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1. 发明申请

US20150056900A1 POLISHING PAD WITH HOMOGENEOUS BODY HAVING DISCRETE PROTRUSIONS THEREON 有权
标题翻译：具有同位素分布的均质体的抛光垫
公开(公告)号：US20150056900A1
公开(公告)日：2015-02-26
申请号：US14530534
申请日：2014-10-31
申请人： Rajeev Bajaj , Ping Huang , Robert Kerprich , William C. Allison , Richard Frentzel , Diane Scott
发明人： Rajeev Bajaj , Ping Huang , Robert Kerprich , William C. Allison , Richard Frentzel , Diane Scott
IPC分类号： B24B37/26 , B29C39/12 , B24B37/24 , B24D18/00 , B24B37/20 , B24B37/22
CPC分类号： B24B37/26 , B24B37/205 , B24B37/22 , B24B37/24 , B24D18/0009 , B29C39/123 , B29K2075/00 , B29L2009/00 , B29L2031/736
摘要： Polishing pads with homogeneous bodies having discrete protrusions thereon are described. In an example, a polishing pad for polishing a substrate includes a homogeneous body having a polishing side and a back side. The homogeneous body is composed of a material having a first hardness. A plurality of discrete protrusions is disposed on and covalently bonded with the polishing side of the homogeneous body. The plurality of discrete protrusions is composed of a material having a second hardness different from the first hardness. Methods of fabricating polishing pads with homogeneous bodies having discrete protrusions thereon are also described.
摘要翻译：描述具有其上具有离散突起的均匀体的抛光垫。在一个实例中，用于抛光衬底的抛光垫包括具有抛光侧和背面的均匀体。均质体由具有第一硬度的材料构成。多个分立的突起设置在同质体的抛光侧上并与之共同地结合。多个离散突起由具有与第一硬度不同的第二硬度的材料构成。还描述了制造具有其上具有离散突起的均匀体的抛光垫的方法。

2. 发明授权

US09296085B2 Polishing pad with homogeneous body having discrete protrusions thereon 有权
标题翻译：具有均匀体的抛光垫，其上具有离散的突起
公开(公告)号：US09296085B2
公开(公告)日：2016-03-29
申请号：US14530534
申请日：2014-10-31
申请人： Rajeev Bajaj , Ping Huang , Robert Kerprich , William C. Allison , Richard Frentzel , Diane Scott
发明人： Rajeev Bajaj , Ping Huang , Robert Kerprich , William C. Allison , Richard Frentzel , Diane Scott
IPC分类号： B24B37/26 , B24B37/20 , B24B37/22 , B24B37/24 , B24D18/00 , B29C39/12 , B29K75/00 , B29L9/00 , B29L31/00
CPC分类号： B24B37/26 , B24B37/205 , B24B37/22 , B24B37/24 , B24D18/0009 , B29C39/123 , B29K2075/00 , B29L2009/00 , B29L2031/736
摘要： Polishing pads with homogeneous bodies having discrete protrusions thereon are described. In an example, a polishing pad for polishing a substrate includes a homogeneous body having a polishing side and a back side. The homogeneous body is composed of a material having a first hardness. A plurality of discrete protrusions is disposed on and covalently bonded with the polishing side of the homogeneous body. The plurality of discrete protrusions is composed of a material having a second hardness different from the first hardness. Methods of fabricating polishing pads with homogeneous bodies having discrete protrusions thereon are also described.
摘要翻译：描述具有其上具有离散突起的均匀体的抛光垫。在一个实例中，用于抛光衬底的抛光垫包括具有抛光侧和背面的均匀体。均质体由具有第一硬度的材料构成。多个分立的突起设置在同质体的抛光侧上并与之共同地结合。多个离散突起由具有与第一硬度不同的第二硬度的材料构成。还描述了制造具有其上具有离散突起的均匀体的抛光垫的方法。

3. 发明申请

US20150343595A1 SOFT POLISHING PAD FOR POLISHING A SEMICONDUCTOR SUBSTRATE 审中-公开
标题翻译：用于抛光半导体基板的软抛光垫
公开(公告)号：US20150343595A1
公开(公告)日：2015-12-03
申请号：US14823956
申请日：2015-08-11
申请人： William C. Allison , Diane Scott , Robert Kerprich , Ping Huang , Richard Frentzel
发明人： William C. Allison , Diane Scott , Robert Kerprich , Ping Huang , Richard Frentzel
IPC分类号： B24B37/24 , C08G18/32 , C08G18/76 , B24B37/26 , B24D11/00
CPC分类号： B24B37/24 , B24B37/205 , B24B37/26 , B24D11/003 , B32B3/30 , B32B5/142 , B32B5/18 , B32B7/06 , B32B7/12 , B32B25/045 , B32B25/08 , B32B27/065 , B32B27/08 , B32B27/308 , B32B27/36 , B32B2266/0278 , B32B2266/08 , B32B2307/40 , B32B2307/41 , B32B2307/412 , B32B2307/536 , B32B2307/72 , B32B2307/732 , B32B2457/00 , C08G18/3206 , C08G18/7621
摘要： Soft polishing pads for polishing semiconductor substrates are described. A soft polishing pad includes a molded homogeneous polishing body having a thermoset, closed cell polyurethane material with a hardness approximately in the range of 20 Shore D to 45 Shore D.
摘要翻译：描述了用于抛光半导体衬底的软抛光垫。软抛光垫包括具有大约在20肖氏D至45肖氏硬度范围内的硬度的热固性闭孔聚氨酯材料的模制均匀抛光体。

4. 发明申请

US20120302148A1 POLISHING PAD WITH HOMOGENEOUS BODY HAVING DISCRETE PROTRUSIONS THEREON 审中-公开
标题翻译：具有同位素分布的均质体的抛光垫
公开(公告)号：US20120302148A1
公开(公告)日：2012-11-29
申请号：US13113655
申请日：2011-05-23
申请人： Rajeev Bajaj , Ping Huang , Robert Kerprich , William C. Allison , Richard Frentzel , Diane Scott
发明人： Rajeev Bajaj , Ping Huang , Robert Kerprich , William C. Allison , Richard Frentzel , Diane Scott
IPC分类号： B24D11/00 , B29C44/12 , B29C39/12
CPC分类号： B24B37/26 , B24B37/205 , B24B37/22 , B24B37/24 , B24D18/0009 , B29C39/123 , B29K2075/00 , B29L2009/00 , B29L2031/736
摘要： Polishing pads with homogeneous bodies having discrete protrusions thereon are described. In an example, a polishing pad for polishing a substrate includes a homogeneous body having a polishing side and a back side. The homogeneous body is composed of a material having a first hardness. A plurality of discrete protrusions is disposed on and covalently bonded with the polishing side of the homogeneous body. The plurality of discrete protrusions is composed of a material having a second hardness different from the first hardness. Methods of fabricating polishing pads with homogeneous bodies having discrete protrusions thereon are also described.
摘要翻译：描述具有其上具有离散突起的均匀体的抛光垫。在一个实例中，用于抛光衬底的抛光垫包括具有抛光侧和背面的均匀体。均质体由具有第一硬度的材料构成。多个分立的突起设置在同质体的抛光侧上并与之共同地结合。多个离散突起由具有与第一硬度不同的第二硬度的材料构成。还描述了制造具有其上具有离散突起的均匀体的抛光垫的方法。

5. 发明申请

US20160221145A1 LOW DENSITY POLISHING PAD 审中-公开
标题翻译：低密度抛光垫
公开(公告)号：US20160221145A1
公开(公告)日：2016-08-04
申请号：US14611064
申请日：2015-01-30
申请人： Ping Huang , William C. Allison , Richard Frentzel , Paul Andre Lefevre , Robert Kerprich , Diane Scott
发明人： Ping Huang , William C. Allison , Richard Frentzel , Paul Andre Lefevre , Robert Kerprich , Diane Scott
IPC分类号： B24B37/24 , C08J9/00 , C08J9/228
CPC分类号： B24B37/24 , B24B37/205 , B24B37/26 , C08J9/0061 , C08J9/228 , C08J2333/00 , C08J2375/04 , C08J2433/00 , C08J2475/04
摘要： Low density polishing pads and methods of fabricating low density polishing pads are described. In an example, a polishing pad for polishing a substrate includes a polishing body having a density approximately in the range of 0.4-0.55 g/cc. The polishing body includes a thermoset polyurethane material and a plurality of closed cell pores dispersed in the thermoset polyurethane material. Each of the plurality of closed cell pores has a shell composed of an acrylic co-polymer.
摘要翻译：描述低密度抛光垫和制造低密度抛光垫的方法。在一个实例中，用于抛光衬底的抛光垫包括密度大约在0.4-0.55g / cc范围内的抛光体。抛光体包括热固性聚氨酯材料和分散在热固性聚氨酯材料中的多个闭孔。多个闭孔细孔中的每一个具有由丙烯酸共聚物构成的壳。

6. 发明申请

US20120009855A1 SOFT POLISHING PAD FOR POLISHING A SEMICONDUCTOR SUBSTRATE 有权
标题翻译：用于抛光半导体基板的软抛光垫
公开(公告)号：US20120009855A1
公开(公告)日：2012-01-12
申请号：US12832908
申请日：2010-07-08
申请人： William Allison , Diane Scott , Robert Kerprich , Ping Huang , Richard Frentzel
发明人： William Allison , Diane Scott , Robert Kerprich , Ping Huang , Richard Frentzel
IPC分类号： B24D11/00 , B24D3/32 , B24D13/14
CPC分类号： B24B37/24 , B24B37/205 , B24B37/26 , B24D11/003 , B32B3/30 , B32B5/142 , B32B5/18 , B32B7/06 , B32B7/12 , B32B25/045 , B32B25/08 , B32B27/065 , B32B27/08 , B32B27/308 , B32B27/36 , B32B2266/0278 , B32B2266/08 , B32B2307/40 , B32B2307/41 , B32B2307/412 , B32B2307/536 , B32B2307/72 , B32B2307/732 , B32B2457/00 , C08G18/3206 , C08G18/7621
摘要： Soft polishing pads for polishing semiconductor substrates are described. A soft polishing pad includes a molded homogeneous polishing body having a thermoset, closed cell polyurethane material with a hardness approximately in the range of 20 Shore D to 45 Shore D.
摘要翻译：描述了用于抛光半导体衬底的软抛光垫。软抛光垫包括具有大约在20肖氏D至45肖氏硬度范围内的硬度的热固性闭孔聚氨酯材料的模制均匀抛光体。

7. 发明申请

US20110171883A1 CMP pad with local area transparency 有权
标题翻译：具有局部透明度的CMP垫
公开(公告)号：US20110171883A1
公开(公告)日：2011-07-14
申请号：US12657135
申请日：2010-01-13
申请人： William Allison , Ping Huang , Diane Scott , Richard Frentzel , Robert Kerprich
发明人： William Allison , Ping Huang , Diane Scott , Richard Frentzel , Robert Kerprich
IPC分类号： B24D7/12 , B24B49/12 , B24D3/00 , B24D3/32 , B24D11/00
CPC分类号： B24B37/205
摘要： A CMP polishing pad comprising (a) a polishing layer having a polishing surface and a back surface opposite said polishing surface; said polishing layer having at least one cured opaque thermoset polyurethane region and at least one aperture region; said at least one cured opaque thermoset region has a porosity from about 10% to about 55% by volume; said at least one aperture region having (1) a top opening positioned below the polishing surface, (2) a bottom opening that is co-planar with said back surface and (3) straight line vertical sidewalls extending from said aperture top opening to said aperture bottom opening; said at least one aperture region filled with a cured plug of thermoset polyurethane local area transparency material that has a light transmission of less than 80% at a wavelength from 700 to 710 nanometers and is chemically bonded directly to a thermoset polyurethane opaque area; (b) an aperture-free removable release sheet covering at least a portion of said back surface of the polishing layer; and (c) an adhesive layer interposed between said polishing layer and said release sheet; said adhesive layer capable of adhering the polishing layer to a platen of a CMP apparatus after said release sheet has been removed.
摘要翻译：一种CMP抛光垫，包括（a）具有抛光表面和与所述抛光表面相对的后表面的抛光层; 所述抛光层具有至少一个固化的不透明热固性聚氨酯区域和至少一个开口区域; 所述至少一个固化的不透明热固性区域具有约10体积％至约55体积％的孔隙率; 所述至少一个开口区域具有（1）位于抛光表面下方的顶部开口，（2）与所述后表面共面的底部开口和（3）从所述开口顶部开口延伸到所述开口顶部开口的直线垂直侧壁孔底开口; 所述至少一个孔区填充有热固性聚氨酯局部透明材料的固化塞，其在700至710纳米的波长下具有小于80％的透光率，并且直接化学键合到热固性聚氨酯不透明区域; （b）覆盖所述抛光层的所述后表面的至少一部分的无孔可移除的剥离片; 和（c）介于所述抛光层和所述剥离片之间的粘合剂层; 所述粘合剂层能够在去除所述剥离片之后将抛光层粘附到CMP设备的压板上。

8. 发明授权

US09156124B2 Soft polishing pad for polishing a semiconductor substrate 有权
标题翻译：用于抛光半导体衬底的软抛光垫
公开(公告)号：US09156124B2
公开(公告)日：2015-10-13
申请号：US12832908
申请日：2010-07-08
申请人： William Allison , Diane Scott , Robert Kerprich , Ping Huang , Richard Frentzel
发明人： William Allison , Diane Scott , Robert Kerprich , Ping Huang , Richard Frentzel
IPC分类号： B24D11/00 , B24B37/20 , B32B7/06 , B32B27/06 , B32B27/36 , B32B3/30
CPC分类号： B24B37/24 , B24B37/205 , B24B37/26 , B24D11/003 , B32B3/30 , B32B5/142 , B32B5/18 , B32B7/06 , B32B7/12 , B32B25/045 , B32B25/08 , B32B27/065 , B32B27/08 , B32B27/308 , B32B27/36 , B32B2266/0278 , B32B2266/08 , B32B2307/40 , B32B2307/41 , B32B2307/412 , B32B2307/536 , B32B2307/72 , B32B2307/732 , B32B2457/00 , C08G18/3206 , C08G18/7621
摘要： Soft polishing pads for polishing semiconductor substrates are described. A soft polishing pad includes a molded homogeneous polishing body having a thermoset, closed cell polyurethane material with a hardness approximately in the range of 20 Shore D to 45 Shore D.
摘要翻译：描述了用于抛光半导体衬底的软抛光垫。软抛光垫包括具有大约在20肖氏D至45肖氏硬度范围内的硬度的热固性闭孔聚氨酯材料的模制均匀抛光体。

9. 发明授权

US09017140B2 CMP pad with local area transparency 有权
标题翻译：具有局部透明度的CMP垫
公开(公告)号：US09017140B2
公开(公告)日：2015-04-28
申请号：US12657135
申请日：2010-01-13
申请人： William Allison , Ping Huang , Diane Scott , Richard Frentzel , Robert Kerprich
发明人： William Allison , Ping Huang , Diane Scott , Richard Frentzel , Robert Kerprich
IPC分类号： B24B49/12 , B24B37/20
CPC分类号： B24B37/205
摘要： A CMP polishing pad comprising (a) a polishing layer having a polishing surface and a back surface opposite said polishing surface; said polishing layer having at least one cured opaque thermoset polyurethane region and at least one aperture region; said at least one cured opaque thermoset region has a porosity from about 10% to about 55% by volume; said at least one aperture region having (1) a top opening positioned below the polishing surface, (2) a bottom opening that is co-planar with said back surface and (3) straight line vertical sidewalls extending from said aperture top opening to said aperture bottom opening; said at least one aperture region filled with a cured plug of thermoset polyurethane local area transparency material that has a light transmission of less than 80% at a wavelength from 700 to 710 nanometers and is chemically bonded directly to a thermoset polyurethane opaque area; (b) an aperture-free removable release sheet covering at least a portion of said back surface of the polishing layer; and (c) an adhesive layer interposed between said polishing layer and said release sheet; said adhesive layer capable of adhering the polishing layer to a platen of a CMP apparatus after said release sheet has been removed.
摘要翻译：一种CMP抛光垫，包括（a）具有抛光表面和与所述抛光表面相对的后表面的抛光层; 所述抛光层具有至少一个固化的不透明热固性聚氨酯区域和至少一个开口区域; 所述至少一个固化的不透明热固性区域具有约10体积％至约55体积％的孔隙率; 所述至少一个开口区域具有（1）位于抛光表面下方的顶部开口，（2）与所述后表面共面的底部开口和（3）从所述开口顶部开口延伸到所述开口顶部开口的直线垂直侧壁孔底开口; 所述至少一个孔区填充有热固性聚氨酯局部透明材料的固化塞，其在700至710纳米的波长下具有小于80％的透光率，并且直接化学键合到热固性聚氨酯不透明区域; （b）覆盖所述抛光层的所述后表面的至少一部分的无孔可移除的剥离片; 和（c）介于所述抛光层和所述剥离片之间的粘合剂层; 所述粘合剂层能够在去除所述剥离片之后将抛光层粘附到CMP设备的压板上。

10. 发明授权

US08657653B2 Homogeneous polishing pad for eddy current end-point detection 有权
标题翻译：用于涡流端点检测的均匀抛光垫
公开(公告)号：US08657653B2
公开(公告)日：2014-02-25
申请号：US12895479
申请日：2010-09-30
申请人： William C. Allison , Diane Scott , Ping Huang , Richard Frentzel , Alexander William Simpson
发明人： William C. Allison , Diane Scott , Ping Huang , Richard Frentzel , Alexander William Simpson
IPC分类号： B24D11/00
CPC分类号： B24D11/003 , B24B37/013 , B24B37/205
摘要： Homogeneous polishing pads for polishing semiconductor substrates using eddy current end-point detection are described. Methods of fabricating homogeneous polishing pads for polishing semiconductor substrates using eddy current end-point detection are also described.
摘要翻译：描述了使用涡流端点检测来研磨半导体衬底的均匀抛光垫。还描述了使用涡流端点检测来制造用于抛光半导体衬底的均匀抛光垫的方法。

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