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1. 发明申请

US20120070145A1 METHOD AND SYSTEM FOR SHIELDING SEMICONDUCTOR DEVICES FROM LIGHT 有权
标题翻译：用于屏蔽半导体器件的方法和系统
公开(公告)号：US20120070145A1
公开(公告)日：2012-03-22
申请号：US12888223
申请日：2010-09-22
申请人： Wingshenq Wong , David Gani , Glenn De Los Reyes
发明人： Wingshenq Wong , David Gani , Glenn De Los Reyes
IPC分类号： G03B17/00 , B05D5/06 , H05K9/00
CPC分类号： B05D1/325 , B05D1/02 , G02B27/0018
摘要： The present disclosure is directed to a camera module that includes at least a semiconducting die, an image-sensing circuit, a lens, a lens aperture, and a coating that adheres to an exterior surface of the camera module. The coating is opaque to light and prevents light from accessing the camera other than through the lens aperture. The opaque coating is applied as a fluid and is cured. In one embodiment, a mask material is selectively applied to exterior surfaces of the semiconducting die, electrical interconnect layers, glass layers, the lens body, or the lens aperture. After applying the opaque coating, the selectively applied mask material is removed. Methods of selectively applying a mask material include applying a conformable and peelably releasable dope-like material, placing an array of joined, selectively shaped rigid masks over an array of assemblies, and applying a conformable mask material that is heat-expandable.
摘要翻译：本公开涉及一种照相机模块，其包括至少半导体裸片，图像感测电路，透镜，透镜孔径以及附着到相机模块的外表面的涂层。涂层对于光是不透明的，并且防止除了通过透镜孔之外的光进入相机。将不透明涂层作为流体施加并固化。在一个实施例中，掩模材料被选择性地施加到半导体管芯，电互连层，玻璃层，透镜体或透镜孔的外表面。在施加不透明涂层之后，去除选择性施加的掩模材料。选择性地施加掩模材料的方法包括施加适形和可剥离的可剥离的涂料样材料，将一组连接的选择性形状的刚性掩模放置在组件阵列上，以及施加可热膨胀的适形掩模材料。

2. 发明授权

US08642119B2 Method and system for shielding semiconductor devices from light 有权
标题翻译：用于屏蔽半导体器件的光的方法和系统
公开(公告)号：US08642119B2
公开(公告)日：2014-02-04
申请号：US12888223
申请日：2010-09-22
申请人： Wingshenq Wong , David Gani , Glenn De Los Reyes
发明人： Wingshenq Wong , David Gani , Glenn De Los Reyes
IPC分类号： B05D5/06
CPC分类号： B05D1/325 , B05D1/02 , G02B27/0018
摘要： The present disclosure is directed to a camera module that includes at least a semiconducting die, an image-sensing circuit, a lens, a lens aperture, and a coating that adheres to an exterior surface of the camera module. The coating is opaque to light and prevents light from accessing the camera other than through the lens aperture. The opaque coating is applied as a fluid and is cured. In one embodiment, a mask material is selectively applied to exterior surfaces of the semiconducting die, electrical interconnect layers, glass layers, the lens body, or the lens aperture. After applying the opaque coating, the selectively applied mask material is removed. Methods of selectively applying a mask material include applying a conformable and peelably releasable dope-like material, placing an array of joined, selectively shaped rigid masks over an array of assemblies, and applying a conformable mask material that is heat-expandable.
摘要翻译：本公开涉及一种照相机模块，其包括至少半导体裸片，图像感测电路，透镜，透镜孔径以及附着到相机模块的外表面的涂层。涂层对于光是不透明的，并且防止除了通过透镜孔之外的光进入相机。将不透明涂层作为流体施加并固化。在一个实施例中，掩模材料被选择性地施加到半导体管芯，电互连层，玻璃层，透镜体或透镜孔的外表面。在施加不透明涂层之后，去除选择性施加的掩模材料。选择性地施加掩模材料的方法包括施加适形和可剥离的可剥离的涂料样材料，将一组连接的选择性形状的刚性掩模放置在组件阵列上，以及施加可热膨胀的适形掩模材料。

3. 发明授权

US08576574B2 Electromagnetic interference shielding on semiconductor devices 有权
标题翻译：半导体器件上的电磁干扰屏蔽
公开(公告)号：US08576574B2
公开(公告)日：2013-11-05
申请号：US12764704
申请日：2010-04-21
申请人： Wingshenq Wong , David Gani , Glenn De Los Reyes
发明人： Wingshenq Wong , David Gani , Glenn De Los Reyes
IPC分类号： H05K1/18
CPC分类号： H01L21/565 , H01L21/561 , H01L23/3128 , H01L23/552 , H01L24/19 , H01L24/97 , H01L2224/04105 , H01L2224/20 , H01L2224/97 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/01082 , H01L2924/14 , H01L2924/1815 , H01L2924/19041 , H01L2924/3025 , H01L2224/81 , H01L2924/00
摘要： A conductive paint electromagnetic interference (EMI) shield for an electronic module or device. The conductive paint is composed of metal particles suspended in a fluidic carrier. In one embodiment, the conductive paint is sprayed onto exterior surfaces of an electronic module or device from a spray gun. The sprayed conductive paint is cured to remove the fluidic carrier, leaving a metal film coated to the outside of the module or device. In one embodiment used with electronic packages in array form, grooves are cut into an encapsulation material of a module so that the shield protection includes sidewalls of the package. In another embodiment used with camera modules, masking is used to selectively shield portions of the module. In a further embodiment, the shield is electrically connected to a ground conductor of a circuit of the electronic module.
摘要翻译：电子模块或设备的导电油漆电磁干扰（EMI）屏蔽。导电涂料由悬浮在流体载体中的金属颗粒组成。在一个实施例中，导电涂料从喷枪喷到电子模块或装置的外表面上。固化喷涂的导电涂料以除去流体载体，留下金属膜涂覆在模块或装置的外部。在与阵列形式的电子封装件一起使用的一个实施例中，沟槽被切割成模块的封装材料，使得屏蔽保护包括封装的侧壁。在与相机模块一起使用的另一个实施例中，掩模用于选择性地屏蔽模块的部分。在另一实施例中，屏蔽电连接到电子模块的电路的接地导体。

4. 发明申请

US20110261550A1 USE OF CONDUCTIVE PAINT AS A METHOD OF ELECTROMAGNETIC INTERFERENCE SHIELDING ON SEMICONDUCTOR DEVICES 有权
标题翻译：导电涂料的使用作为半导体器件电磁干涉屏蔽方法
公开(公告)号：US20110261550A1
公开(公告)日：2011-10-27
申请号：US12764704
申请日：2010-04-21
申请人： Wingsheng Wong , David Gani , Glenn De Los Reyes
发明人： Wingsheng Wong , David Gani , Glenn De Los Reyes
IPC分类号： H05K9/00 , H01L21/56
CPC分类号： H01L21/565 , H01L21/561 , H01L23/3128 , H01L23/552 , H01L24/19 , H01L24/97 , H01L2224/04105 , H01L2224/20 , H01L2224/97 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/01082 , H01L2924/14 , H01L2924/1815 , H01L2924/19041 , H01L2924/3025 , H01L2224/81 , H01L2924/00
摘要： A conductive paint electromagnetic interference (EMI) shield for an electronic module or device. The conductive paint is composed of metal particles suspended in a fluidic carrier. In one embodiment, the conductive paint is sprayed onto exterior surfaces of an electronic module or device from a spray gun. The sprayed conductive paint is cured to remove the fluidic carrier, leaving a metal film coated to the outside of the module or device. In one embodiment used with electronic packages in array form, grooves are cut into an encapsulation material of a module so that the shield protection includes sidewalls of the package. In another embodiment used with camera modules, masking is used to selectively shield portions of the module. In a further embodiment, the shield is electrically connected to a ground conductor of a circuit of the electronic module.
摘要翻译：电子模块或设备的导电油漆电磁干扰（EMI）屏蔽。导电涂料由悬浮在流体载体中的金属颗粒组成。在一个实施例中，导电涂料从喷枪喷到电子模块或装置的外表面上。固化喷涂的导电涂料以除去流体载体，留下金属膜涂覆在模块或装置的外部。在与阵列形式的电子封装件一起使用的一个实施例中，沟槽被切割成模块的封装材料，使得屏蔽保护包括封装的侧壁。在与相机模块一起使用的另一个实施例中，掩模用于选择性地屏蔽模块的部分。在另一实施例中，屏蔽电连接到电子模块的电路的接地导体。

5. 发明申请

US20130164867A1 EMBEDDED WAFER LEVEL OPTICAL PACKAGE STRUCTURE AND MANUFACTURING METHOD 有权
标题翻译：嵌入式水平光学包装结构与制造方法
公开(公告)号：US20130164867A1
公开(公告)日：2013-06-27
申请号：US13335548
申请日：2011-12-22
申请人： Anandan Ramasamy , KahWee Gan , Hk Looi , David Gani
发明人： Anandan Ramasamy , KahWee Gan , Hk Looi , David Gani
IPC分类号： H01L33/48
CPC分类号： H01L25/167 , H01L23/5389 , H01L24/19 , H01L27/14618 , H01L27/14632 , H01L27/14683 , H01L2924/12042 , H01L2924/181 , H01L2924/00
摘要： A method of forming an embedded wafer level optical package includes attaching a sensor die, PCB bars and an LED on adhesive tape laminated on a carrier, attaching a dam between two light sensitive sensors of the sensor die, encapsulating the sensor die, the PCB bars, the LED, and the dam in an encapsulation layer, debonding the carrier, grinding a top surface of the encapsulation layer, forming vias through the encapsulation layer to the sensor die and the LED, filling the vias with conductive material, metalizing the top surface of the encapsulation layer, dielectric coating of the top surface of the encapsulation layer, dielectric coating of a bottom surface of the encapsulation layer, patterning the dielectric coating of the bottom surface of the encapsulation layer, and plating the patterned dielectric coating of the bottom surface of the encapsulation layer.
摘要翻译：一种形成嵌入式晶片级光学封装的方法包括将传感器芯片，PCB条和LED粘贴在层压在载体上的粘合带上，将传感器管芯的两个感光传感器之间的坝连接，封装传感器管芯，PCB条，LED和封装层中的坝，使载体脱粘，研磨封装层的顶表面，通过封装层形成通孔到传感器裸片和LED，用导电材料填充通孔，使顶表面金属化封装层的顶表面的电介质涂层，封装层的底表面的电介质涂层，图案化封装层底表面的电介质涂层，以及镀覆底表面的图案化电介质涂层的封装层。

6. 发明授权

US08492181B2 Embedded wafer level optical package structure and manufacturing method 有权
标题翻译：嵌入式晶圆级光封装结构及制造方法
公开(公告)号：US08492181B2
公开(公告)日：2013-07-23
申请号：US13335548
申请日：2011-12-22
申请人： Anandan Ramasamy , KahWee Gan , Hk Looi , David Gani
发明人： Anandan Ramasamy , KahWee Gan , Hk Looi , David Gani
IPC分类号： H01L21/00
CPC分类号： H01L25/167 , H01L23/5389 , H01L24/19 , H01L27/14618 , H01L27/14632 , H01L27/14683 , H01L2924/12042 , H01L2924/181 , H01L2924/00
摘要： A method of forming an embedded wafer level optical package includes attaching a sensor die, PCB bars and an LED on adhesive tape laminated on a carrier, attaching a dam between two light sensitive sensors of the sensor die, encapsulating the sensor die, the PCB bars, the LED, and the dam in an encapsulation layer, debonding the carrier, grinding a top surface of the encapsulation layer, forming vias through the encapsulation layer to the sensor die and the LED, filling the vias with conductive material, metalizing the top surface of the encapsulation layer, dielectric coating of the top surface of the encapsulation layer, dielectric coating of a bottom surface of the encapsulation layer, patterning the dielectric coating of the bottom surface of the encapsulation layer, and plating the patterned dielectric coating of the bottom surface of the encapsulation layer.
摘要翻译：一种形成嵌入式晶片级光学封装的方法包括将传感器芯片，PCB条和LED粘贴在层压在载体上的粘合带上，将传感器管芯的两个感光传感器之间的坝连接，封装传感器管芯，PCB条，LED和封装层中的坝，使载体脱粘，研磨封装层的顶表面，通过封装层形成通孔到传感器裸片和LED，用导电材料填充通孔，使顶表面金属化封装层的顶表面的电介质涂层，封装层的底表面的电介质涂层，图案化封装层底表面的电介质涂层，以及镀覆底表面的图案化电介质涂层的封装层。

7. 发明授权

US06486354B1 Solid phase supports 失效
标题翻译：固相支持
公开(公告)号：US06486354B1
公开(公告)日：2002-11-26
申请号：US09485613
申请日：2000-04-17
申请人： David Gani , Friedrich Erich Karl Kroll , Michael John Plater , John Richard Morphy , David Rees
发明人： David Gani , Friedrich Erich Karl Kroll , Michael John Plater , John Richard Morphy , David Rees
IPC分类号： C07C31500
CPC分类号： G01N33/545 , C07K1/042 , C08F8/30 , C08F8/34
摘要： Embodiments of the present invention generally relate to carrying out organic chemistry on solid supports comprising derivatised functionalities, methods for synthesizing said supports, methods for synthesizing compounds comprising amine groups or N-containing heterocycles using said solid supports, intermediate compounds linked to said supports and uses thereof.
摘要翻译：本发明的实施方案通常涉及在包含衍生化官能团的固体支持物上进行有机化学，用于合成所述载体的方法，使用所述固体支持物合成包含胺基或含N杂环的化合物的方法，与所述载体连接的中间体化合物和用途其中。

8. 发明授权

US07183367B2 Vinyl sulphone modified polymer 失效
标题翻译：乙烯基砜改性聚合物
公开(公告)号：US07183367B2
公开(公告)日：2007-02-27
申请号：US10799912
申请日：2004-03-12
申请人： David Gani , Friedrich E. Kroll , Michael J. Plater , John R. Morphy , David C. Rees
发明人： David Gani , Friedrich E. Kroll , Michael J. Plater , John R. Morphy , David C. Rees
IPC分类号： C08F12/36 , C08F12/30
CPC分类号： C08F8/34 , C08F8/32 , C08F2810/20 , C08F2810/30 , C08F212/14 , C08F8/06 , C08F8/20 , C08F8/26 , C08F8/44 , C08F8/12
摘要： There is provided a polymer having a side chain of general formula (I) in which R may be any suitable alkyl, oxyalkyl, aryl or oxyaryl linking group R is preferably C1-6 alkyl (especially —CH2—), a benzene group or a group —CH2—O-Phe-. Generally, the side chain will be attached to an ethylene moiety forming part of the backbone of the polymer. Preferred polymers include polystyrene. The polymer is useful as a support for solid phase chemical reactions especially combinatorial chemical synthesis.
摘要翻译：提供具有通式（I）侧链的聚合物，其中R可以是任何合适的烷基，烷氧基，芳基或氧芳基连接基团R优选为C 1-6烷基（特别是-CH 2 - ， - 苯基或基团-CH 2 -O-Phe - 。通常，侧链将连接到形成聚合物主链部分的乙烯部分。优选的聚合物包括聚苯乙烯。该聚合物可用作固相化学反应的支持，特别是组合化学合成。

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