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    • 1. 发明授权
    • Simplified fabrication methods for rim phase-shift masks
    • 轮缘相移掩模的简化制造方法
    • US5532089A
    • 1996-07-02
    • US173383
    • 1993-12-23
    • William J. AdairTimothy A. BrunnerDerek B. DoveLouis L. HsuChi-Min Yuan
    • William J. AdairTimothy A. BrunnerDerek B. DoveLouis L. HsuChi-Min Yuan
    • G03F1/29H01L21/027G03F9/00
    • G03F1/29Y10T428/24322
    • A simplified method of forming a phase shift structure for a lithographic mask includes the conformal deposition of a phase shift material, preferably having an index of refraction similar to that of the mask substrate, over a patterned layer of opaque material and exposed areas of the mask substrate corresponding to the pattern. The thickness of the opaque patterned layer, in combination with the conformal deposition preferably establishes a differentially altered optical path length to produce a phase shift which enhances contrast and increases illumination and resolution in fine patterns. In variant forms of the invention, the conformal deposition of either phase shift material or a sidewall spacer material is followed by an anisotropic removal of material to form the phase shift structure. The application of phase shift material over the mask surface increases durability of the mask and also enhances contrast of images produced with other phase-shift mask feature structures, such as Levenson-type shifters.
    • 形成用于光刻掩模的相移结构的简化方法包括在不透明材料的图案化层和掩模的暴露区域上的相移材料的共形沉积,优选地具有类似于掩模衬底的折射率的相移材料 衬底对应于图案。 不透明图案层的厚度与保形沉积结合优选地建立差异改变的光路长度以产生增强对比度并增加精细图案中的照明和分辨率的相移。 在本发明的变体形式中,相移材料或侧壁间隔物材料的共形沉积之后是材料的各向异性去除以形成相移结构。 在掩模表面上施加相移材料增加了掩模的耐久性,并且还增强了与其他相移掩模特征结构(例如莱文森型移位器)产生的图像的对比度。
    • 2. 发明授权
    • Mask with attenuating phase-shift and opaque regions
    • 具有衰减相移和不透明区域的掩模
    • US06207333B1
    • 2001-03-27
    • US09363862
    • 1999-07-29
    • William J. AdairJames J. ColelliErik A. PuttlitzTimothy J. TothArthur C. Winslow
    • William J. AdairJames J. ColelliErik A. PuttlitzTimothy J. TothArthur C. Winslow
    • G03F900
    • G03F1/32
    • A method of fabricating an attenuating phase shift photolithographic mask which will reduce the formation of side-lobes adjacent to large structures in the kerf regions on the patterned wafer. These structures are typically much larger in size than device nominal, and this method may be applied to either one axis or both axes of the kerf structure depending on it's susceptibility to form side-lobes. A substantially defect free optical lithography mask having partially transmissive attenuating phase-shift regions, transmissive clear regions, and more opaque than partially transmissive regions is fabricated by first depositing an attenuating phase-shifting layer on the top surface of a transmissive substrate followed by deposition of a more opaque than partially transmissive layer on top of the partially transmissive attenuating phase-shifting layer. Next an image transfer layer is deposited on top of the more opaque than partially transmissive layer. A first photolithographic step is performed in order to pattern the image transfer layer. The image transfer layer may then be inspected and repaired. The pattern in the image transfer layer is then transferred to both the more opaque than partially transmissive layer and partially transmissive attenuating phase-shift layer. Next a second photolithographic step is performed in order to remove the more opaque than partially transmissive layer from over the partially transmissive attenuating phase-shift layer in certain regions of the mask. The fabrication process may include the further steps of depositing a second image transfer layer before performing the second photolithographic step, and performing a second inspection and repair after the second photolithographic step. The image transfer layer(s) are then removed.
    • 一种制造衰减相移光刻掩模的方法,其将减少在图案化晶片上的切口区域中与大结构相邻的旁瓣的形成。 这些结构的尺寸通常比设备标称的大得多,并且该方法可以应用于切口结构的一个轴或两个轴,这取决于其形成旁瓣的敏感性。基本上无缺陷的光刻掩模具有部分透射衰减 通过首先在透射基板的顶表面上沉积衰减的移相层,然后在部分透射区的顶部沉积更不透明的部分透射层来制造相移区域,透射透明区域和比部分透射区域更不透明的区域 部分透射衰减相移层。 接下来,图像转印层沉积在比不透明层更不透明的层之上。 执行第一光刻步骤以对图像转印层进行图案化。 然后可以检查和修理图像转印层。 然后将图像转印层中的图案转移到比不透射的层和部分透射的衰减相移层更不透明。 接下来,执行第二光刻步骤,以便在掩模的某些区域中从部分透射的衰减相移层上去除比部分透射层更不透明的层。 制造工艺可以包括在执行第二光刻步骤之前沉积第二图像转印层的步骤,以及在第二光刻步骤之后进行第二次检查和修复。 然后去除图像转印层。
    • 5. 发明授权
    • Lithographic mask repair and fabrication method
    • 平版印刷修复和制作方法
    • US5506080A
    • 1996-04-09
    • US376570
    • 1995-01-23
    • William J. AdairDavid S. O'GradyWillam C. JoyceJames J. LynchJean T. Ohlson
    • William J. AdairDavid S. O'GradyWillam C. JoyceJames J. LynchJean T. Ohlson
    • G03F1/72G03F9/00
    • G03F1/72
    • A method of forming a substantially defect-free mask for optical and phase-shift lithography. The method involves depositing a transfer layer on a mask layer deposited on a transmissive substrate, forming in the transfer layer a mask image to be defined in the mask layer, inspecting the image formed in the transfer layer, repairing the image formed in the transfer image, and transferring the corrected image from the transfer layer into the mask layer. The repair of the transfer layer is accomplished by removing unwanted portions of the transfer layer followed by filling any unwanted voids therein with a selected material. Preferably, the fill material has the same desirable etching and/or optical characteristics as the surrounding transfer layer. However, any material that is substantially opaque to the radiation used to transfer the image from the transfer layer to the mask layer can be successfully employed.
    • 形成用于光学和相移光刻的基本无缺陷掩模的方法。 该方法包括在沉积在透射基板上的掩模层上沉积转移层,在转印层中形成要在掩模层中限定的掩模图像,检查在转印层中形成的图像,修复转印图像中形成的图像 并将修正后的图像从转印层转印到掩模层中。 转移层的修复通过去除转移层的不需要的部分,然后用所选择的材料填充其中的任何不需要的空隙来实现。 优选地,填充材料具有与周围转移层相同的期望的蚀刻和/或光学特性。 然而,可以成功地使用对于用于将图像从转印层转印到掩模层的辐射基本上不透明的任何材料。