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    • 1. 发明授权
    • Method for laser-cutting structural components to be joined
    • 激光切割待接合结构件的方法
    • US07176408B2
    • 2007-02-13
    • US10471547
    • 2002-03-07
    • Wolfgang SchulzJan MichelPeter AbelsGerhard AlberJörg NeubertFriedrich BehrStefan Kaierle
    • Wolfgang SchulzJan MichelPeter AbelsGerhard AlberJörg NeubertFriedrich BehrStefan Kaierle
    • B23K26/38B23K26/03
    • B23K26/38B23K26/04B23K26/24
    • In a method for cutting structural components to be joined by laser radiation that is guided by a computer-controlled manipulation system provided with a nominal path for each structural component corresponding to a joining line that is curved as a result of at least one of the structural components being three-dimensionally shaped, the structural component surfaces of the structural components including the joining line are determined measuring technologically. Based on measuring results, the nominal path corresponding to a penetration line of the structural components to be joined is calculated. A marking is formed on a first one of the structural component surfaces. When performing the cut on the structural component surface provided with the marking, the resulting cutting gap and the marking are determining measuring technologically. When a deviation of the cutting gap from the nominal path is detected, the manipulation system is controlled to correct the deviation.
    • 在用于切割由激光辐射连接的结构部件的方法中,所述方法由计算机控制的操纵系统引导,所述计算机控制的操纵系统具有对应于作为结构的至少一个的弯曲的接合线的每个结构部件的标称路径 由三维构件构成的结构部件的结构部件表面由接合线构成,由技术上确定。 基于测量结果,计算与要连接的结构部件的穿透线相对应的标称路径。 在第一个结构部件表面上形成标记。 当在具有标记的结构部件表面上进行切割时,所产生的切割间隙和标记在技术上决定测量。 当检测到切割间隙与标称路径的偏差时,控制操纵系统以校正偏差。
    • 2. 发明申请
    • Method for laser-cutting structural components to be joined
    • 激光切割待接合结构件的方法
    • US20060151452A1
    • 2006-07-13
    • US10471547
    • 2002-03-07
    • Wolfgang SchulzJan MichelPeter AbelsGerhard AlberJorg NeubertFriedrich BehrStefan Kajerle
    • Wolfgang SchulzJan MichelPeter AbelsGerhard AlberJorg NeubertFriedrich BehrStefan Kajerle
    • B23K26/38B23K26/03G06F19/00
    • B23K26/38B23K26/04B23K26/24
    • In a method for cutting structural components to be joined by laser radiation that is guided by a computer-controlled manipulation system provided with a nominal path for each structural component corresponding to a joining line that is curved as a result of at least one of the structural components being three-dimensionally shaped, the structural component surfaces of the structural components including the joining line are determined measuring technologically. Based on measuring results, the nominal path corresponding to a penetration line of the structural components to be joined is calculated. A marking is formed on a first one of the structural component surfaces. When performing the cut on the structural component surface provided with the marking, the resulting cutting gap and the marking are determining measuring technologically. When a deviation of the cutting gap from the nominal path is detected, the manipulation system is controlled to correct the deviation.
    • 在用于切割由激光辐射连接的结构部件的方法中,所述方法由计算机控制的操纵系统引导,所述计算机控制的操纵系统具有对应于作为至少一个所述结构的结果弯曲的接合线的每个结构部件的标称路径 由三维构件构成的结构部件的结构部件表面由接合线构成,由技术上确定。 基于测量结果,计算与要连接的结构部件的穿透线相对应的标称路径。 在第一个结构部件表面上形成标记。 当在具有标记的结构部件表面上进行切割时,所产生的切割间隙和标记在技术上决定测量。 当检测到切割间隙与标称路径的偏差时,控制操纵系统以校正偏差。
    • 3. 发明授权
    • Method for measuring phase boundaries of a material during machining with a machining beam using additional illumination radiation and an automated image processing algorithm, and associated device
    • 用于使用附加的照射辐射和自动图像处理算法以及相关联的装置在用加工梁加工期间测量材料的相边界的方法
    • US08207471B2
    • 2012-06-26
    • US11885812
    • 2006-03-07
    • Boris RegaardAnas MoalemJan MichelPeter AbelsStefan KaierleWolfgang Schulz
    • Boris RegaardAnas MoalemJan MichelPeter AbelsStefan KaierleWolfgang Schulz
    • B23K26/03
    • B23K26/032
    • The present invention relates to a method for measuring phase boundaries of a material during the machining of a workpiece (12) with a machining beam, more preferably with a laser beam, and a device that is embodied in such a way as to carry out the method. According to said method, during the machining, a machining region (13) containing the impact point of the machining beam (1) on the workpiece (12) is illuminated at least approximately coaxially to the machining beam (1) by means of additional optical radiation (2). Radiation (3) reflected by the machining region (13) is detected, parallel to an incidence direction of the optical radiation (2) or at small angle thereto, by means of an optical detector with local resolution, in order to obtain an optical reflection pattern of the machining region (13). From the optical reflection pattern, a course of at least one liquid/solid phase boundary in the machining region (13) is then determined in an automated manner by means of an image processing algorithm on the basis of a transition from an area containing a large-surface homogeneous area and an area containing a plurality of small-surface homogeneous areas in the optical reflection pattern.
    • 本发明涉及一种用于在用加工光束加工工件(12)期间测量材料的相边界的方法,更优选地使用激光束,以及以如下方式实施的装置: 方法。 根据所述方法,在加工过程中,通过附加的光学至少与加工光束(1)同轴地照射包含加工光束(1)在工件(12)上的冲击点的加工区域(13) 辐射(2)。 通过具有局部分辨率的光学检测器来检测与加工区域(13)反射的辐射(3)平行于光辐射(2)的入射方向或以小的角度,以获得光学反射 加工区域(13)的图案。 从光学反射图案,在加工区域(13)中至少一个液相/固相边界的过程随后通过图像处理算法以自动方式基于从包含大的区域的区域的过渡来确定 表面均质区域和在光学反射图案中包含多个小表面均匀区域的区域。
    • 4. 发明申请
    • Method for Measuring Phase Boundaries of a Material During Machining With a Machining Beam Using Additional Illumination Radiation and an Automated Image Processing Algorithm, and Associated Device
    • 使用附加照明辐射和自动图像处理算法的加工光束加工期间材料相边界的方法及相关装置
    • US20090032512A1
    • 2009-02-05
    • US11885812
    • 2006-03-07
    • Boris RegaardAnas MoalemJan MichelPeter AbelsStefan KaierleWolfgang Schulz
    • Boris RegaardAnas MoalemJan MichelPeter AbelsStefan KaierleWolfgang Schulz
    • B23K26/03
    • B23K26/032
    • The present invention relates to a method for measuring phase boundaries of a material during the machining of a workpiece (12) with a machining beam, more preferably with a laser beam, and a device that is embodied in such a way as to carry out the method. According to said method, during the machining, a machining region (13) containing the impact point of the machining beam (1) on the workpiece (12) is illuminated at least approximately coaxially to the machining beam (1) by means of additional optical radiation (2). Radiation (3) reflected by the machining region (13) is detected, parallel to an incidence direction of the optical radiation (2) or at small angle thereto, by means of an optical detector with local resolution, in order to obtain an optical reflection pattern of the machining region (13). From the optical reflection pattern, a course of at least one liquid/solid phase boundary in the machining region (13) is then determined in an automated manner by means of an image processing algorithm on the basis of a transition from an area containing a large-surface homogeneous area and an area containing a plurality of small-surface homogeneous areas in the optical reflection pattern.
    • 本发明涉及一种用于在用加工光束加工工件(12)期间测量材料的相边界的方法,更优选地使用激光束,以及以如下方式实施的装置: 方法。 根据所述方法,在加工过程中,通过附加的光学至少与加工光束(1)同轴地照射包含加工光束(1)在工件(12)上的冲击点的加工区域(13) 辐射(2)。 通过具有局部分辨率的光学检测器来检测与加工区域(13)反射的辐射(3)平行于光辐射(2)的入射方向或以小的角度,以获得光学反射 加工区域(13)的图案。 从光学反射图案,在加工区域(13)中至少一个液相/固相边界的过程随后通过图像处理算法以自动方式基于从包含大的区域的区域的过渡来确定 表面均质区域和在光学反射图案中包含多个小表面均匀区域的区域。