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    • 1. 发明授权
    • Structure of stacked integrated circuits
    • 堆叠集成电路的结构
    • US06441496B1
    • 2002-08-27
    • US09768987
    • 2001-01-23
    • Wen Chuan ChenKuo Feng PengJichen WuChia Jung Chang
    • Wen Chuan ChenKuo Feng PengJichen WuChia Jung Chang
    • H01L23495
    • H01L24/29H01L24/32H01L24/83H01L25/0657H01L2224/32145H01L2224/48091H01L2224/48227H01L2224/73265H01L2224/83139H01L2224/8319H01L2224/8385H01L2225/0651H01L2225/06575H01L2924/01033H01L2924/01075H01L2924/07802H01L2924/14H01L2924/15311H01L2924/00014
    • The structure of stacked integrated circuits includes a substrate, a lower integrated circuit, a plurality of wirings, an adhesive layer, and an upper integrated circuit. The substrate has a first surface formed with signal input terminals, and a second surface formed with signal output terminals. The lower integrated circuit has a first surface and a second surface. The first surface is adhered to the first surface of the substrate while the second surface is formed with a plurality of bonding pads. The wirings have first ends and second ends. The first ends are electrically connected to the bonding pads of the lower integrated circuit while the second ends are electrically connected to the signal input terminals of the substrate. The adhesive layer is coated on the second surface of the lower integrated circuit and includes adhesive agent and filling elements. The upper integrated circuit is stacked above the second surface of the lower integrated circuit with the adhesive layer inserted between the upper and lower integrated circuit. The lower integrated circuit is adhered to the upper integrated circuit by the adhesive agent. A predetermined gap is formed between the lower and upper integrated circuit by the filling elements. According to this structure, the wirings located under the lower integrated circuit are free from being pressed and damaged by the upper integrated circuit when stacking a plurality of integrated circuits. Thus, the stacking processes can be facilitated and the manufacturing costs can also be lowered.
    • 堆叠集成电路的结构包括基板,下部集成电路,多个布线,粘合层和上部集成电路。 衬底具有形成有信号输入端的第一表面和形成有信号输出端的第二表面。 下集成电路具有第一表面和第二表面。 第一表面粘附到基板的第一表面,而第二表面形成有多个接合焊盘。 布线具有第一端和第二端。 第一端电连接到下集成电路的接合焊盘,而第二端电连接到衬底的信号输入端。 粘合剂层涂覆在下部集成电路的第二表面上并且包括粘合剂和填充元件。 上集成电路堆叠在下集成电路的第二表面上方,粘合层插入在上下集成电路之间。 下集成电路通过粘合剂粘附到上集成电路。 通过填充元件在下集成电路和上集成电路之间形成预定的间隙。 根据该结构,当堆叠多个集成电路时,位于下部集成电路下方的配线不受上部集成电路的压制和损坏。 因此,可以促进堆叠处理,并且还可以降低制造成本。
    • 2. 发明授权
    • Door lock transmission element
    • 门锁传动元件
    • US07049780B2
    • 2006-05-23
    • US10995232
    • 2004-11-24
    • Chia Jung Chang
    • Chia Jung Chang
    • G05B19/29
    • B60R1/072
    • An auto-adjusting electric rear-view mirror includes at least two driving mechanisms for driving the rear-view mirror to deflect. The driving mechanisms are respectively coupled to servo control circuits that are further connected to sensor members. The servo control circuits are also coupled to a master control circuit that is further connected to an external controller. The sensor members can sense a positional variation of the rear-view mirror and send a feedback signal to the servo control circuits. The servo control circuits compare a signal from input ports thereof with the feedback signal, and output a control signal to the driving mechanisms according to the comparison result to drive position or negative rotation of the driving mechanisms, such that the rear-view mirror would automatically adjust its view angle to ensure driving safety.
    • 一种自动调节电动后视镜包括用于驱动后视镜偏转的至少两个驱动机构。 驱动机构分别耦合到进一步连接到传感器构件的伺服控制电路。 伺服控制电路还耦合到进一步连接到外部控制器的主控制电路。 传感器构件可感测后视镜的位置变化,并向伺服控制电路发送反馈信号。 伺服控制电路将来自其输入端口的信号与反馈信号进行比较,并根据比较结果向驱动机构输出驱动机构的驱动位置或负旋转的控制信号,使得后视镜将自动 调整其视角以确保驾驶安全。