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1. 发明授权

US06818466B2 Method of fabricating an integrated optoelectronic circuit 有权
标题翻译：制造集成光电子电路的方法
公开(公告)号：US06818466B2
公开(公告)日：2004-11-16
申请号：US10728148
申请日：2003-12-04
申请人： William Kornrumpf , Glenn Claydon , Samhita Dasgupta , Robert Filkins , Glenn Forman , Joseph Iannotti , Matthew Christian Nielsen
发明人： William Kornrumpf , Glenn Claydon , Samhita Dasgupta , Robert Filkins , Glenn Forman , Joseph Iannotti , Matthew Christian Nielsen
IPC分类号： H01L2100
CPC分类号： G02F1/065 , G02F1/0121 , G02F1/225
摘要： A method of fabricating an integrated optoelectronic circuit. The method includes positioning a microchip on a first flexible dielectric substrate. A polymer electro-optic waveguide is positioned on or within the first flexible dielectric substrate. A ground electrode is positioned along the electro-optic waveguide. A signal electrode is positioned along the electro-optic waveguide opposite the ground electrode. A first patterned metallization layer is applied to the first flexible dielectric substrate. A second flexible dielectric substrate is positioned along the first flexible dielectric substrate. A plurality of via openings are provided in the first and second flexible dielectric substrates. A second patterned metallization layer is applied to the second flexible dielectric substrate.
摘要翻译：一种制造集成光电子电路的方法。该方法包括将微芯片定位在第一柔性电介质基片上。聚合物电光波导位于第一柔性电介质基底上或内。接地电极沿着电光波导定位。信号电极沿着与接地电极相对的电光波导放置。将第一图案化金属化层施加到第一柔性电介质基板。第二柔性电介质基片沿着第一柔性电介质基片定位。多个通孔开口设置在第一和第二柔性电介质基片中。将第二图案化金属化层施加到第二柔性电介质基板。

2. 发明授权

US06711312B1 Integrated optoelectronic circuit and method of fabricating the same 有权
标题翻译：集成光电子电路及其制造方法
公开(公告)号：US06711312B1
公开(公告)日：2004-03-23
申请号：US10248148
申请日：2002-12-20
申请人： William Kornrumpf , Glenn Claydon , Samhita Dasgupta , Robert Filkins , Glenn Forman , Joseph Iannotti , Matthew Christian Nielsen
发明人： William Kornrumpf , Glenn Claydon , Samhita Dasgupta , Robert Filkins , Glenn Forman , Joseph Iannotti , Matthew Christian Nielsen
IPC分类号： G02B612
CPC分类号： G02F1/065 , G02F1/0121 , G02F1/225
摘要： The invention comprises a novel combination of microwave and photonic packaging to arrive a compact, self contained MZI modulator. The nature of the NLO polymer, that is, its large electro-optic coefficient reduces the drive requirements for the integrated power amplifier, allowing a small to medium power amplifier to be used. Microwave high density interconnect (HDI) packaging techniques allow the medium power amplifier to be fabricated into a small assembly, which can be mounted directly to the MZI substrate. The integrated amplifier and modulator provides a significant reduced size and lower power, and high bandwidth advantage when compared with existing devices based on inorganic materials.
摘要翻译：本发明包括微波和光子包装的新颖组合，以获得紧凑的，独立的MZI调制器。 NLO聚合物的性质，即其大的电光系数降低了集成功率放大器的驱动要求，允许使用中小功率放大器。微波高密度互连（HDI）封装技术允许将中等功率放大器制造成小型组件，其可以直接安装到MZI衬底。与基于无机材料的现有器件相比，集成放大器和调制器提供了显着的减小的尺寸和较低的功率，并且具有高带宽优势。

3. 发明申请

US20060089546A1 Measurement and treatment system and method 失效
标题翻译：测量和处理系统及方法
公开(公告)号：US20060089546A1
公开(公告)日：2006-04-27
申请号：US10973598
申请日：2004-10-27
申请人： Michael Mahony , John Hershey , Glenn Forman , Harold Tomlinson , William Powell
发明人： Michael Mahony , John Hershey , Glenn Forman , Harold Tomlinson , William Powell
IPC分类号： A61B5/00 , A61G11/00
CPC分类号： A61B5/14552 , A61B5/0064 , A61B5/11 , A61B5/1464 , A61B2562/0233 , A61B2562/046 , A61N5/0601 , A61N5/062 , A61N5/0621
摘要： A non-intrusive physiological data measurement system and method, as well as an optically induced treatment system, are described. The measurement system includes a monitoring mechanism that includes light emitter modules capable of emitting light at at least two wavelengths. The light emitted from the light emitter modules is transmitted through a subject and to a light receiving mechanism, such as an optical sensor. Physiological data is taken from the received light. The system also can ascertain movement of the subject by obtaining an initial outline of the subject and comparing that outline with a subsequently obtained outline. A therapeutic optic system includes a non-adhering light emitting mechanism for providing light at therapeutic wavelengths.
摘要翻译：描述了非侵入式生理数据测量系统和方法以及光诱导治疗系统。测量系统包括监测机构，其包括能够发射至少两个波长的光的光发射器模块。从光发射器模块发出的光通过被摄体传送到诸如光学传感器的光接收机构。生理数据取自收到的光线。该系统还可以通过获得对象的初始轮廓并将该轮廓与随后获得的轮廓进行比较来确定被摄体的运动。治疗光学系统包括用于提供治疗波长的光的非粘附发光机构。

4. 发明授权

US06912183B2 High-speed optical read/write pick-up mechanisms and associated methods 有权
标题翻译：高速光读/写拾取机制及相关方法
公开(公告)号：US06912183B2
公开(公告)日：2005-06-28
申请号：US10368170
申请日：2003-02-18
申请人： Kelvin Ma , Glenn Forman , Jeannine Jones
发明人： Kelvin Ma , Glenn Forman , Jeannine Jones
IPC分类号： G11B7/085 , G11B7/135 , G11B7/00
CPC分类号： G11B7/1362 , G11B7/08576 , G11B7/1384
摘要： High-speed pick-up mechanisms operable for reading data from and/or writing data to an optical storage medium are disclosed. These mechanisms comprise a pivotable structure, a reflective element, a light source, a light receiving device, and an actuation device. The light source and the light receiving device are remotely located from the reflective element via the pivotable structure, and only the reflective element and a portion of the pivotable structure are positioned adjacent the surface of an optical storage medium. High-speed optical read/write devices and systems comprising these high-speed pick-up mechanisms are also disclosed. Additionally, high-speed methods for reading data from and/or writing data to an optical storage medium are disclosed.
摘要翻译：公开了用于从光学存储介质读取和/或写入数据的高速拾取机构。这些机构包括可枢转结构，反射元件，光源，光接收装置和致动装置。光源和光接收装置通过可枢转结构远离反射元件，只有反射元件和可枢转结构的一部分位于光存储介质的表面附近。还公开了包括这些高速拾取机构的高速光学读/写装置和系统。另外，公开了从光存储介质读取数据和/或将数据写入光存储介质的高速方法。

5. 发明授权

US08536700B2 Stackable electronic package and method of fabricating same 有权
公开(公告)号：US08536700B2
公开(公告)日：2013-09-17
申请号：US13101249
申请日：2011-05-05
申请人： James Sabatini , Christopher James Kapusta , Glenn Forman
发明人： James Sabatini , Christopher James Kapusta , Glenn Forman
IPC分类号： H01L23/58
CPC分类号： H01L25/50 , H01L23/5385 , H01L23/5389 , H01L24/19 , H01L24/82 , H01L25/0657 , H01L25/16 , H01L2224/04105 , H01L2224/24137 , H01L2224/73267 , H01L2224/82039 , H01L2224/92144 , H01L2225/0652 , H01L2225/06524 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/15192 , H01L2924/15311 , H01L2924/15331 , H01L2924/18162 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/00
摘要： An electronic package includes a first layer having a first surface, the first layer includes a first device having a first electrical node, and a first contact pad in electrical communication with the first electrical node and positioned within the first surface. The package includes a second layer having a second surface and a third surface, the second layer includes a first conductor positioned within the second surface and a second contact pad positioned within the third surface and in electrical communication with the first conductor. A first anisotropic conducting paste (ACP) is positioned between the first contact pad and the first conductor to electrically connect the first contact pad to the first conductor such that an electrical signal may pass therebetween.

6. 发明申请

US20100244226A1 STACKABLE ELECTRONIC PACKAGE AND METHOD OF FABRICATING SAME 有权
标题翻译：可堆叠电子封装及其制造方法
公开(公告)号：US20100244226A1
公开(公告)日：2010-09-30
申请号：US12463090
申请日：2009-05-08
申请人： James Sabatini , Christopher James Kapusta , Glenn Forman
发明人： James Sabatini , Christopher James Kapusta , Glenn Forman
IPC分类号： H01L23/498 , H01L21/98
CPC分类号： H01L25/50 , H01L23/5385 , H01L23/5389 , H01L24/19 , H01L24/82 , H01L25/0657 , H01L25/16 , H01L2224/04105 , H01L2224/24137 , H01L2224/73267 , H01L2224/82039 , H01L2224/92144 , H01L2225/0652 , H01L2225/06524 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/15192 , H01L2924/15311 , H01L2924/15331 , H01L2924/18162 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/00
摘要： An electronic package includes a first layer having a first surface, the first layer includes a first device having a first electrical node, and a first contact pad in electrical communication with the first electrical node and positioned within the first surface. The package includes a second layer having a second surface and a third surface, the second layer includes a first conductor positioned within the second surface and a second contact pad positioned within the third surface and in electrical communication with the first conductor. A first anisotropic conducting paste (ACP) is positioned between the first contact pad and the first conductor to electrically connect the first contact pad to the first conductor such that an electrical signal may pass therebetween.
摘要翻译：电子封装包括具有第一表面的第一层，第一层包括具有第一电节点的第一器件和与第一电节点电连通且位于第一表面内的第一接触焊盘。封装包括具有第二表面和第三表面的第二层，第二层包括位于第二表面内的第一导体和位于第三表面内且与第一导体电连通的第二接触垫。第一各向异性导电膏（ACP）位于第一接触焊盘和第一导体之间，以将第一接触焊盘电连接到第一导体，使得电信号可以在其间通过。

7. 发明申请

US20080057623A1 Thin embedded active IC circuit integration techniques for flexible and rigid circuits 失效
标题翻译：薄型嵌入式有源IC电路集成技术，用于柔性和刚性电路
公开(公告)号：US20080057623A1
公开(公告)日：2008-03-06
申请号：US11981017
申请日：2007-10-31
申请人： Glenn Forman , Kelvin Ma
发明人： Glenn Forman , Kelvin Ma
IPC分类号： H01L21/58
CPC分类号： H01L23/5389 , H01L21/6835 , H01L23/48 , H01L23/5387 , H01L23/552 , H01L23/66 , H01L24/24 , H01L24/82 , H01L2221/6834 , H01L2221/68363 , H01L2224/24137 , H01L2224/24226 , H01L2924/01029 , H01L2924/01033 , H01L2924/014 , H01L2924/14 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/3025 , H05K1/185 , H05K1/189 , H05K3/4614 , H05K3/4617
摘要： A flexible electronic circuit member formed of a plurality of dielectric layers includes a plurality of thinned semiconductor chips embedded within the circuit member for increased levels of integration and component density. The thinned semiconductor chips may include various integrated circuits thereon. They may be formed on various substrates and using various technologies and the embedded, thinned semiconductor chips are interconnected by a patterned interconnect that extends between and through the respective dielectric layers. A method for forming the flexible circuit member includes joining semiconductor chips to a mounting apparatus using a releasable bonding layer then forming thinned semiconductor chips that are joined to respective dielectric layers that combine to form the flexible electronic circuit member. The releasable bonding layer is removed after the thinned semiconductor chips are joined to the respective dielectric layers used in combination to form the electronic circuit member.
摘要翻译：由多个电介质层形成的柔性电子电路部件包括嵌入电路部件内的多个变薄的半导体芯片，用于提高集成度和部件密度。减薄的半导体芯片可以包括其上的各种集成电路。它们可以形成在各种基板上并使用各种技术，并且嵌入的，变薄的半导体芯片通过在相应的电介质层之间延伸并穿过各个电介质层的图案化互连而互连。形成柔性电路部件的方法包括：使用可剥离接合层将半导体芯片接合到安装装置，然后形成连接到组合形成柔性电子电路部件的各个电介质层的变薄的半导体芯片。在将薄化的半导体芯片组合到组合使用的各个电介质层之后，去除可剥离接合层，以形成电子电路部件。

8. 发明授权

US06956796B2 High-capacity optical read/write pick-up mechanism and associated methods 失效
标题翻译：大容量光读写机构及相关方法
公开(公告)号：US06956796B2
公开(公告)日：2005-10-18
申请号：US10368162
申请日：2003-02-18
申请人： Kelvin Ma , Glenn Forman
发明人： Kelvin Ma , Glenn Forman
IPC分类号： G11B7/085 , G11B7/135 , G11B7/00
CPC分类号： G11B7/1362 , G11B7/08576 , G11B7/1353 , G11B7/1356 , G11B7/1365
摘要： High-capacity pick-up mechanisms operable for selectively reading data from and/or writing data to one or more surfaces of one or more optical storage media are disclosed. These mechanisms comprise a first pivotable structure, a second pivotable structure, a first reflective element, a second reflective element, a light source, and a light receiving device. The light source and the light receiving device are remotely located from the reflective elements via the pivotable structures, and only the reflective elements and a portion of the pivotable structure are positioned adjacent the surface of an optical storage medium. High-capacity optical read/write devices and systems comprising these high-capacity pick-up mechanisms are also disclosed.
摘要翻译：公开了用于从一个或多个光学存储介质的一个或多个表面选择性地读取数据和/或向其写入数据的大容量拾取机构。这些机构包括第一可枢转结构，第二可枢转结构，第一反射元件，第二反射元件，光源和光接收装置。光源和光接收装置通过可枢转结构远离反射元件，只有反射元件和可枢转结构的一部分位于光存储介质的表面附近。还公开了包括这些高容量拾取机构的大容量光学读/写装置和系统。

9. 发明申请

US20120171816A1 INTEGRATED CIRCUIT PACKAGE AND METHOD OF MAKING SAME 审中-公开
标题翻译：集成电路封装及其制造方法
公开(公告)号：US20120171816A1
公开(公告)日：2012-07-05
申请号：US13327333
申请日：2011-12-15
申请人： Christopher James Kapusta , Glenn Forman , James Sabatini
发明人： Christopher James Kapusta , Glenn Forman , James Sabatini
IPC分类号： H01L21/56
CPC分类号： H01L24/20 , H01L21/568 , H01L21/6835 , H01L23/3121 , H01L23/5389 , H01L24/19 , H01L25/0655 , H01L2221/68359 , H01L2224/04105 , H01L2224/20 , H01L2224/92144 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01075 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/1433 , H01L2924/15174 , H01L2924/15311 , H01L2924/18162
摘要： An integrated circuit package includes a first dielectric layer comprising a dielectric film having a first side and a second side, the first side having a plurality of contact locations and a plurality of non-contact locations. The package includes a plurality of components, each component having a first surface and a second surface, wherein the first surface of each of the plurality of components is affixed to a corresponding one of the plurality of contact locations of the dielectric film absent a layer of adhesive therebetween that is distinct from a material of the dielectric film.
摘要翻译：集成电路封装包括第一介电层，其包括具有第一侧和第二侧的电介质膜，第一侧具有多个接触位置和多个非接触位置。所述封装包括多个部件，每个部件具有第一表面和第二表面，其中所述多个部件中的每一个的所述第一表面固定到所述电介质膜的所述多个接触位置中的对应的一个，它们之间的粘合剂与电介质膜的材料不同。

10. 发明授权

US08026608B2 Stackable electronic package 有权
标题翻译：可堆叠电子封装
公开(公告)号：US08026608B2
公开(公告)日：2011-09-27
申请号：US12410237
申请日：2009-03-24
申请人： James Sabatini , Christopher James Kapusta , Glenn Forman
发明人： James Sabatini , Christopher James Kapusta , Glenn Forman
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H01L25/50 , H01L23/5385 , H01L23/5389 , H01L24/19 , H01L24/82 , H01L25/0657 , H01L25/16 , H01L2224/04105 , H01L2224/24137 , H01L2224/73267 , H01L2224/82039 , H01L2224/92144 , H01L2225/0652 , H01L2225/06524 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/15192 , H01L2924/15311 , H01L2924/15331 , H01L2924/18162 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/00
摘要： An electronic package includes a first layer having a first surface, the first layer includes a first device having a first electrical node, and a first contact pad in electrical communication with the first electrical node and positioned within the first surface. The package includes a second layer having a second surface and a third surface, the second layer includes a first conductor positioned within the second surface and a second contact pad positioned within the third surface and in electrical communication with the first conductor. A first anisotropic conducting paste (ACP) is positioned between the first contact pad and the first conductor to electrically connect the first contact pad to the first conductor such that an electrical signal may pass therebetween.
摘要翻译：电子封装包括具有第一表面的第一层，第一层包括具有第一电节点的第一器件和与第一电节点电连通且位于第一表面内的第一接触焊盘。封装包括具有第二表面和第三表面的第二层，第二层包括位于第二表面内的第一导体和位于第三表面内且与第一导体电连通的第二接触垫。第一各向异性导电膏（ACP）位于第一接触焊盘和第一导体之间，以将第一接触焊盘电连接到第一导体，使得电信号可以在其间通过。

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