专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US07083477B1 Providing mechanical support for modular interconnect systems 失效
标题翻译：为模块化互连系统提供机械支持
公开(公告)号：US07083477B1
公开(公告)日：2006-08-01
申请号：US11193822
申请日：2005-07-29
申请人： William Louis Brodsky , Michael F. Scanlon , John G. Torok
发明人： William Louis Brodsky , Michael F. Scanlon , John G. Torok
IPC分类号： H01R9/22
CPC分类号： H01R12/52 , H01R12/727
摘要： A connector system includes a first connector assembly that is electrically connected to wiring on a first printed wiring board and a second connector assembly that is electrically connected to wiring on a second printed wiring board. Each connector assembly includes a number of connector modules that are joined together in a predetermined array such as a row. In one of the connector assemblies, the row also includes one or more actuation modules. The actuation module or modules are engaged by an actuator mechanism to force the connector assemblies into mating engagement or to draw them apart.
摘要翻译：连接器系统包括电连接到第一印刷线路板上的布线的第一连接器组件和与第二印刷线路板上的布线电连接的第二连接器组件。每个连接器组件包括多个连接器模块，其以诸如行的预定阵列连接在一起。在一个连接器组件中，该行还包括一个或多个致动模块。致动模块或模块通过致动器机构接合以迫使连接器组件配合接合或将它们分开。

2. 发明授权

US07987584B2 Article extraction / insertion tool and assembly 失效
标题翻译：文章提取/插入工具和装配
公开(公告)号：US07987584B2
公开(公告)日：2011-08-02
申请号：US12025099
申请日：2008-02-04
申请人： Kyle Steven Barna , William Louis Brodsky , John G. Torok
发明人： Kyle Steven Barna , William Louis Brodsky , John G. Torok
IPC分类号： B23P19/04 , B23P19/00 , H01R13/62
CPC分类号： H05K7/1415 , Y10T29/49822 , Y10T29/53257 , Y10T29/53261 , Y10T29/53283 , Y10T29/53861
摘要： A tool assembly for removing an article from, or inserting an article onto, a printed circuit board which includes a tool housing having a handle portion and an article receiving portion, a plate slidable within the housing, the plate having a handle portion at a first end adjacent to the handle portion of the housing and two receiving portions at a second end, and two lever arms within the housing, each lever arm having a first end pinned to the housing and a second end of each lever arm inserted into the receiving portion of the plate such that each of the lever arms pivots about the pinned first end upon movement of the plate. The tool further comprises a pair of flexible rods located in respective recessed channels on either side of the article receiving portion, with one end of the flexible rods affixed to a first end of each of the lever arms, each of the flexible rods having a free end for interacting with an article retention device. The tool assembly may also include a tool guide for aligning the tool with a desired portion of a printed circuit board.
摘要翻译：一种用于将物品从物品移出或将物品插入到印刷电路板上的工具组件，印刷电路板包括具有手柄部分和物品接收部分的工具壳体，可在壳体内滑动的板，该板在第一位置处具有手柄部分在壳体的手柄部分附近的端部和在第二端处的两个接收部分，以及壳体内的两个杠杆臂，每个杠杆臂具有钉住壳体的第一端和插入接收部分的每个杠杆臂的第二端使得每个杠杆臂在板的移动时围绕固定的第一端枢转。该工具还包括一对柔性杆，位于物品接收部分两侧的相应的凹槽中，柔性杆的一端固定在每个杠杆臂的第一端，每个柔性杆具有自由结束与物品保持装置的交互。工具组件还可以包括用于将工具与印刷电路板的期望部分对准的工具引导件。

3. 发明授权

US07168958B1 Wadded-wire LGA contact with parallel solid conductor 失效
标题翻译：焊丝LGA与平行固体导体接触
公开(公告)号：US07168958B1
公开(公告)日：2007-01-30
申请号：US11212007
申请日：2005-08-25
申请人： William Louis Brodsky , John G. Torok
发明人： William Louis Brodsky , John G. Torok
IPC分类号： H01R12/00
CPC分类号： H05K7/1061 , H01R12/714
摘要： A connector, for example an LGA connector to be used in coupling a circuit board to a chip or a multi-chip module, includes an insulating carrier with a through-holes corresponding to the connections to be made above and below the carrier, and contacts in the through-holes. The contacts include wadded-wire wads that protrude above and below the carrier to make contact with the chip or circuit board, but each also includes a solid conductive member that extends over a major portion of the length of the through-hole and is in electro-mechanical connection with the wadded-wire wad or wads in the hole at numerous points along the length of the through-hole. The solid conductive member includes barbs or projections that penetrate the wadded wire. The solid conductive members thus provide a low-resistance parallel path and can also hold the wadded-wire wad or wads in place. A method of making and system are also disclosed.
摘要翻译：连接器，例如用于将电路板耦合到芯片或多芯片模块的LGA连接器包括绝缘载体，其具有与要在载体上方和下方形成的连接相对应的通孔，以及触点在通孔中。触点包括突出在载体上方和下方的焊丝焊丝，以与芯片或电路板接触，但是每个还包括在通孔的长度的大部分上延伸并且处于电 - 在通孔的长度上的许多点处，与焊丝网或焊盘在孔中的机械连接。固体导电构件包括穿过填充线的倒钩或突起。因此，固体导电构件提供低电阻平行路径，并且也可以将填充线束或焊垫保持在适当位置。还公开了制造方法和系统。

4. 发明申请

US20090193641A1 Article Extraction / Insertion Tool and Assembly 失效
标题翻译：文章提取/插入工具和装配
公开(公告)号：US20090193641A1
公开(公告)日：2009-08-06
申请号：US12025099
申请日：2008-02-04
申请人： Kyle Steven Barna , William Louis Brodsky , John G. Torok
发明人： Kyle Steven Barna , William Louis Brodsky , John G. Torok
IPC分类号： B25B27/14 , H05K13/04 , B23P19/04
CPC分类号： H05K7/1415 , Y10T29/49822 , Y10T29/53257 , Y10T29/53261 , Y10T29/53283 , Y10T29/53861
摘要： A tool assembly for removing an article from, or inserting an article onto, a printed circuit board which includes a tool housing having a handle portion and an article receiving portion, a plate slidable within the housing, the plate having a handle portion at a first end adjacent to the handle portion of the housing and two receiving portions at a second end, and two lever arms within the housing, each lever arm having a first end pinned to the housing and a second end of each lever arm inserted into the receiving portion of the plate such that each of the lever arms pivots about the pinned first end upon movement of the plate. The tool further comprises a pair of flexible rods located in respective recessed channels on either side of the article receiving portion, with one end of the flexible rods affixed to a first end of each of the lever arms, each of the flexible rods having a free end for interacting with an article retention device. The tool assembly may also include a tool guide for aligning the tool with a desired portion of a printed circuit board.
摘要翻译：一种用于将物品从物品移出或将物品插入到印刷电路板上的工具组件，印刷电路板包括具有手柄部分和物品接收部分的工具壳体，可在壳体内滑动的板，该板在第一位置具有手柄部分在壳体的手柄部分附近的端部和在第二端处的两个接收部分，以及壳体内的两个杠杆臂，每个杠杆臂具有钉住壳体的第一端和插入接收部分的每个杠杆臂的第二端使得每个杠杆臂在板的移动时围绕固定的第一端枢转。该工具还包括一对柔性杆，位于物品接收部分两侧的相应的凹槽中，柔性杆的一端固定在每个杠杆臂的第一端，每个柔性杆具有自由结束与物品保持装置的交互。工具组件还可以包括用于将工具与印刷电路板的期望部分对准的工具引导件。

5. 发明授权

US08179693B2 Apparatus for electrically connecting two substrates using a land grid array connector provided with a frame structure having power distribution elements 失效
标题翻译：一种用于使用设置有具有配电元件的框架结构的平面栅格阵列连接器来电连接两个基板的装置
公开(公告)号：US08179693B2
公开(公告)日：2012-05-15
申请号：US11693824
申请日：2007-03-30
申请人： William Louis Brodsky , Mark Kenneth Hoffmeyer
发明人： William Louis Brodsky , Mark Kenneth Hoffmeyer
IPC分类号： H05K1/11 , H05K1/14
CPC分类号： H05K7/1069 , H01R12/52 , H01R12/7082 , H01R12/714 , Y10T29/49169
摘要： Apparatus for electrically connecting two substrates using a land grid array (LGA) connector provided with a frame structure having power distribution elements. In an embodiment, the frame structure includes a frame having one or more conductive layers sandwiched between non-conductive layers. The frame may, for example, be a printed wire board (PWB) having power planes that distribute power from a first substrate (e.g., a system PWB) and/or a power cable to a second substrate (e.g., an electronic module). The frame includes one or more apertures configured to receive an LGA interposer for electrically connecting the two substrates. Preferably, the frame includes four apertures arranged in quadrants that each receive an interposer, and at least one power plane extends between two quadrants and/or adjacent to a peripheral edge of one or more quadrants in the form of stacked and/or parallel bus bars each defining a power domain.
摘要翻译：一种用于使用具有配电元件的框架结构的焊盘格栅阵列（LGA）连接器来电连接两个基板的装置。在一个实施例中，框架结构包括具有夹在非导电层之间的一个或多个导电层的框架。框架可以例如是具有从第一基板（例如，系统PWB）和/或电力电缆分配功率到第二基板（例如，电子模块）的电力平面的印刷线路板（PWB）。该框架包括一个或多个孔，其构造成接收用于电连接两个基板的LGA插入器。优选地，框架包括布置在象限中的四个孔，每个孔分别接收插入件，并且至少一个电源平面在两个象限之间延伸和/或邻近一个或多个象限的周边边缘，堆叠和/或并行母线的形式每个定义一个电源域。

6. 发明授权

US07765693B2 Electrically connecting two substrates using a resilient wire bundle captured in an aperture of an interposer by a retention member 失效
标题翻译：使用由保持构件捕获在插入件的孔中的弹性线束电连接两个基板
公开(公告)号：US07765693B2
公开(公告)日：2010-08-03
申请号：US12183288
申请日：2008-07-31
申请人： William Louis Brodsky , John Lee Colbert , Roger Duane Hamilton , Amanda Elisa Ennis Mikhail , Mark David Plucinski
发明人： William Louis Brodsky , John Lee Colbert , Roger Duane Hamilton , Amanda Elisa Ennis Mikhail , Mark David Plucinski
IPC分类号： H01R43/00 , H05K13/00
CPC分类号： H01R13/2407 , H01R12/52 , Y10T29/49117 , Y10T29/49126 , Y10T29/4913 , Y10T29/49155 , Y10T29/49169 , Y10T29/49204 , Y10T29/49208
摘要： A method and apparatus for electrically connecting two substrates using resilient wire bundles captured in apertures of an interposer by a retention film. The interposer comprises an electrically non-conductive carrier having two surfaces and apertures extending from surface to surface. A resilient wire bundle is disposed in each aperture. An electrically non-conductive retention film is associated with one or both surfaces of the carrier and has an orifice overlying each aperture. The width of each orifice is smaller than that of the underlying aperture to thereby enhance retention of the resilient wire bundle within the aperture. Pin contacts of one or both of the substrates make electrical contact with the resilient wire bundles by extending through the orifices of the retention film and partially through the apertures. In one embodiment, the interposer is a land grid array (LGA) connector that connects an electronic module and a printed circuit board (PCB).
摘要翻译：一种使用通过保持膜捕获在插入件的孔中的弹性线束来电连接两个基板的方法和装置。插入器包括具有从表面到表面延伸的两个表面和孔的非导电载体。弹性线束设置在每个孔中。非导电保持膜与载体的一个或两个表面相关联并且具有覆盖每个孔的孔口。每个孔的宽度小于下面的孔的宽度，从而增强弹性线束在孔内的保持力。一个或两个基板的引脚触点通过延伸穿过保持膜的孔并部分地穿过孔而与弹性线束电接触。在一个实施例中，插入器是连接电子模块和印刷电路板（PCB）的平面栅格阵列（LGA）连接器。

7. 发明申请

US20090111292A1 Surface Mount Technology Pad Layout for Docking Connector Systems 审中-公开
标题翻译：用于对接连接器系统的表面贴装技术垫布局
公开(公告)号：US20090111292A1
公开(公告)日：2009-04-30
申请号：US11931220
申请日：2007-10-31
申请人： William Louis Brodsky , Mark Kenneth Hoffmeyer
发明人： William Louis Brodsky , Mark Kenneth Hoffmeyer
IPC分类号： H01R12/06
CPC分类号： H05K1/111 , H01R12/724 , H01R13/6471 , H01R13/648 , H05K1/0219 , H05K2201/09409 , H05K2201/10189 , Y02P70/611
摘要： A pad array for a surface mount technology board includes a front row ground pad as a single pad, followed by a signal pad. The ground pads internal to the array may be arranged as pairs of pads interconnected to each other, with sandwiching signal pads on the internal portion of the array. To minimize stress on connector wafers of large scale connectors, external rows of ground pads may be enlarged by a predetermined amount in a Y-direction to minimize potential formation of stress risers, while ensuring that electrical spacing requirements to adjacent signal leads may be preserved for optimal signal integrity.
摘要翻译：用于表面贴装技术板的焊盘阵列包括作为单个焊盘的前排接地焊盘，其后是信号焊盘。阵列内部的接地焊盘可以布置为彼此互连的焊盘对，并且在阵列的内部部分上夹有信号焊盘。为了最大限度地减小大尺寸连接器的连接器晶片上的应力，外部排的接地焊盘可以在Y方向上扩大预定量，以最小化应力梯级的潜在形成，同时确保可以保持对相邻信号引线的电气间隔要求，最佳信号完整性。

8. 发明申请

US20080026627A1 PIN GRID ARRAY ZERO INSERTION FORCE CONNECTORS CONFIGURABLE FOR SUPPORTING LARGE PIN COUNTS 有权
标题翻译： PIN网格阵列插入力连接器可配置为支持大量PIN码
公开(公告)号：US20080026627A1
公开(公告)日：2008-01-31
申请号：US11496153
申请日：2006-07-31
申请人： Gareth Geoffrey Hougham , William Louis Brodsky , Thomas M. Cipolla , Paul William Coteus , Ronald Malfatt
发明人： Gareth Geoffrey Hougham , William Louis Brodsky , Thomas M. Cipolla , Paul William Coteus , Ronald Malfatt
IPC分类号： H01R4/50
CPC分类号： H01R13/193 , H05K7/1007
摘要： A PGA socket including a plurality of sub-socket components, which when used in combination forms a larger effective socket, includes multiple apertures configured to receive corresponding pins of an IC. The PGA socket further includes multiple contact members, each of the contact members corresponding to a respective one of the apertures. The contact members are configured to movably engage corresponding pins of the IC upon respective movement of the apertures so as to provide electrical and mechanical contact thereto. Each of the sub-socket components is configured to mechanically engage at least one of the other sub-socket components such that the contact members in each of the sub-socket components are capable of electrically connecting to corresponding pins of the IC substantially simultaneously.
摘要翻译：包括多个子插座部件的PGA插座，当组合使用时形成较大的有效插座，包括配置成接收IC的相应引脚的多个孔。 PGA插座还包括多个接触构件，每个接触构件对应于相应的一个孔。接触构件被构造成在孔的相应移动时可移动地接合IC的相应销，以便提供与其的电和机械接触。每个子插座部件被构造成机械地接合其他子插座部件中的至少一个，使得每个子插座部件中的接触部件能够基本上同时电连接到IC的相应引脚。

9. 发明授权

US06974915B2 Printed wiring board interposer sub-assembly and method 失效
标题翻译：印刷电路板插件子组件及方法
公开(公告)号：US06974915B2
公开(公告)日：2005-12-13
申请号：US10979366
申请日：2004-11-01
申请人： William Louis Brodsky , Benson Chan , Michael Anthony Gaynes , Voya Rista Markovich
发明人： William Louis Brodsky , Benson Chan , Michael Anthony Gaynes , Voya Rista Markovich
IPC分类号： H05K3/32 , H05K1/16
CPC分类号： H01R12/523 , H05K3/325 , Y10T29/49117 , Y10T29/4913 , Y10T29/49144 , Y10T29/49165 , Y10T29/49213
摘要： The details of a printed wiring board (PWB) sub-assembly and the method of producing the same are described. The sub-assembly comprises a printed circuit board electrically joined through a plurality of connections to one or more area array devices, such as modules or printed wiring boards. The sub-assembly can serve as a part of an original assembly. The sub-assembly can function as an after market item that can be readily substituted as a replacement for a failed component wherein the dimensional space between the printed circuit board and one or both of the area array devices must provide sufficient clearance for surface mounted devices.
摘要翻译：描述印刷电路板（PWB）子组件的细节及其制造方法。子组件包括通过多个连接电连接到一个或多个区域阵列器件（例如模块或印刷线路板）的印刷电路板。子组件可以作为原始组件的一部分。子组件可以用作可以容易地替代为故障组件的后市场项目，其中印刷电路板与一个或两个区域阵列器件之间的尺寸空间必须为表面安装的器件提供足够的间隙。

10. 发明授权

US06695623B2 Enhanced electrical/mechanical connection for electronic devices 失效
标题翻译：电子设备增强的电气/机械连接
公开(公告)号：US06695623B2
公开(公告)日：2004-02-24
申请号：US09871554
申请日：2001-05-31
申请人： William Louis Brodsky , David V. Caletka , Michael Anthony Gaynes , Voya Rista Markovich
发明人： William Louis Brodsky , David V. Caletka , Michael Anthony Gaynes , Voya Rista Markovich
IPC分类号： H01R1200
CPC分类号： H01R12/52 , H05K3/321 , H05K3/325 , H05K3/3436 , Y10T29/49147 , Y10T29/49149
摘要： A method and structure for electrically and mechanically interconnecting an array of printed circuit board contacts to an array of module contacts with a plurality of deformable resilient electrical conductors with two ends. Each of the conductor ends are electrically connected to one of the contact arrays. A portion of the conductor may deform longitudinally and laterally responsive to movement of the printed circuit board relative to the module responsive to heating and cooling cycles and mechanical vibrations, while maintaining the electrical connection of the contact arrays. An interposer with apertures extending through the interposer carries the conductors in the apertures and is used to align the conductors with the contacts. A method for excluding a rigid adhesive means from a portion of the resilient conductor is also taught.
摘要翻译：用于将印刷电路板触点阵列电气和机械地互连到具有两端的多个可变形的弹性电导体的模块触点阵列的方法和结构。每个导体端电连接到一个接触阵列。导体的一部分可以响应于加热和冷却循环和机械振动而响应于印刷电路板相对于模块的移动而纵向和横向地变形，同时保持接触阵列的电连接。具有延伸穿过插入器的孔的插入器承载孔中的导体并且用于将导体与触点对准。还教导了从弹性导体的一部分排除刚性粘合剂装置的方法。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式