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1. 发明授权

US6127619A Process for producing high performance thermoelectric modules 失效
标题翻译：生产高性能热电模块的工艺
公开(公告)号：US6127619A
公开(公告)日：2000-10-03
申请号：US93966
申请日：1998-06-08
申请人： Xiaomei Xi , Goran S. Matijasevic , Lutz Brandt , Linh Ha
发明人： Xiaomei Xi , Goran S. Matijasevic , Lutz Brandt , Linh Ha
IPC分类号： H01L35/16 , H01L35/32 , H01L35/34 , H01L35/28
CPC分类号： H01L35/34 , H01L35/16 , H01L35/32
摘要： A method for cost-effectively producing thermoelectric elements and thermoelectric modules with a multitude of thermoelectric couples is disclosed. This method makes the fabrication of very small size thermoelectric elements and miniaturized, compact, powerful thermoelectric modules possible. Methods of the present invention can be also used to fabricate integrated thermoelectric modules in electrical or other devices. The invented method is based on an additive technology using thermoelectric pastes and a patternable insulator layer. Layers of conductive traces are first fabricated on the two insulating planes. A patternable insulator layer is formed and filled with P- and N-type thermoelectric pastes. The thermoelectric elements are formed during the curing or sintering of the thermoelectric pastes. Sizes and positions of the thermoelectric elements are defined by the patterned insulator layer. Thermoelectric modules are obtained by electrically connecting the P- and N-type thermoelectric elements through the electrical conductive traces on the two insulating planes.
摘要翻译：公开了一种用于成本有效地制造具有多个热电偶的热电元件和热电模块的方法。这种方法使得可以制造非常小尺寸的热电元件和小型化，紧凑的，强大的热电模块。本发明的方法也可用于在电气或其他装置中制造集成的热电模块。本发明的方法是基于使用热电糊和可图案化绝缘体层的添加技术。导电迹线层首先在两个绝缘平面上制造。形成可图案化的绝缘体层并填充有P-型和N型热电型糊料。在热电渣的固化或烧结期间形成热电元件。热电元件的尺寸和位置由图案化的绝缘体层限定。通过在两个绝缘平面上的导电迹线电连接P-型和N-型热电元件来获得热电模块。

2. 发明授权

US5948533A Vertically interconnected electronic assemblies and compositions useful therefor 失效
标题翻译：垂直互连的电子组件和有用的组合物
公开(公告)号：US5948533A
公开(公告)日：1999-09-07
申请号：US813809
申请日：1997-03-06
申请人： Catherine A. Gallagher , Goran S. Matijasevic , Pradeep Gandhi , M. Albert Capote
发明人： Catherine A. Gallagher , Goran S. Matijasevic , Pradeep Gandhi , M. Albert Capote
IPC分类号： H05K1/11 , B23K35/02 , H01B1/22 , H01L23/498 , H01L23/538 , H05K1/09 , H05K3/32 , H05K3/34 , H05K3/40 , H05K3/46 , H01B1/02
CPC分类号： H05K3/462 , B23K35/0222 , H01L23/49827 , H01L23/49883 , H01L23/5384 , H05K1/095 , H05K3/321 , H05K3/4069 , H01L2224/293 , H01L2924/01079 , H05K2201/0272 , H05K2201/10378 , H05K2203/0425 , H05K2203/1105 , H05K3/3489 , H05K3/4623 , H05K3/4647 , Y10S428/901 , Y10T428/31511 , Y10T428/31529 , Y10T428/31681
摘要： In accordance with the present invention, there are provided novel vertically interconnected assemblies and compositions useful therefore. Invention assemblies comprise substrate boards with multiple layer electronic assemblies. The multiple layers comprise individual layers of circuitry separated and adhered by dielectric materials selectively coated and/or filled with a transient liquid phase sintered (TLPS) material. The TLPS is formulated to be electrically conductive, and thereby serves to convey current between the layers of circuitry. In addition, the TLPS is easily workable so that it is amenable to automated, stepwise construction of multilayer circuitry without the need for labor intensive drilling and filling of conductive vias.
摘要翻译：根据本发明，提供了因此有用的新颖的垂直互连组件和组合物。本发明组件包括具有多层电子组件的基板。多层包括由选择性地涂覆和/或填充有瞬态液相烧结（TLPS）材料的电介质材料分离和粘附的各层电路。 TLPS被配制为导电的，从而用于在电路层之间传送电流。此外，TLPS易于工作，因此它可以自动化，逐步构建多层电路，而无需劳动密集型钻孔和填充导电通孔。

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