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    • 2. 发明申请
    • Non-volatile memory devices and method thereof
    • 非易失性存储器件及其方法
    • US20070103963A1
    • 2007-05-10
    • US11490129
    • 2006-07-21
    • Won-Joo KimSung-Jae ByunYoon-Dong ParkEun-Hong LeeSuk-Pil KimJae-Woong Hyun
    • Won-Joo KimSung-Jae ByunYoon-Dong ParkEun-Hong LeeSuk-Pil KimJae-Woong Hyun
    • G11C11/00
    • G11C13/0007G11C11/5678G11C11/5685G11C13/0004G11C16/0416G11C2213/31G11C2213/32G11C2213/72H01L27/11521H01L27/11568
    • Non-volatile memory devices and a method thereof are provided. A non-volatile memory device according to an example embodiment of the present invention may include a first transistor including a source, a drain, and a control gate, a first storage node coupled to the first transistor, the first storage node configured to store information in a first manner, a first diode having a first end connected to the source of the transistor, the first diode configured to rectify a flow of current from the source of the transistor and a second storage node connected to a second end of the first diode, the second storage node configured to store information in a second manner. Another non-volatile memory device according to another example embodiment of the present invention may include a semiconductor substrate having a first conductivity type including an active region defined by a device isolating layer, a source region and a drain region formed by doping an impurity having a second conductivity type in the active region, a control gate electrode insulated from the active region, the control gate electrode extending across the active region disposed between the source region and the drain region, a first storage node layer interposed between the active region and the control gate electrode configured to store information in a first manner, a second storage node layer disposed on the source region configured to store information in a second manner and a diode interposed between the source region and the second storage node layer to rectify a flow of current to the source region. The example method may be directed to obtaining a higher storage capacity per cell area in either of the above-described example non-volatile memory devices.
    • 提供了非易失性存储器件及其方法。 根据本发明的示例性实施例的非易失性存储器件可以包括:第一晶体管,包括源极,漏极和控制栅极;耦合到第一晶体管的第一存储节点,第一存储节点,被配置为存储信息 以第一方式,第一二极管具有连接到晶体管的源极的第一端,第一二极管被配置为对来自晶体管的源极的电流进行整流,以及连接到第一二极管的第二端的第二存储节点 所述第二存储节点被配置为以第二方式存储信息。 根据本发明的另一示例性实施例的另一非易失性存储器件可以包括具有第一导电类型的半导体衬底,该第一导电类型包括由器件隔离层限定的有源区,源区和漏区, 有源区中的第二导电类型,与有源区绝缘的控制栅电极,跨越设置在源区和漏区之间的有源区延伸的控制栅电极,插入在有源区和控制区之间的第一存储节点层 栅电极,其被配置为以第一方式存储信息;第二存储节点层,被布置在源区域上,被配置为以第二方式存储信息;以及二极管,插入在源区域和第二存储节点层之间,以将电流流向 源区域。 示例性方法可以针对在上述任一示例非易失性存储器件中获得每个单元区域的更高的存储容量。
    • 3. 发明授权
    • Non-volatile memory devices and method thereof
    • 非易失性存储器件及其方法
    • US07436704B2
    • 2008-10-14
    • US11490129
    • 2006-07-21
    • Won-Joo KimSung-Jae ByunYoon-Dong ParkEun-Hong LeeSuk-Pil KimJae-Woong Hyun
    • Won-Joo KimSung-Jae ByunYoon-Dong ParkEun-Hong LeeSuk-Pil KimJae-Woong Hyun
    • G11C11/34
    • G11C13/0007G11C11/5678G11C11/5685G11C13/0004G11C16/0416G11C2213/31G11C2213/32G11C2213/72H01L27/11521H01L27/11568
    • Non-volatile memory devices and a method thereof are provided. A non-volatile memory device according to an example embodiment of the present invention may include a first transistor including a source, a drain, and a control gate, a first storage node coupled to the first transistor, the first storage node configured to store information in a first manner, a first diode having a first end connected to the source of the transistor, the first diode configured to rectify a flow of current from the source of the transistor and a second storage node connected to a second end of the first diode, the second storage node configured to store information in a second manner. Another non-volatile memory device according to another example embodiment of the present invention may include a semiconductor substrate having a first conductivity type including an active region defined by a device isolating layer, a source region and a drain region formed by doping an impurity having a second conductivity type in the active region, a control gate electrode insulated from the active region, the control gate electrode extending across the active region disposed between the source region and the drain region, a first storage node layer interposed between the active region and the control gate electrode configured to store information in a first manner, a second storage node layer disposed on the source region configured to store information in a second manner and a diode interposed between the source region and the second storage node layer to rectify a flow of current to the source region. The example method may be directed to obtaining a higher storage capacity per cell area in either of the above-described example non-volatile memory devices.
    • 提供了非易失性存储器件及其方法。 根据本发明的示例性实施例的非易失性存储器件可以包括:第一晶体管,包括源极,漏极和控制栅极;耦合到第一晶体管的第一存储节点,第一存储节点,被配置为存储信息 以第一方式,第一二极管具有连接到晶体管的源极的第一端,第一二极管被配置为对来自晶体管的源极的电流进行整流,以及连接到第一二极管的第二端的第二存储节点 所述第二存储节点被配置为以第二方式存储信息。 根据本发明的另一示例性实施例的另一非易失性存储器件可以包括具有第一导电类型的半导体衬底,该第一导电类型包括由器件隔离层限定的有源区,源区和漏区, 有源区中的第二导电类型,与有源区绝缘的控制栅电极,跨越设置在源区和漏区之间的有源区延伸的控制栅电极,插入在有源区和控制区之间的第一存储节点层 栅电极,其被配置为以第一方式存储信息;第二存储节点层,被布置在源区域上,被配置为以第二方式存储信息;以及二极管,插入在源区域和第二存储节点层之间,以将电流流向 源区域。 示例性方法可以针对在上述任一示例非易失性存储器件中获得每个单元区域的更高的存储容量。
    • 7. 发明授权
    • Method of manufacturing a non-volatile memory device
    • 制造非易失性存储器件的方法
    • US07947590B2
    • 2011-05-24
    • US12588064
    • 2009-10-02
    • Yoon-Dong ParkWon-Joo KimJune-Mo KooSuk-Pil KimJae-Woong HyunJung-Hoon Lee
    • Yoon-Dong ParkWon-Joo KimJune-Mo KooSuk-Pil KimJae-Woong HyunJung-Hoon Lee
    • H01L21/3205H01L21/4763
    • H01L27/115H01L21/764H01L27/11521H01L27/11568H01L29/66825H01L29/66833H01L29/788H01L29/792
    • The non-volatile memory device may include a semiconductor substrate having a body and a pair of fins. A bridge insulating layer may non-electrically connect upper portions of the pair of fins to define a void between the pair of fins. Outer surfaces of the pair of fins are the surfaces of the pair of fins that do not face the void and inner surfaces of the pair of fins are the surfaces of the pair of fins that do face the void. The non-volatile memory device may further include at least one control gate electrode that may cover at least a portion of outer surfaces of the pair of fins, may extend over the bridge insulating layer, and may be isolated from the semiconductor substrate. At least one pair of gate insulating layers may be between the at least one control gate electrode and the pair of fins, and at least one pair of storage nodes may be between the at least one pair of gate insulating layers and the at least one control gate electrode.
    • 非易失性存储器件可以包括具有主体和一对翅片的半导体衬底。 桥式绝缘层可以非电连接该对翅片的上部,以限定一对翅片之间的空隙。 一对翅片的外表面是一对翅片的不面向空隙的表面,并且一对翅片的内表面是面对空隙的一对翅片的表面。 非易失性存储器件还可以包括至少一个可覆盖该对散热片的外表面的至少一部分的控制栅极电极,可以在该桥绝缘层上延伸,并且可以与该半导体衬底隔离。 至少一对栅极绝缘层可以在至少一个控制栅极电极和一对散热片之间,并且至少一对存储节点可以位于至少一对栅极绝缘层之间,并且至少一个控制 栅电极。
    • 8. 发明授权
    • Non-volatile memory device and method of manufacturing the same
    • 非易失性存储器件及其制造方法
    • US07622761B2
    • 2009-11-24
    • US11723222
    • 2007-03-19
    • Yoon-Dong ParkWon-Joo KimJune-Mo KooSuk-Pil KimJae-Woong HyunJung-Hoon Lee
    • Yoon-Dong ParkWon-Joo KimJune-Mo KooSuk-Pil KimJae-Woong HyunJung-Hoon Lee
    • H01L29/76
    • H01L27/115H01L21/764H01L27/11521H01L27/11568H01L29/66825H01L29/66833H01L29/788H01L29/792
    • The non-volatile memory device may include a semiconductor substrate having a body and a pair of fins. A bridge insulating layer may non-electrically connect upper portions of the pair of fins to define a void between the pair of fins. Outer surfaces of the pair of fins are the surfaces of the pair of fins that do not face the void and inner surfaces of the pair of fins are the surfaces of the pair of fins that do face the void. The non-volatile memory device may further include at least one control gate electrode that may cover at least a portion of outer surfaces of the pair of fins, may extend over the bridge insulating layer, and may be isolated from the semiconductor substrate. At least one pair of gate insulating layers may be between the at least one control gate electrode and the pair of fins, and at least one pair of storage nodes may be between the at least one pair of gate insulating layers and the at least one control gate electrode.
    • 非易失性存储器件可以包括具有主体和一对翅片的半导体衬底。 桥式绝缘层可以非电连接该对翅片的上部,以限定一对翅片之间的空隙。 一对翅片的外表面是一对翅片的不面向空隙的表面,并且一对翅片的内表面是面对空隙的一对翅片的表面。 非易失性存储器件还可以包括至少一个可覆盖该对散热片的外表面的至少一部分的控制栅极电极,可以在该桥绝缘层上延伸,并且可以与该半导体衬底隔离。 至少一对栅极绝缘层可以在至少一个控制栅极电极和一对散热片之间,并且至少一对存储节点可以位于至少一对栅极绝缘层之间,并且至少一个控制 栅电极。
    • 10. 发明授权
    • Fin-FET having GAA structure and methods of fabricating the same
    • 具有GAA结构的Fin-FET及其制造方法
    • US07514325B2
    • 2009-04-07
    • US11505936
    • 2006-08-18
    • Suk-Pil KimJae-Woong HyunYoon-Dong ParkWon-Joo KimDong-Gun ParkChoong-Ho Lee
    • Suk-Pil KimJae-Woong HyunYoon-Dong ParkWon-Joo KimDong-Gun ParkChoong-Ho Lee
    • H01L21/336
    • H01L29/785H01L29/42392H01L29/66795
    • Example embodiments of the present invention relate to a semiconductor device and methods of fabricating the same. Other example embodiments of the present invention relate to a fin-field effect transistor (Fin-FET) having a fin-type channel region and methods of fabricating the same. A Fin-FET having a gate all around (GAA) structure that may use an entire area around a fin as a channel region is provided. The Fin-FET having the GAA structure includes a semiconductor substrate having a body, a pair of support pillars and a fin. The pair of support pillars may protrude from the body. A fin may be spaced apart from the body and may have ends connected to and supported by the pair of support pillars. A gate electrode may surround at least a portion of the fin of the semiconductor substrate. The gate electrode may be insulated from the semiconductor substrate. A gate insulation layer may be interposed between the gate electrode and the fin of the semiconductor substrate.
    • 本发明的示例性实施例涉及一种半导体器件及其制造方法。 本发明的其它示例性实施例涉及一种具有鳍型沟道区的鳍式场效应晶体管(Fin-FET)及其制造方法。 提供了可以使用围绕鳍片的整个区域作为沟道区域的具有栅极全(GAA)结构的鳍FET。 具有GAA结构的Fin-FET包括具有主体,一对支撑柱和鳍的半导体衬底。 一对支柱可能从身体突出。 翅片可以与主体间隔开,并且可以具有连接到一对支撑柱并由其支撑的端部。 栅电极可围绕半导体衬底的鳍的至少一部分。 栅电极可以与半导体衬底绝缘。 栅极绝缘层可以插入在半导体衬底的栅电极和鳍之间。