for a heat-generating component includes a heat dissipation fin group and a side plate. The heat dissipation fin group comprises a plurality of heat dissipation fins arranged one on the other, each of the heat dissipation fins comprises a base plate and a fold extending vertically from a side of the base plate. The folds of the heat dissipation fins located at a common side are combined with each other to form a side surface. The side plate covers the side surface of the heat dissipation fin group, and an exposed surface of the side plate includes a plurality of strips formed thereon.
摘要翻译：用于发热部件的散热装置包括散热片组和侧板。散热翅片组包括多个彼此排列的散热片，每个散热翅片包括基板和从基板的一侧垂直延伸的折叠部。位于公共侧的散热片的折叠部彼此结合形成侧面。侧板覆盖散热片组的侧表面，侧板的暴露表面包括形成在其上的多个条。

2. 发明申请

US20100252239A1 HEAT DISSIPATION DEVICE AND METHOD FOR MANUFACTURING THE SAME 失效
标题翻译：散热装置及其制造方法
公开(公告)号：US20100252239A1
公开(公告)日：2010-10-07
申请号：US12534879
申请日：2009-08-04
申请人： WEI LI , YI-QIANG WU , CHUN-CHI CHEN
发明人： WEI LI , YI-QIANG WU , CHUN-CHI CHEN
IPC分类号： F28D15/04 , B21D53/02
CPC分类号： B23P15/26 , C25D11/04 , F28D15/0275 , F28F1/32 , F28F19/02 , H01L23/3672 , H01L23/427 , H01L23/467 , H01L2924/0002 , Y10T29/4935 , H01L2924/00
摘要： A heat dissipation device includes a plurality of fins, a plurality of heat pipes connected to the fins in a thermal conductive relationship and a plurality of electric conductors extending through the fins. The fins are stacked together and spaced from each other. The heat pipes are extended through the fins. The electric conductors are electrically connected to the fins to enable consistent metal oxide films to be formed all over surfaces of the fins when anodizing the fins.
摘要翻译：散热装置包括多个散热片，多个热导管连接到散热片并具有导热关系的散热装置以及延伸穿过散热片的多个电导体。翅片堆叠在一起并彼此间隔开。热管延伸穿过翅片。电导体与翅片电连接，以便在阳极氧化翅片时在翅片的整个表面上形成一致的金属氧化物膜。

3. 发明申请

US20100038057A1 HEAT DISSIPATION DEVICE 失效
标题翻译：散热装置
公开(公告)号：US20100038057A1
公开(公告)日：2010-02-18
申请号：US12396480
申请日：2009-03-03
申请人： WEI LI , YI-QIANG WU , CHUN-CHI CHEN
发明人： WEI LI , YI-QIANG WU , CHUN-CHI CHEN
IPC分类号： F28F7/00 , H05K7/20
CPC分类号： H01L23/427 , F28D15/0275 , H01L23/3672 , H01L23/4006 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device for cooling an electronic device mounted on a printed circuited board, comprises a heat spreader contacting the electronic device, a fin assembly comprising a plurality of fins, a supporting bracket contacting the heat spreader and supporting the fin assembly, and a heat pipe extending through the fin assembly and the supporting bracket and attached to the heat spreader, wherein a lowermost fin of the fin assembly has a plurality of clasps extending near two opposite ends thereof and towards the supporting bracket. The clasps are bent to press against a bottom of the supporting bracket after the clasps extend through the supporting bracket.
摘要翻译：一种用于冷却安装在印刷线路板上的电子装置的散热装置，包括接触电子装置的散热器，包括多个翅片的散热片组件，与散热器相接触并支撑散热片组件的支架，以及散热片延伸穿过翅片组件和支撑托架并连接到散热器的管，其中翅片组件的最下部翅片具有多个在其两个相对端附近并朝向支撑托架延伸的钩扣。在扣环延伸穿过支撑托架之后，该扣被弯曲以压靠支撑托架的底部。

4. 发明申请

US20100020501A1 HEAT DISSIPATION DEVICE 有权
标题翻译：散热装置
公开(公告)号：US20100020501A1
公开(公告)日：2010-01-28
申请号：US12396477
申请日：2009-03-03
申请人： WEI LI , YI-QIANG WU , CHUN-CHI CHEN
发明人： WEI LI , YI-QIANG WU , CHUN-CHI CHEN
IPC分类号： H05K7/20
CPC分类号： H01L23/427 , F28D15/0266 , F28D15/0275 , H01L23/4006 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device comprises a heat spreader and heat pipe soldered thereon via a heat conducting material. The heat spreader defines a plurality of cavities in an inner side surface thereof, the heat conducting material is received in the cavities, and the heat pipe contacts and is soldered to the inner side surface of the heat spreader.
摘要翻译：散热装置包括通过导热材料在其上焊接的散热器和热管。散热器在其内侧表面中限定多个空腔，导热材料容纳在空腔中，并且热管接触并焊接到散热器的内侧表面。

5. 发明申请

US20110155351A1 HEAT DISSIPATION DEVICE WITH HEAT PIPE 失效
标题翻译：热管散热装置
公开(公告)号：US20110155351A1
公开(公告)日：2011-06-30
申请号：US12902170
申请日：2010-10-12
申请人： WEI LI , YI-QIANG WU , CHUN-CHI CHEN
发明人： WEI LI , YI-QIANG WU , CHUN-CHI CHEN
IPC分类号： F28D15/04
CPC分类号： F28D15/0275 , F28F1/32 , F28F2215/00 , F28F2265/00 , F28F2275/06 , H01L23/3672 , H01L23/427 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： An exemplary heat dissipation device includes a fin assembly, a heat pipe, and a protective member. The fin assembly includes stacked fins and air passages between fins. Each fin includes a main body, an extending hole defined in the main body, and a flange extending from the main body around the extending hole. The heat pipe is received in the extending holes of the fins and abuts the flanges of the fins. The protective member includes a plurality pairs of elastic arms. Each pair of elastic arms is sandwiched between a free end of the flange of a corresponding fin and the main body of a corresponding adjacent fin to prevent solder associated with the heat pipe from flowing into the corresponding air passage.
摘要翻译：示例性的散热装置包括翅片组件，热管和保护构件。翅片组件包括翅片之间的堆叠翅片和空气通道。每个翅片包括主体，限定在主体中的延伸孔以及从主体围绕延伸孔延伸的凸缘。热管被容纳在散热片的延伸孔中，并与翅片的凸缘相接触。保护构件包括多对弹性臂。每对弹性臂被夹在对应的翅片的凸缘的自由端和相应的相邻的翅片的主体之间，以防止与热管相关联的焊料流入相应的空气通道。

6. 发明申请

US20100116467A1 HEAT DISSIPATION DEVICE 审中-公开
标题翻译：散热装置
公开(公告)号：US20100116467A1
公开(公告)日：2010-05-13
申请号：US12269051
申请日：2008-11-12
申请人： WU LI , YI-QIANG WU , CHUN-CHI CHEN
发明人： WU LI , YI-QIANG WU , CHUN-CHI CHEN
IPC分类号： F28D15/00
CPC分类号： F28D15/0275 , F28F1/32 , H01L23/3672 , H01L23/427 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device includes a plurality of fins stacked together, a plurality of heat pipes extending through the fins, and solder filled in gaps between the fins and the heat pipes. Each fin includes a plate defining a plurality of holes therein for extension of the heat pipes therethrough, respectively. A collar extends from a periphery of each of the holes. The collar includes a columned portion attached to an outer surface of each of the heat pipes, and a taper portion interconnecting the plate and the columned portion. The solder fills in a gap between the columned portion and a corresponding heat pipe and a space between the taper portion and the corresponding heat pipe. The collar has a height slightly smaller than a distance between two adjacent fins.
摘要翻译：散热装置包括堆叠在一起的多个翅片，延伸穿过翅片的多个热管，以及填充在翅片和热管之间的间隙中的焊料。每个翅片包括限定多个孔的板，分别用于使热管延伸通过其中。套环从每个孔的周边延伸。套环包括附接到每个热管的外表面的柱状部分和将板和柱状部分互连的锥形部分。焊料填充在柱状部分和对应的热管之间的间隙以及锥形部分和相应的热管之间的空间。套环的高度略小于两个相邻鳍片之间的距离。

7. 发明申请

US20100025012A1 HEAT SINK ASSEMBLY 失效
标题翻译：散热装置
公开(公告)号：US20100025012A1
公开(公告)日：2010-02-04
申请号：US12185125
申请日：2008-08-04
申请人： YI-QIANG WU , CHUN-CHI CHEN
发明人： YI-QIANG WU , CHUN-CHI CHEN
IPC分类号： F28F7/00
CPC分类号： H01L23/467 , F28D15/0266 , F28D15/0275 , F28F1/32 , H01L23/3672 , H01L23/4006 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A heat sink assembly includes a base, a fin group located at a top of the base, a heat pipe connecting the base with the fin group, a fan mounted on a side of the fin group and a supporting bracket mounted on the base and supporting the fan. The supporting bracket includes a mounting portion secured on the base and a pair of supporting arms extending from the mounting portion and fixed to the fan. Four screws extend through the fan to threadedly engage with the fin group. Lower two of the screws also extend through the supporting arms of the supporting bracket whereby the supporting bracket also connects with the fan.
摘要翻译：一种散热器组件，包括基座，位于基座顶部的翅片组，将基座与翅片组连接的热管，安装在翅片组侧面的风扇和安装在基座上的支撑支架风扇。支撑托架包括固定在基座上的安装部分和从安装部分延伸并固定到风扇的一对支撑臂。四个螺丝穿过风扇，与翅片组螺纹接合。下部两个螺钉也延伸穿过支撑托架的支撑臂，由此支撑托架也与风扇连接。

8. 发明申请

US20080144286A1 HEAT DISSIPATING DEVICE HAVING A FIN ALSO FUNCTIONING AS A FAN HOLDER 失效
标题翻译：具有粉碎功能的散热装置作为风扇支架
公开(公告)号：US20080144286A1
公开(公告)日：2008-06-19
申请号：US11621085
申请日：2007-01-08
申请人： WEI LI , YI-QIANG WU
发明人： WEI LI , YI-QIANG WU
IPC分类号： H05K7/20
CPC分类号： H01L23/427 , H01L23/4006 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipating device for cooling a heat-generating electronic device, includes a heat sink assembly (10) and a fan (20) mounted to a side of the heat sink assembly. The heat sink assembly includes a heat spreader (12), a plurality of fins (14), and heat pipes (16) thermally connecting the heat spreader and the fins. The fins include at least one fastening fin (146). The fastening fin includes a pair of mounting tabs (1462). The mounting tabs of the fastening fin are oriented towards the fan for mounting the fan on the heat sink assembly. The fastening fin functions not only for dissipating heat into a surrounding environment but also for connecting the fan to the heat sink assembly.
摘要翻译：一种用于冷却发热电子装置的散热装置，包括安装在散热器组件一侧的散热器组件（10）和风扇（20）。散热器组件包括散热器（12），多个散热片（14）和热连接散热器和散热片的热管（16）。翅片包括至少一个紧固翅片（146）。紧固翅片包括一对安装突片（1462）。紧固翅片的安装翼片朝向风扇定向，以将风扇安装在散热器组件上。紧固翅片不仅用于将热量散发到周围环境中，而且还用于将风扇连接到散热器组件。

9. 发明申请

US20090059526A1 HEAT SINK ASSEMBLY AND METHOD MANUFACTURING THE SAME 失效
标题翻译：散热装置及其制造方法
公开(公告)号：US20090059526A1
公开(公告)日：2009-03-05
申请号：US11848189
申请日：2007-08-30
申请人： YI-QIANG WU
发明人： YI-QIANG WU
IPC分类号： H05K7/20 , B21D53/02
CPC分类号： H01L23/467 , B21D53/08 , B23P2700/10 , F28D15/0275 , F28F1/32 , H01L23/427 , H01L2924/0002 , Y10T29/4935 , H01L2924/00
摘要： A heat sink assembly includes a base plate, a fin group and a heat pipe thermally connecting the base plate with the fin group. The fin group includes a plurality of fins. The heat pipe includes a straight evaporating section contacting with the base plate, a first condensing section extending upwardly from an end of the evaporating section and through the fins, a second condensing section bent downwardly from a free end of the first condensing section and through the fins, and a third condensing section extending upwardly from an opposite end of the evaporating section and through the fins. Periphery walls of at least two of the first, second and third condensing sections substantially totally contact with the fins to increase a contact area between the heat pipe and the fins.
摘要翻译：散热器组件包括基板，翅片组和将基板与翅片组热连接的热管。翅片组包括多个翅片。所述热管包括与所述基板接触的直的蒸发部，从所述蒸发部的端部向上延伸并且通过所述散热片的第一冷凝部，从所述第一冷凝部的自由端向下弯曲的第二冷凝部，翅片和从蒸发部分的相对端向上延伸并通过翅片的第三冷凝部分。第一，第二和第三冷凝部分中的至少两个的外围壁基本上完全与散热片接触，以增加热管和散热片之间的接触面积。

10. 发明申请

US20080257527A1 HEAT SINK ASSEMBLY HAVING A FIN ALSO FUNCTIONING AS A SUPPORTING BRACKET 失效
标题翻译：散热组件也有一个功能，作为一个支持的支架
公开(公告)号：US20080257527A1
公开(公告)日：2008-10-23
申请号：US11737100
申请日：2007-04-18
申请人： WEI LI , YI-QIANG WU
发明人： WEI LI , YI-QIANG WU
IPC分类号： F28F3/02 , H05K7/20
CPC分类号： F28D15/0266 , F28D15/0275 , F28F1/32 , F28F2215/12 , H01L23/4006 , H01L23/427 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat sink assembly (100) for cooling a heat-generating electronic component, includes a base plate (32), a plurality of fins (50) mounted on the base plate and a heat pipe (20) thermally connecting the base plate and the fins. The fins are parallel to the base plate and include a bottom fin (40) supporting the fins on the base plate. The bottom fin includes a plurality of supporting tabs (422) engaging with the base plate and separating a body (42) of the bottom fin from the base plate. The bottom fin can be used not only for dissipating heat into a surrounding environment but also for reinforcing the whole strength of the heat sink assembly.
摘要翻译：一种用于冷却发热电子部件的散热器组件（100），包括基板（32），安装在基板上的多个散热片（50）和将基板和翅片。散热片平行于基板并且包括支撑底板上的翅片的底部翅片（40）。底部散热片包括与底板接合并将底部翅片的主体（42）与基板分开的多个支撑突片（422）。底鳍不仅可以用于将热量散发到周围环境中，而且可用于加强散热器组件的整体强度。

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