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    • 1. 发明授权
    • Process for producing high performance thermoelectric modules
    • 生产高性能热电模块的工艺
    • US6127619A
    • 2000-10-03
    • US93966
    • 1998-06-08
    • Xiaomei XiGoran S. MatijasevicLutz BrandtLinh Ha
    • Xiaomei XiGoran S. MatijasevicLutz BrandtLinh Ha
    • H01L35/16H01L35/32H01L35/34H01L35/28
    • H01L35/34H01L35/16H01L35/32
    • A method for cost-effectively producing thermoelectric elements and thermoelectric modules with a multitude of thermoelectric couples is disclosed. This method makes the fabrication of very small size thermoelectric elements and miniaturized, compact, powerful thermoelectric modules possible. Methods of the present invention can be also used to fabricate integrated thermoelectric modules in electrical or other devices. The invented method is based on an additive technology using thermoelectric pastes and a patternable insulator layer. Layers of conductive traces are first fabricated on the two insulating planes. A patternable insulator layer is formed and filled with P- and N-type thermoelectric pastes. The thermoelectric elements are formed during the curing or sintering of the thermoelectric pastes. Sizes and positions of the thermoelectric elements are defined by the patterned insulator layer. Thermoelectric modules are obtained by electrically connecting the P- and N-type thermoelectric elements through the electrical conductive traces on the two insulating planes.
    • 公开了一种用于成本有效地制造具有多个热电偶的热电元件和热电模块的方法。 这种方法使得可以制造非常小尺寸的热电元件和小型化,紧凑的,强大的热电模块。 本发明的方法也可用于在电气或其他装置中制造集成的热电模块。 本发明的方法是基于使用热电糊和可图案化绝缘体层的添加技术。 导电迹线层首先在两个绝缘平面上制造。 形成可图案化的绝缘体层并填充有P-型和N型热电型糊料。 在热电渣的固化或烧结期间形成热电元件。 热电元件的尺寸和位置由图案化的绝缘体层限定。 通过在两个绝缘平面上的导电迹线电连接P-型和N-型热电元件来获得热电模块。
    • 2. 发明授权
    • Metal-containing compositions and uses thereof, including preparation of
resistor and thermistor elements
    • 含金属的组合物及其用途,包括制备电阻和热敏电阻元件
    • US5980785A
    • 1999-11-09
    • US942368
    • 1997-10-02
    • Xiaomei XiSam FuGoran MatijavesicLutz BrandtCatharine GallagherPradeep Gandhi
    • Xiaomei XiSam FuGoran MatijavesicLutz BrandtCatharine GallagherPradeep Gandhi
    • C08K3/00H01B1/02H01B1/00C08J3/00C08K3/08
    • C08K3/0008
    • In accordance with the present invention, there are provided novel metal-containing compositions useful for the preparation of electrical resistance devices (e.g., resistors and thermistor elements). Compositions according to the invention comprise at least one low melting point metal material, and optionally a higher melting point metal material, with the further presence of a binder system also being optional. Compositions according to the invention exhibit a wide range of resistivity and a wide range of values for temperature coefficient of resistance (TCR). Compositions with low values for TCR are useful for resistor applications while compositions with large values for TCR are useful for thermistor applications. Resistor or thermistor elements can be produced by applying compositions according to the invention onto suitable substrates and subsequently alloying (i.e., curing and/or sintering) the compositions. During curing/sintering, the metal or metal alloy powders undergo transient liquid phase sintering to form a continuous metallurgical network. The electrical conduction of the resulting resistor and/or thermistor elements is achieved as a result of the continuous metallurgical network. Resistance and values for TCR of resistors and/or thermistors prepared employing compositions according to the invention are dependent on the intermetallic compounds formed as a result of the alloying/sintering process. Resistors and thermistor elements formed employing compositions according to the invention are stable up to approximately 250.degree. C. and can be used in the temperature range of about -50.degree. C. up to about 200.degree. C. These metal-containing compositions are compatible with polymer, metal and other types of substrates, are highly reliable as compared to existing technology.
    • 根据本发明,提供了用于制备电阻装置(例如电阻器和热敏电阻元件)的新颖的含金属组合物。 根据本发明的组合物包含至少一种低熔点金属材料和任选的较高熔点的金属材料,另外还存在粘合剂体系也是可选的。 根据本发明的组合物表现出宽范围的电阻率和宽的温度范围的温度系数值(TCR)。 具有低TCR值的组合对于电阻器应用是有用的,而具有大的TCR值的组合物可用于热敏电阻应用。 电阻或热敏电阻元件可以通过将根据本发明的组合物施加到合适的基底上并随后将组合物合金化(即固化和/或烧结)来制备。 在固化/烧结期间,金属或金属合金粉末进行瞬态液相烧结,形成连续的冶金网络。 所得到的电阻和/或热敏电阻元件的导电是由于连续的冶金网络而实现的。 使用根据本发明的组合物制备的电阻器和/或热敏电阻的TCR的电阻和值取决于由于合金/烧结工艺而形成的金属间化合物。 使用根据本发明的组合物形成的电阻器和热敏电阻元件在高达约250℃下是稳定的,并且可以在约-50℃至约200℃的温度范围内使用。这些含金属组合物与 聚合物,金属和其他类型的基材,与现有技术相比是高度可靠的。
    • 6. 发明授权
    • Metal-plating of cured and sintered transient liquid phase sintering
pastes
    • 固化和烧结瞬态液相烧结膏的金属镀层
    • US5922397A
    • 1999-07-13
    • US816401
    • 1997-03-03
    • Lutz BrandtPradeep GandhiBryan Shearer
    • Lutz BrandtPradeep GandhiBryan Shearer
    • C23C18/16C25D5/54H05K1/09H05K3/24B05D5/12
    • H05K3/246C23C18/1608C23C18/1612C23C18/1651C25D5/54H05K1/095
    • In accordance with the present invention, it has been discovered that conductive traces made from transient liquid phase sintering (TLPS) pastes, plated by electroless or electrolytic means, result in improved solderability, adhesion and conductivity of the circuitry. Transient liquid phase sintering pastes employed in the practice of the present invention differ from conventional metal loaded polymer thick film (PTF) inks in that they contain, in addition to a binder, they also contain both a relatively high melting metal powder and a relatively low melting solder powder capable of forming a continuous intermetallic/metallic phase after sintering. The present invention is particularly useful, for example, for the fabrication of single and multi-layer printed circuit boards, providing horizontal and vertical conductive interconnects, metallized through-holes, and conductive pads for electronic component attachment.
    • 根据本发明,已经发现,由通过无电解或电解方法电镀的瞬态液相烧结(TLPS)糊料制成的导电迹线导致电路的可焊性,粘附性和导电性的改善。 在本发明的实践中使用的瞬态液相烧结浆料与常规的金属负载聚合物厚膜(PTF)油墨不同之处在于,除了粘合剂之外,它们还含有相对较高的熔融金属粉末和相对低的 能够在烧结后形成连续的金属间/金属相的熔融焊料粉末。 本发明特别有用,例如用于制造单层和多层印刷电路板,提供水平和垂直导电互连,金属化通孔和用于电子元件连接的导电焊盘。