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    • 3. 发明申请
    • Nonvolatile memory device and method of fabricating the same
    • 非易失性存储器件及其制造方法
    • US20080157176A1
    • 2008-07-03
    • US11902511
    • 2007-09-21
    • Won-joo KimYoon-dong ParkJune-mo KooSuk-pil KimSung-jae Byun
    • Won-joo KimYoon-dong ParkJune-mo KooSuk-pil KimSung-jae Byun
    • H01L27/115H01L21/8247
    • H01L27/115H01L27/11521H01L27/11524H01L27/11568H01L29/42336H01L29/66803
    • A nonvolatile memory device having lower bit line contact resistance and a method of fabricating the same is provided. In the nonvolatile memory device, a semiconductor substrate of a first conductivity type may include first and second fins. A common bit line electrode may connect one end of the first fin to one end of the second fin. A plurality of control gate electrodes may cover the first and second fins and expand across the top surface of each of the first and second fins. A first string selection gate electrode may be positioned between the common bit line electrode and the plurality of control gate electrodes. The first string selection gate electrode may cover the first and second fins and expand across the top surface of each of the first and second fins. A second string selection gate electrode may be positioned between the first string selection gate electrode and the plurality of control gate electrodes. The second string selection gate electrode may cover the first and second fins and expand across the top surface of each of the first and second fins. The first fin under the first string selection gate electrode and the second fin under the second string selection gate electrode may have a second conductivity type opposite to the first conductivity type.
    • 提供一种具有较低位线接触电阻的非易失性存储器件及其制造方法。 在非易失性存储器件中,第一导电类型的半导体衬底可以包括第一和第二鳍片。 公共位线电极可将第一鳍片的一端连接到第二鳍片的一端。 多个控制栅极电极可以覆盖第一和第二鳍片并且跨越第一和第二鳍片中的每一个的顶表面膨胀。 第一串选择栅极可以位于公共位线电极和多个控制栅电极之间。 第一串选择栅电极可以覆盖第一和第二鳍片并且横跨第一和第二鳍片中的每一个的顶表面扩展。 第二串选择栅电极可以位于第一串选择栅电极和多个控制栅电极之间。 第二串选择栅电极可以覆盖第一和第二鳍片并且横跨第一和第二鳍片中的每一个的顶表面扩展。 第一串选择栅电极下的第一鳍和第二串选择栅电极下的第二鳍可以具有与第一导电类型相反的第二导电类型。
    • 5. 发明申请
    • Non-volatile memory device and method of fabricating the same
    • 非易失性存储器件及其制造方法
    • US20080123390A1
    • 2008-05-29
    • US11882694
    • 2007-08-03
    • Won-joo KimSuk-pil KimYoon-dong ParkJune-mo Koo
    • Won-joo KimSuk-pil KimYoon-dong ParkJune-mo Koo
    • G11C11/00H01L21/16
    • G11C11/5678G11C13/0004H01L27/24
    • A non-volatile memory device and a method of fabricating the same are provided. In the non-volatile memory device, at least one first semiconductor layer of a first conductivity type may be formed spaced apart from each other on a portion of a substrate. A plurality of first resistance variation storage layers may contact first sidewalls of each of the at least one first semiconductor layer. A plurality of second semiconductor layers of a second conductivity type, opposite to the first conductivity type, may be interposed between the first sidewalls of each of the at least one first semiconductor layer and the plurality of first resistance variation storage layers. A plurality of bit line electrodes may be connected to each of the plurality of first resistance variation storage layers.
    • 提供了一种非易失性存储器件及其制造方法。 在非易失性存储器件中,第一导电类型的至少一个第一半导体层可以在衬底的一部分上彼此间隔开形成。 多个第一电阻变化存储层可以接触至少一个第一半导体层中的每一个的第一侧壁。 与第一导电类型相反的第二导电类型的多个第二半导体层可以插入在至少一个第一半导体层和多个第一电阻变化存储层中的每一个的第一侧壁之间。 多个位线电极可以连接到多个第一电阻变化存储层中的每一个。
    • 7. 发明授权
    • Non-volatile memory devices and methods of operating the same
    • 非易失性存储器件及其操作方法
    • US07813180B2
    • 2010-10-12
    • US12005376
    • 2007-12-27
    • Won-joo KimYoon-dong ParkJune-mo KooSuk-pil KimTae-hee Lee
    • Won-joo KimYoon-dong ParkJune-mo KooSuk-pil KimTae-hee Lee
    • G11C7/00
    • H01L29/7881G11C16/3418H01L27/115H01L27/11521H01L29/42328H01L29/42336H01L29/66825
    • Example embodiment non-volatile memory devices may be capable of increased integration and reliability and may provide example methods of operating non-volatile memory devices. Example embodiment non-volatile memory devices may include a first control gate electrode on a semiconductor substrate. A first charge storing layer may be between the semiconductor substrate and the first control gate electrode. A source region may be defined in the semiconductor substrate at one side of the first control gate electrode. A first auxiliary gate electrode may be at the other side of the first control gate electrode and may be recessed into the semiconductor substrate. A first drain region may be defined in the semiconductor substrate at one side of the first auxiliary gate electrode opposite to the first control gate electrode. A bit line may be connected to the first drain region.
    • 示例性实施例非易失性存储器设备可能能够提高集成度和可靠性,并且可以提供操作非易失性存储器设备的示例性方法。 示例性实施例非易失性存储器件可以包括半导体衬底上的第一控制栅电极。 第一电荷存储层可以在半导体衬底和第一控制栅电极之间。 源区域可以在第一控制栅电极的一侧的半导体衬底中限定。 第一辅助栅电极可以在第一控制栅电极的另一侧,并且可以凹入到半导体衬底中。 第一漏极区域可以在第一辅助栅电极的与第一控制栅电极相对的一侧的半导体衬底中限定。 位线可以连接到第一漏区。
    • 8. 发明授权
    • Non-volatile memory device and method of fabricating the same
    • 非易失性存储器件及其制造方法
    • US07700935B2
    • 2010-04-20
    • US11882694
    • 2007-08-03
    • Won-joo KimSuk-pil KimYoon-dong ParkJune-mo Koo
    • Won-joo KimSuk-pil KimYoon-dong ParkJune-mo Koo
    • H01L47/00
    • G11C11/5678G11C13/0004H01L27/24
    • A non-volatile memory device and a method of fabricating the same are provided. In the non-volatile memory device, at least one first semiconductor layer of a first conductivity type may be formed spaced apart from each other on a portion of a substrate. A plurality of first resistance variation storage layers may contact first sidewalls of each of the at least one first semiconductor layer. A plurality of second semiconductor layers of a second conductivity type, opposite to the first conductivity type, may be interposed between the first sidewalls of each of the at least one first semiconductor layer and the plurality of first resistance variation storage layers. A plurality of bit line electrodes may be connected to each of the plurality of first resistance variation storage layers.
    • 提供了一种非易失性存储器件及其制造方法。 在非易失性存储器件中,第一导电类型的至少一个第一半导体层可以在衬底的一部分上彼此间隔开形成。 多个第一电阻变化存储层可以接触至少一个第一半导体层中的每一个的第一侧壁。 与第一导电类型相反的第二导电类型的多个第二半导体层可以插入在至少一个第一半导体层和多个第一电阻变化存储层中的每一个的第一侧壁之间。 多个位线电极可以连接到多个第一电阻变化存储层中的每一个。