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1. 发明申请

US20020097303A1 Electrostatically-actuated device having a corrugated multi-layer membrane structure 有权
标题翻译：具有波纹多层膜结构的静电致动装置
公开(公告)号：US20020097303A1
公开(公告)日：2002-07-25
申请号：US09768676
申请日：2001-01-24
申请人： Xerox Corporation
发明人： Peter M. Gulvin , Elliott A. Eklund
IPC分类号： B41J002/05
CPC分类号： H02N1/006 , B41J2/14314 , F04B43/043
摘要： A micro-electromechanical fluid ejector including a substrate having an insulating layer thereon; a conductor formed on said insulating layer; a membrane adjacent to said conductor, said membrane having a corrugated, multi-layer structure for added rigidity; and an actuator chamber formed between said membrane and said conductor, said membrane flexing toward said conductor when a voltage bias is applied thereto.
摘要翻译：一种微机电流体喷射器，包括其上具有绝缘层的基板; 形成在所述绝缘层上的导体; 与所述导体相邻的膜，所述膜具有波纹状多层结构，用于增加刚性; 以及形成在所述膜和所述导体之间的致动器室，当施加电压偏压时，所述膜朝着所述导体弯曲。

2. 发明申请

US20030087468A1 Membrane structures for micro-devices, micro-devices including same and methods for making same 失效
标题翻译：用于微器件的膜结构，包括其的微器件及其制造方法
公开(公告)号：US20030087468A1
公开(公告)日：2003-05-08
申请号：US09986107
申请日：2001-11-07
申请人： XEROX CORPORATION
发明人： Peter M. Gulvin , Elliott A. Eklund , Joel A. Kubby
IPC分类号： H01L021/00
CPC分类号： B81C1/00476 , B81B2203/0127 , B81C2201/053
摘要： A structure for a micro-device is fabricated by forming: a first layer of sacrificial material, a layer of structural material over the first sacrificial material layer, a second layer of sacrificial material over the structural material layer and a protective layer over the second sacrificial material layer. A release etch is used to remove the first and second sacrificial material layers at approximately the same rate. A structural feature may also be fabricated by forming: a first layer of a first material; a layer of structural material over the first layer of the first material; at least one cut in the structural material layer; and, a first layer of a sacrificial material, different from the first material, over the structural material layer such that an interface is created between the first layer of the sacrificial material and the first layer of the first material at the at least one cut.
摘要翻译：通过在第一牺牲材料层上形成第一牺牲材料层，结构材料层，在结构材料层上形成第二牺牲材料层，在第二牺牲层上形成保护层，制成微器件结构材料层。使用释放蚀刻以大致相同的速率去除第一和第二牺牲材料层。还可以通过形成第一材料的第一层来制造结构特征; 在第一材料的第一层上方的结构材料层; 在结构材料层中至少有一个切口; 以及在所述结构材料层上方的与所述第一材料不同的牺牲材料的第一层，使得在所述牺牲材料的第一层和所述至少一个切口处的所述第一材料的所述第一层之间形成界面。

3. 发明申请

US20020096488A1 Method for fabricating a micro-electro-mechanical fluid ejector 有权
标题翻译：微机电液体喷射器的制造方法
公开(公告)号：US20020096488A1
公开(公告)日：2002-07-25
申请号：US09768688
申请日：2001-01-24
申请人： Xerox Corporation
发明人： Peter M. Gulvin , Elliott A. Eklund
IPC分类号： G11B005/127 , B41J002/04
CPC分类号： B81B3/007 , B41J2/14314 , B41J2/16 , B41J2/1628 , B41J2/1629 , B41J2/1631 , B41J2/1639 , B41J2/1642 , B81B2201/052 , B81B2203/0127 , F04B43/043 , H04R7/08
摘要： A method for fabricating a membrane having a corrugated, multi-layer structure, comprising the steps of: providing a substrate having an insulator layer on the top surface of the substrate, a conductive layer on the insulator layer, a sacrificial layer on said conductive layer, and a second conductive layer; patterning a series of holes the second conductive layer to allow release etchant to have access to a second sacrificial layer; depositing the second sacrificial layer onto said second conductive layer so that the series of holes are filled with the second sacrificial layer; patterning the second sacrificial layer with a radial and/or concentric grid pattern so that a third conductive layer when deposited will form the support structure and top portion of the corrugated structure; depositing the third conductive layer so that the grid pattern is filled in and is in contact with the second conductive layer; removing the first and second sacrificial layer by immersing the device in a release etchant.
摘要翻译：一种用于制造具有波纹状多层结构的膜的方法，包括以下步骤：在所述基板的顶表面上提供具有绝缘体层的基板，所述绝缘体层上的导电层，所述导电层上的牺牲层，和第二导电层; 将一系列孔图案化成第二导电层，以允许剥离蚀刻剂进入第二牺牲层; 将所述第二牺牲层沉积到所述第二导电层上，使得所述一系列孔被所述第二牺牲层填充; 以径向和/或同心网格图案图案化第二牺牲层，使得沉积时的第三导电层将形成波纹结构的支撑结构和顶部; 沉积第三导电层，使得栅格图案被填充并与第二导电层接触; 通过将设备浸入释放蚀刻剂中来去除第一和第二牺牲层。

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