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1. 发明申请

US20130043006A1 HEAT DISSPATION DEVICE 审中-公开
标题翻译：加热装置
公开(公告)号：US20130043006A1
公开(公告)日：2013-02-21
申请号：US13337061
申请日：2011-12-24
申请人： XUE-WEN PENG , WEI LI , HAO-XIA LIU
发明人： XUE-WEN PENG , WEI LI , HAO-XIA LIU
IPC分类号： F28D15/04
CPC分类号： H01L23/3672 , F28D15/0233 , F28D15/0275 , H01L23/427 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device includes a substrate, a heat sink arranged on the substrate, and a heat pipe. The substrate includes a bottom plate, a cover, and a supporter sandwiched between the bottom plate and the cover, a receiving chamber being defined by the bottom plate, the cover and the supporter cooperatively. The heat pipe includes a U-shaped evaporation section received in the receiving chamber, a condensation section outside the receiving chamber, and a connection section interconnecting the evaporation section and the condensation section.
摘要翻译：散热装置包括基板，布置在基板上的散热器和热管。基板包括夹在底板和盖之间的底板，盖和支撑件，由底板，盖和支撑件协同地限定的接收室。热管包括容纳在容纳室中的U形蒸发部分，在容纳室外部的冷凝部分和将蒸发部分和冷凝部分互连的连接部分。

2. 发明授权

US07755902B2 Heat dissipation device for computer add-on cards 失效
标题翻译：计算机附加卡散热装置
公开(公告)号：US07755902B2
公开(公告)日：2010-07-13
申请号：US12200878
申请日：2008-08-28
申请人： Xue-Wen Peng , Rui-Hua Chen
发明人： Xue-Wen Peng , Rui-Hua Chen
IPC分类号： H05K7/20
CPC分类号： H05K7/20145 , G06F1/20 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device to be mounted on a heat-generating component of a graphics card includes a base in contact with the heat-generating component, a heat dissipating member placed on the base, a fan mounted on the base adjacent to an end of the base, and a covering body. The fan is located closely to the heat dissipating member and generates airflow to the heat dissipating member. The dissipating member has a cellular structure integrally formed therein. The covering body includes a top wall in contact with a top of the dissipating member and a sidewall extending downwardly from an edge of the top wall and surrounding the dissipating member and the fan. The cellular structure comprises a plurality of elongated passages extending from the fan to another end of the base away from the fan.
摘要翻译：安装在图形卡的发热部件上的散热装置包括与发热部件接触的基座，放置在基座上的散热部件，安装在与基座的端部相邻的基座上的风扇基座和覆盖体。风扇位于散热构件附近，并向散热构件产生气流。消散构件具有一体地形成在其中的多孔结构。覆盖体包括与散热构件的顶部接触的顶壁和从顶壁的边缘向下延伸并围绕消散构件和风扇的侧壁。蜂窝结构包括从风扇延伸到基座的远离风扇的另一端的多个细长通道。

3. 发明授权

US07447023B2 Heat dissipation device for computer add-on cards 失效
标题翻译：计算机附加卡散热装置
公开(公告)号：US07447023B2
公开(公告)日：2008-11-04
申请号：US11608650
申请日：2006-12-08
申请人： Bing Chen , Xue-Wen Peng
发明人： Bing Chen , Xue-Wen Peng
IPC分类号： H05K7/20
CPC分类号： H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device is to be mounted in a computer enclosure for dissipating heat generated by a VGA card (10). The heat dissipation device includes a heat sink (90), a fan (60) and a fan duct (50) connecting the heat sink (90) and the fan (60). The heat sink (90) contacts a heat-generating device (12) of the VGA card. The fan (60) has an inlet port (62) and an outlet port (63). The outlet port (63) communicates with an ambient air outside the computer enclosure. The fan duct (50) has two open ends (55,52). One open end (55) engages with the heat sink (90) and the other open end (52) engages with the inlet port (62) of the fan (60).
摘要翻译：散热装置将安装在计算机外壳中，用于散热由VGA卡（10）产生的热量。散热装置包括散热器（90），风扇（60）和连接散热器（90）和风扇（60）的风扇导管（50）。散热器（90）与VGA卡的发热装置（12）接触。风扇（60）具有入口（62）和出口（63）。出口端口（63）与计算机外壳外部的环境空气相通。风扇导管（50）具有两个开口端（55,52）。一个开口端（55）与散热器（90）接合，另一个开口端（52）与风扇（60）的入口（62）接合。

4. 发明授权

US07443672B2 Video graphics array (VGA) card assembly 失效
标题翻译：视频图形阵列（VGA）卡组合
公开(公告)号：US07443672B2
公开(公告)日：2008-10-28
申请号：US11309818
申请日：2006-10-03
申请人： Xue-Wen Peng , Rui-Hua Chen
发明人： Xue-Wen Peng , Rui-Hua Chen
IPC分类号： H05K7/20 , F28F7/00
CPC分类号： H01L23/467 , H01L23/4006 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A VGA card assembly includes a VGA card (90) having a heat-generating electronic component (94) mounted thereon and a heat dissipating device thermally connecting with the electronic component. The assembly includes a flow director (50) defining a receiving room (57) therein. A thermal module (10) is received in the receiving room. A bottom of the thermal module contacts with the heat-generating electronic component. A cover (80) is movably mounted on the flow director to cover the thermal module in the flow director. The cover is capable of rotating or sliding relative to the flow director to facilitate open or close of the receiving room. When the receiving room is opened, the thermal module is exposed.
摘要翻译： VGA卡组件包括具有安装在其上的发热电子部件（94）的VGA卡（90）和与电子部件热连接的散热装置。组件包括在其中限定接收室（57）的导流器（50）。一个热模块（10）被接收在接收室中。热模块的底部与发热电子部件接触。盖（80）可移动地安装在导流器上以覆盖导流器中的热模块。盖子能够相对于导流器旋转或滑动以便于接收室的打开或关闭。当接收室打开时，散热模块被暴露。

5. 发明授权

US07382618B2 Heat dissipating apparatus for computer add-on cards 失效
标题翻译：计算机附加卡散热装置
公开(公告)号：US07382618B2
公开(公告)日：2008-06-03
申请号：US11309856
申请日：2006-10-13
申请人： Xue-Wen Peng , Rui-Hua Chen
发明人： Xue-Wen Peng , Rui-Hua Chen
IPC分类号： H05K7/20 , H01L23/36
CPC分类号： H01L23/4093 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipating apparatus for dissipating heat generated by a VGA card includes a heat sink and a retention assembly. The heat sink includes a base located on the add-on card, a plurality of fins, a fan for blowing air toward the fins and a cover for covering the fins and the fan. The retention assembly includes four pegs each having a first end locked in the base of the heat sink and a second end, a back plate secured beneath the add-on card and two wire clips. The second ends of the pegs extend through the base, the add-on card and the back plate in turn and are held in position by the wire clips beneath the back plate, whereby the heat sink and the back plate are secured to opposite sides of the add-on card.
摘要翻译：用于耗散由VGA卡产生的热量的散热装置包括散热器和保持组件。散热器包括位于附加卡上的基座，多个翅片，用于朝翅片吹送空气的风扇和用于覆盖翅片和风扇的盖。保持组件包括四个栓钉，每个钉头具有锁定在散热器底座中的第一端和第二端，固定在附加卡下方的后板和两个线夹。钉的第二端依次延伸穿过基座，附加卡和背板，并通过背板下方的线夹保持在适当的位置，由此散热片和背板固定在附加卡。

6. 发明授权

US07365989B2 Heat dissipating device for computer add-on cards 失效
标题翻译：计算机附加卡散热装置
公开(公告)号：US07365989B2
公开(公告)日：2008-04-29
申请号：US11308134
申请日：2006-03-08
申请人： Xue-Wen Peng , Rui-Hua Chen , Jun-Hai Li
发明人： Xue-Wen Peng , Rui-Hua Chen , Jun-Hai Li
IPC分类号： H05K7/20
CPC分类号： G06F1/20 , H01L23/3672 , H01L23/427 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipating device mounted onto a VGA card (10) includes a base (22) contacting with a GPU (12) attached on the VGA card, a cover (21) mounted on the base, and a plurality of fins (24) received between and thermally connecting the cover and the base. The base defines a slot (222) above the GPU. A fan (28) is positioned on the base for driving an airflow, wherein one portion of the airflow flows through the fins and another portion of the airflow flows through the slot and blows over other electronic components near to the GPU. Thus, rebounding of the airflow is reduced, and the heat dissipating device has better heat dissipating efficiency.
摘要翻译：安装在VGA卡（10）上的散热装置包括与安装在VGA卡上的GPU（12）接触的基座（22），安装在基座上的盖（21）和多个翅片（24）在盖和基座之间进行热连接。基座定义GPU上方的槽（222）。风扇（28）位于基座上用于驱动气流，其中气流的一部分流过翅片，另一部分气流流过狭槽并吹过靠近GPU的其它电子部件。因此，气流的反弹降低，散热装置具有更好的散热效率。

7. 发明申请

US20080089026A1 HEAT DISSIPATING APPARATUS FOR COMPUTER ADD-ON CARDS 失效
标题翻译：用于计算机附加卡的散热装置
公开(公告)号：US20080089026A1
公开(公告)日：2008-04-17
申请号：US11309856
申请日：2006-10-13
申请人： Xue-Wen Peng , Rui-Hua Chen
发明人： Xue-Wen Peng , Rui-Hua Chen
IPC分类号： H05K7/20
CPC分类号： H01L23/4093 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipating apparatus for dissipating heat generated by a VGA card includes a heat sink and a retention assembly. The heat sink includes a base located on the add-on card, a plurality of fins, a fan for blowing air toward the fins and a cover for covering the fins and the fan. The retention assembly includes fours pegs each having a first end locked in the base of the heat sink and a second end, a back plate secured beneath the add-on card and two wire clips. The second ends of the pegs extend through the base, the add-on card and the back plate in turn and are held in position by the wire clips beneath the back plate, whereby the heat sink and the back plate are secured to opposite sides of the add-on card.
摘要翻译：用于耗散由VGA卡产生的热量的散热装置包括散热器和保持组件。散热器包括位于附加卡上的基座，多个翅片，用于朝翅片吹送空气的风扇和用于覆盖翅片和风扇的盖。保持组件包括四个栓钉，每个钉头具有锁定在散热器的底部中的第一端和第二端，固定在附加卡下方的后板和两个线夹。钉的第二端依次延伸穿过基座，附加卡和背板，并通过背板下方的线夹保持在适当的位置，由此散热片和背板固定在附加卡。

8. 发明授权

US07319588B2 Heat dissipation device 失效
标题翻译：散热装置
公开(公告)号：US07319588B2
公开(公告)日：2008-01-15
申请号：US11307153
申请日：2006-01-25
申请人： Xue-Wen Peng , Bing Chen
发明人： Xue-Wen Peng , Bing Chen
IPC分类号： H05K7/20
CPC分类号： H01L23/467 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation assembly includes a printed circuit board, first and second heat dissipation units each defining a channel therein and a heat pipe. The printed circuit board has an electronic heat-generating component mounted thereon. The first heat dissipation unit is attached to a top surface of the heat-generating component. The second heat dissipation unit has a main portion disposed beneath the printed circuit board and another portion extending from a level beneath the printed circuit board to another level above the printed circuit board. The heat pipe is wholly disposed above the printed circuit board and comprises an evaporating portion rotatably received in the channel of the first heat dissipation unit and a condensing portion rotatably received in the channel of the second heat dissipation unit.
摘要翻译：散热组件包括印刷电路板，每个在其中限定通道的第一和第二散热单元和热管。印刷电路板上安装有电子发热部件。第一散热单元附接到发热部件的顶表面。第二散热单元具有设置在印刷电路板下方的主要部分和从印刷电路板下方的水平面延伸到印刷电路板上方另一个高度的另一部分。热管完全设置在印刷电路板的上方，并包括可旋转地容纳在第一散热单元的通道中的蒸发部分和可旋转地容纳在第二散热单元的通道中的冷凝部分。

9. 发明申请

US20070258218A1 HEAT DISSIPATION DEVICE 失效
标题翻译：散热装置
公开(公告)号：US20070258218A1
公开(公告)日：2007-11-08
申请号：US11308775
申请日：2006-05-02
申请人： Xue-Wen Peng , Rui-Hua Chen
发明人： Xue-Wen Peng , Rui-Hua Chen
IPC分类号： H05K7/20
CPC分类号： H01L23/427 , F28D15/0275 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device used for dissipating heat from heat generating electronic components mounted on an interface card, which has a mounting bracket for being mounted to a computer case, includes a heat-absorbing member, a pair of heat pipes and a pair of heat-dissipating members. The heat-absorbing member is bound to the heat generating electronic components for absorbing heat generated by the electronic components. The heat-dissipating members are disposed within the computer case and located at one peripheral side edge of the graphics card. The heat-absorbing member and the heat-dissipating members are connected by the heat pipes so as to transfer the heat received by the heat-absorbing member to the heat-dissipating members for further dissipating.
摘要翻译：用于散热装置的散热装置包括：吸热构件，一对热管和一对热交换器，所述散热装置用于从安装在接口卡上的发热电子部件散热，消散部件。吸热构件与用于吸收电子部件产生的热量的发热电子部件结合。散热构件设置在计算机外壳内并且位于显卡的一个周边侧边缘处。吸热构件和散热构件通过热管连接，以将由吸热构件接收的热量传递到散热构件以进一步消散。

10. 发明申请

US20070119566A1 HEAT DISSIPATION DEVICE 审中-公开
标题翻译：散热装置
公开(公告)号：US20070119566A1
公开(公告)日：2007-05-31
申请号：US11164594
申请日：2005-11-30
申请人： Xue-Wen Peng
发明人： Xue-Wen Peng
IPC分类号： H05K7/20
CPC分类号： H01L23/427 , H01L23/3672 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device includes a fin set including a plurality of fins assembled together and a fan located beside the fin set. Pluralities of air passages are defined between the fins. Each fin has two spaced flaps extending from a main body thereof and dividing the main body to upper and lower portions and a middle portion between the two flaps. The middle portion has a converging entrance between two corresponding end sections of the two flaps. The fan confronts to the air passages and the converging entrances of the middle portions of the fins of the fin set.
摘要翻译：散热装置包括翅片组，其包括组装在一起的多个翅片和位于翅片组旁边的风扇。在翅片之间限定多个空气通道。每个翅片具有从其主体延伸的两个间隔的翼片，并将主体分为上部和下部以及两个翼片之间的中间部分。中间部分在两个翼片的两个对应端部之间具有会聚入口。风扇面对翅片组的翅片的空气通道和会聚入口。

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