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    • 10. 发明授权
    • Phase-shift mask for printing high-resolution images and a method of fabrication
    • 用于打印高分辨率图像的相移掩模和制造方法
    • US06428938B1
    • 2002-08-06
    • US09596900
    • 2000-06-19
    • Chin-Hsiang LinShy-Jay LinSheng-Chi ChinWei-Zen Chou
    • Chin-Hsiang LinShy-Jay LinSheng-Chi ChinWei-Zen Chou
    • G03F900
    • G03F1/30
    • An improved phase-shift photomask and method of fabrication are described. The method for making this phase-shift mask involves depositing an opaque film, such as chromium (Cr), on a transparent plate, such as SiO2 (quartz plate). An electron beam photoresist layer is deposited on the Cr film and is partially exposed in regions A and completely exposed in closely spaced alternate regions B by an electron beam. The exposed photoresist is then developed. The Cr film is etched in regions B while the remaining resist in regions A protect the Cr from etching. The e-bean resist is plasma etched back to remove the resist over regions A and then the quartz plate in regions B is recessed to a depth d by plasma etching while the Cr protects the quartz in regions A from etching. The recess is etched to a depth to provide an optical path difference between A and B of ½ wavelength (180°) when UV light is transmitted through the mask to expose resist on a product substrate. This 180° phase-shift minimizes the diffracted light under the Cr film between regions A and B and improves the DOF and therefore the photoresist resolution. Since a single e-beam resist is used to make the mask it is more manufacturing cost effective with improved alignment accuracy between regions A and B.
    • 描述了改进的相移光掩模和制造方法。 制造该相移掩模的方法包括在诸如SiO 2(石英板)的透明板上沉积不透明的膜,例如铬(Cr)。 电子束光致抗蚀剂层沉积在Cr膜上,并部分暴露在区域A中,并通过电子束完全暴露在紧密间隔的交替区域B中。 然后曝光的光刻胶显影。 在区域B中蚀刻Cr膜,而区域A中的剩余抗蚀剂保护Cr不被蚀刻。 等离子体蚀刻回蚀刻e-bean抗蚀剂以去除区域A上的抗蚀剂,然后通过等离子体蚀刻将区域B中的石英板凹入深度d,同时Cr保护区域A中的石英免受蚀刻。 当UV光通过掩模透射以暴露产品基底上的抗蚀剂时,凹陷被蚀刻到深度以提供½波长(180°)的A和B之间的光程差。 这种180°相移使区域A和B之间的Cr膜下的衍射光最小化,并且改善了DOF并因此改善了光刻胶分辨率。 由于使用单个电子束抗蚀剂来制造掩模,因此在区域A和区域B之间具有改善的对准精度是更具制造成本效益的。