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1. 发明授权

US08492181B2 Embedded wafer level optical package structure and manufacturing method 有权
标题翻译：嵌入式晶圆级光封装结构及制造方法
公开(公告)号：US08492181B2
公开(公告)日：2013-07-23
申请号：US13335548
申请日：2011-12-22
申请人： Anandan Ramasamy , KahWee Gan , Hk Looi , David Gani
发明人： Anandan Ramasamy , KahWee Gan , Hk Looi , David Gani
IPC分类号： H01L21/00
CPC分类号： H01L25/167 , H01L23/5389 , H01L24/19 , H01L27/14618 , H01L27/14632 , H01L27/14683 , H01L2924/12042 , H01L2924/181 , H01L2924/00
摘要： A method of forming an embedded wafer level optical package includes attaching a sensor die, PCB bars and an LED on adhesive tape laminated on a carrier, attaching a dam between two light sensitive sensors of the sensor die, encapsulating the sensor die, the PCB bars, the LED, and the dam in an encapsulation layer, debonding the carrier, grinding a top surface of the encapsulation layer, forming vias through the encapsulation layer to the sensor die and the LED, filling the vias with conductive material, metalizing the top surface of the encapsulation layer, dielectric coating of the top surface of the encapsulation layer, dielectric coating of a bottom surface of the encapsulation layer, patterning the dielectric coating of the bottom surface of the encapsulation layer, and plating the patterned dielectric coating of the bottom surface of the encapsulation layer.
摘要翻译：一种形成嵌入式晶片级光学封装的方法包括将传感器芯片，PCB条和LED粘贴在层压在载体上的粘合带上，将传感器管芯的两个感光传感器之间的坝连接，封装传感器管芯，PCB条，LED和封装层中的坝，使载体脱粘，研磨封装层的顶表面，通过封装层形成通孔到传感器裸片和LED，用导电材料填充通孔，使顶表面金属化封装层的顶表面的电介质涂层，封装层的底表面的电介质涂层，图案化封装层底表面的电介质涂层，以及镀覆底表面的图案化电介质涂层的封装层。

2. 发明申请

US20130164867A1 EMBEDDED WAFER LEVEL OPTICAL PACKAGE STRUCTURE AND MANUFACTURING METHOD 有权
标题翻译：嵌入式水平光学包装结构与制造方法
公开(公告)号：US20130164867A1
公开(公告)日：2013-06-27
申请号：US13335548
申请日：2011-12-22
申请人： Anandan Ramasamy , KahWee Gan , Hk Looi , David Gani
发明人： Anandan Ramasamy , KahWee Gan , Hk Looi , David Gani
IPC分类号： H01L33/48
CPC分类号： H01L25/167 , H01L23/5389 , H01L24/19 , H01L27/14618 , H01L27/14632 , H01L27/14683 , H01L2924/12042 , H01L2924/181 , H01L2924/00
摘要： A method of forming an embedded wafer level optical package includes attaching a sensor die, PCB bars and an LED on adhesive tape laminated on a carrier, attaching a dam between two light sensitive sensors of the sensor die, encapsulating the sensor die, the PCB bars, the LED, and the dam in an encapsulation layer, debonding the carrier, grinding a top surface of the encapsulation layer, forming vias through the encapsulation layer to the sensor die and the LED, filling the vias with conductive material, metalizing the top surface of the encapsulation layer, dielectric coating of the top surface of the encapsulation layer, dielectric coating of a bottom surface of the encapsulation layer, patterning the dielectric coating of the bottom surface of the encapsulation layer, and plating the patterned dielectric coating of the bottom surface of the encapsulation layer.
摘要翻译：一种形成嵌入式晶片级光学封装的方法包括将传感器芯片，PCB条和LED粘贴在层压在载体上的粘合带上，将传感器管芯的两个感光传感器之间的坝连接，封装传感器管芯，PCB条，LED和封装层中的坝，使载体脱粘，研磨封装层的顶表面，通过封装层形成通孔到传感器裸片和LED，用导电材料填充通孔，使顶表面金属化封装层的顶表面的电介质涂层，封装层的底表面的电介质涂层，图案化封装层底表面的电介质涂层，以及镀覆底表面的图案化电介质涂层的封装层。

3. 发明申请

US20130170164A1 ADHESIVE DAM 有权
标题翻译：粘合丹
公开(公告)号：US20130170164A1
公开(公告)日：2013-07-04
申请号：US13340345
申请日：2011-12-29
申请人： Jing-En Luan , Hk Looi
发明人： Jing-En Luan , Hk Looi
IPC分类号： H05K7/06 , H05K3/30 , H05K1/16
CPC分类号： H05K3/305 , H05K3/321 , H05K3/3421 , H05K2201/09781 , H05K2201/09909 , Y02P70/613 , Y10T29/4913
摘要： On a circuit substrate on which an adhesive is used to couple electronic or structural components to the substrate, an adhesive dam is positioned to prevent the adhesive from interfering with the operation of the circuit. A contact pad can be provided at a selected location and with a selected shape, and solder deposited on the pad, then reflowed to form the dam. The dam can be a structure soldered to a contact pad, or the dam can be supported at its ends by another structure of the device, so that, at the location where it functions to contain the adhesive, it is not attached to the substrate.
摘要翻译：在其上使用粘合剂将电子或结构部件耦合到基板的电路基板上，设置粘合剂阻挡层以防止粘合剂干扰电路的操作。可以在选定的位置提供接触垫并具有选定的形状，并将焊料沉积在垫上，然后回流以形成坝。大坝可以是焊接到接触垫的结构，或者可以通过设备的另一种结构在其端部处支撑坝，使得在其用于容纳粘合剂的位置处，该坝不附着到基底。

4. 发明授权

US09025339B2 Adhesive dam 有权
标题翻译：胶水坝
公开(公告)号：US09025339B2
公开(公告)日：2015-05-05
申请号：US13340345
申请日：2011-12-29
申请人： Jing-En Luan , Hk Looi
发明人： Jing-En Luan , Hk Looi
IPC分类号： H05K7/06 , H05K3/30 , H05K3/32 , H05K3/34
CPC分类号： H05K3/305 , H05K3/321 , H05K3/3421 , H05K2201/09781 , H05K2201/09909 , Y02P70/613 , Y10T29/4913
摘要： On a circuit substrate on which an adhesive is used to couple electronic or structural components to the substrate, an adhesive dam is positioned to prevent the adhesive from interfering with the operation of the circuit. A contact pad can be provided at a selected location and with a selected shape, and solder deposited on the pad, then reflowed to form the dam. The dam can be a structure soldered to a contact pad, or the dam can be supported at its ends by another structure of the device, so that, at the location where it functions to contain the adhesive, it is not attached to the substrate.
摘要翻译：在其上使用粘合剂将电子或结构部件耦合到基板的电路基板上，设置粘合剂阻挡层以防止粘合剂干扰电路的操作。可以在选定的位置提供接触垫并具有选定的形状，并将焊料沉积在垫上，然后回流以形成坝。大坝可以是焊接到接触垫的结构，或者可以通过设备的另一种结构在其端部处支撑坝，使得在其用于容纳粘合剂的位置处，该坝不附着到基底。

5. 发明申请

US20120171372A1 AUTOMATIC SHUTTER FOR ADHESIVE DISPENSER 审中-公开
标题翻译：胶粘剂自动切纸机
公开(公告)号：US20120171372A1
公开(公告)日：2012-07-05
申请号：US12982755
申请日：2010-12-30
申请人： Hk Looi , Cheng-hai Cheh
发明人： Hk Looi , Cheng-hai Cheh
IPC分类号： B05D5/10 , B05C11/00 , B05C5/00
CPC分类号： B05B13/0431 , B05C5/0204 , B05C5/0225 , B05C5/0291 , B05C11/1039
摘要： In automated gluing systems for semiconductor device manufacture, an automatic shutter system is provided for use with an adhesive dispenser that is configured to deposit adhesive for joining elements during final assembly processes. A shutter is configured to interpose itself between a needle tip of the dispenser and a working surface, on which devices in process are positioned, while the dispenser is in a ready position and not actually delivering adhesive, and to withdraw from the interposed position as, or immediately before the needle tip descends to a dispensing position to deposit adhesive on a device. In this way, drops of adhesive that fall from the needle tip while in the ready position are captured by the shutter and prevented from falling onto a device in process in an unintended location of the device.
摘要翻译：在用于半导体器件制造的自动胶粘系统中，提供自动快门系统以与粘合剂分配器一起使用，其被配置为在最终组装过程期间沉积用于接合元件的粘合剂。快门被配置为将自身插入到分配器的针尖和工作表面之间，在该工作表面处于正在处理的装置中，而分配器处于就绪位置，而不是实际输送粘合剂，并且从插入位置退出，或者在针尖下降到分配位置之前，以将粘合剂沉积在装置上。以这种方式，在就绪位置从针尖落下的粘合剂滴被快门捕获并防止在设备的非预期位置中落在正在处理的设备上。

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