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1. 发明申请

US20100078418A1 METHOD OF LASER MICRO-MACHINING STAINLESS STEEL WITH HIGH COSMETIC QUALITY 审中-公开
标题翻译：具有高化妆品质量的激光微加工不锈钢的方法
公开(公告)号：US20100078418A1
公开(公告)日：2010-04-01
申请号：US12413272
申请日：2009-03-27
申请人： Weisheng Lei , Mehmet E. Alpay , Hisashi Matsumoto , Jeffrey Howerton , Guangyu Li , Peter Pirogovsky , Wilson Lu , Glenn Simenson
发明人： Weisheng Lei , Mehmet E. Alpay , Hisashi Matsumoto , Jeffrey Howerton , Guangyu Li , Peter Pirogovsky , Wilson Lu , Glenn Simenson
IPC分类号： B23K26/38
CPC分类号： B23K26/18 , B23K26/009 , B23K26/0622 , B23K26/36 , B23K26/382 , B23K26/40 , B23K2101/34 , B23K2103/05 , B23K2103/10
摘要： A process to laser micro-machine a metal part with a high cosmetic quality surface includes applying a protective coating layer to at least one surface of the part before micro-machining the part with a laser. The protective coating applied to the high quality cosmetic surface can have a thickness of between about 5 mil and about 10 mil, inclusive and have sufficient adhesion strength to adhere to the part without delaminating during processing. The protective coating applied to the machining surface of the part can be a metallic material, such as a metallic foil or tape.
摘要翻译：激光微加工具有高化妆品质量表面的金属部件的方法包括在用激光微加工部件之前，在部件的至少一个表面上施加保护涂层。施加到高质量化妆品表面的保护涂层可以具有约5密耳至约10密耳之间的厚度，并且具有足够的粘附强度以在加工期间粘附到部件上而不会分层。施加到部件的加工表面的保护涂层可以是金属材料，例如金属箔或带。

2. 发明申请

US20100252959A1 METHOD FOR IMPROVED BRITTLE MATERIALS PROCESSING 审中-公开
标题翻译：改进的脆性材料加工方法
公开(公告)号：US20100252959A1
公开(公告)日：2010-10-07
申请号：US12732020
申请日：2010-03-25
申请人： Weisheng Lei , Glenn Simenson , Hisashi Matsumoto , Guangyu Li , Jeffrey Howerton
发明人： Weisheng Lei , Glenn Simenson , Hisashi Matsumoto , Guangyu Li , Jeffrey Howerton
IPC分类号： B44C1/22 , B29C35/08
CPC分类号： B23K26/40 , B23K2103/50
摘要： An improved method for laser machining features in brittle materials such as glass is presented, wherein a tool path related to a feature is analyzed to determine how many passes are required to laser machine the feature using non-adjacent laser pulses. Laser pulses applied during subsequent passes are located so as to overlap previous laser spot locations by a predetermined overlap amount. In this way no single spot receives excessive laser radiation caused by immediately subsequent laser pulses being applied adjacent to a previous pulse location.
摘要翻译：提出了一种用于脆性材料如玻璃中的激光加工特征的改进方法，其中分析与特征相关的刀具路径，以确定使用不相邻的激光脉冲激光加工特征所需的通过数量。在后续通过期间施加的激光脉冲被定位成与先前的激光光斑位置重叠预定的重叠量。以这种方式，没有单个点接收由紧邻的先前脉冲位置施加的紧随其后的激光脉冲引起的过多的激光辐射。

3. 发明申请

US20100252540A1 METHOD AND APPARATUS FOR BRITTLE MATERIALS PROCESSING 审中-公开
标题翻译：用于脆性材料加工的方法和装置
公开(公告)号：US20100252540A1
公开(公告)日：2010-10-07
申请号：US12753509
申请日：2010-04-02
申请人： Weisheng Lei , Hisashi Matsumoto , Glenn Simenson , Guangyu Li , Jeffrey Howerton , David Childers , Edward Johnson , Jeffrey Albelo
发明人： Weisheng Lei , Hisashi Matsumoto , Glenn Simenson , Guangyu Li , Jeffrey Howerton , David Childers , Edward Johnson , Jeffrey Albelo
IPC分类号： B23K26/00
CPC分类号： B23K26/40 , B23K2103/50
摘要： An improved method for laser machining features in brittle materials 8 such as glass is presented, wherein a tool path 10 related to a feature is analyzed to determine how many passes are required to laser machine the feature using non-adjacent laser pulses 12. Laser pulses 12 applied during subsequent passes are located so as to overlap previous laser spot locations by a predetermined overlap amount. In this way no single spot receives excessive laser radiation caused by immediately subsequent laser pulses 12 being applied adjacent to a previous pulse location.
摘要翻译：提出了一种用于诸如玻璃的脆性材料8中的激光加工特征的改进方法，其中分析与特征相关的工具路径10，以确定使用不相邻的激光脉冲12激光加工特征所需的通过次数。激光脉冲在后续通过期间施加的12被定位成与先前的激光光斑位置重叠预定的重叠量。以这种方式，没有单个点接收由紧邻的先前脉冲位置施加的紧随其后的激光脉冲12引起的过多的激光辐射。

4. 发明授权

US09302350B2 Method for laser processing glass with a chamfered edge 有权
公开(公告)号：US09302350B2
公开(公告)日：2016-04-05
申请号：US12336609
申请日：2008-12-17
申请人： Weisheng Lei , Glenn Simenson , Hisashi Matsumoto , Guangyu Li , Jeffery Howerton
发明人： Weisheng Lei , Glenn Simenson , Hisashi Matsumoto , Guangyu Li , Jeffery Howerton
IPC分类号： B23K26/00 , B23K26/03 , B23K26/40 , C03B33/08
摘要： A laser machining process is described for laser machining glass or glass-like materials. This process machines articles or features in articles with chamfered edges in one manufacturing operation. Chamfered edges are desirable in glass and glass-like materials because they resist fracturing or chipping and eliminate sharp edges. Producing articles or features in articles in one manufacturing operation is desirable because it can save time and expense by eliminating the need to transfer the article to a separate machine for chamfering after laser machining. Alternatively, it can permit use of less expensive equipment because the same laser used for machining can be used to form the chamfer instead of having a separate process perform the chamfering. Producing chamfers with laser machining results in high quality chamfers without the need for a separate polishing or finishing step.

5. 发明申请

US20100147813A1 METHOD FOR LASER PROCESSING GLASS WITH A CHAMFERED EDGE 有权
标题翻译：用于激光加工玻璃与渐变边缘的方法
公开(公告)号：US20100147813A1
公开(公告)日：2010-06-17
申请号：US12336609
申请日：2008-12-17
申请人： Weisheng Lei , Glenn Simenson , Hisashi Matsumoto , Guangyu Li , Jeffery Howerton
发明人： Weisheng Lei , Glenn Simenson , Hisashi Matsumoto , Guangyu Li , Jeffery Howerton
IPC分类号： B23K26/38
CPC分类号： B23K26/40 , B23K2103/50 , B28D1/22 , C03B33/0222 , C03B33/04 , C03B33/082
摘要： A laser machining process is described for laser machining glass or glass-like materials. This process machines articles or features in articles with chamfered edges in one manufacturing operation. Chamfered edges are desirable in glass and glass-like materials because they resist fracturing or chipping and eliminate sharp edges. Producing articles or features in articles in one manufacturing operation is desirable because it can save time and expense by eliminating the need to transfer the article to a separate machine for chamfering after laser machining. Alternatively, it can permit use of less expensive equipment because the same laser used for machining can be used to form the chamfer instead of having a separate process perform the chamfering. Producing chamfers with laser machining results in high quality chamfers without the need for a separate polishing or finishing step.
摘要翻译：描述了激光加工玻璃或玻璃状材料的激光加工工艺。在一个制造操作中，该过程在具有倒角边缘的物品中加工制品或特征。倒角边缘在玻璃和玻璃状材料中是理想的，因为它们抵抗压裂或碎裂并消除锋利的边缘。在一个制造操作中在制品中制造物品或特征是期望的，因为通过在激光加工之后不需要将物品转移到单独的机器进行倒角，因此可以节省时间和费用。或者，它可以允许使用较便宜的设备，因为用于加工的相同的激光可用于形成倒角，而不是具有单独的工艺来执行倒角。使用激光加工生产倒角可以获得高品质的倒角，无需单独的抛光或精加工。

6. 发明授权

US09346130B2 Method for laser processing glass with a chamfered edge 有权
标题翻译：激光加工具有倒角边缘的玻璃的方法
公开(公告)号：US09346130B2
公开(公告)日：2016-05-24
申请号：US12336609
申请日：2008-12-17
申请人： Weisheng Lei , Glenn Simenson , Hisashi Matsumoto , Guangyu Li , Jeffery Howerton
发明人： Weisheng Lei , Glenn Simenson , Hisashi Matsumoto , Guangyu Li , Jeffery Howerton
IPC分类号： B23K26/00 , B23K26/03 , B23K26/40 , C03B33/08
CPC分类号： B23K26/40 , B23K2103/50 , B28D1/22 , C03B33/0222 , C03B33/04 , C03B33/082
摘要： A laser machining process is described for laser machining glass or glass-like materials. This process machines articles or features in articles with chamfered edges in one manufacturing operation. Chamfered edges are desirable in glass and glass-like materials because they resist fracturing or chipping and eliminate sharp edges. Producing articles or features in articles in one manufacturing operation is desirable because it can save time and expense by eliminating the need to transfer the article to a separate machine for chamfering after laser machining. Alternatively, it can permit use of less expensive equipment because the same laser used for machining can be used to form the chamfer instead of having a separate process perform the chamfering. Producing chamfers with laser machining results in high quality chamfers without the need for a separate polishing or finishing step.
摘要翻译：描述了激光加工玻璃或玻璃状材料的激光加工工艺。在一个制造操作中，该过程在具有倒角边缘的物品中加工制品或特征。倒角边缘在玻璃和玻璃状材料中是理想的，因为它们抵抗压裂或碎裂并消除锋利的边缘。在一个制造操作中在制品中制造物品或特征是期望的，因为通过在激光加工之后不需要将物品转移到单独的机器进行倒角，因此可以节省时间和费用。或者，它可以允许使用较便宜的设备，因为用于加工的相同的激光可用于形成倒角，而不是具有单独的工艺来执行倒角。使用激光加工生产倒角可以获得高品质的倒角，无需单独的抛光或精加工。

7. 发明授权

US08648277B2 Laser direct ablation with picosecond laser pulses at high pulse repetition frequencies 有权
标题翻译：激光直接消融，皮秒激光脉冲以高脉冲重复频率
公开(公告)号：US08648277B2
公开(公告)日：2014-02-11
申请号：US13076754
申请日：2011-03-31
申请人： Mehmet E. Alpay , Hisashi Matsumoto , Mark A. Unrath , Guangyu Li
发明人： Mehmet E. Alpay , Hisashi Matsumoto , Mark A. Unrath , Guangyu Li
IPC分类号： B23K26/00 , B23K26/36
CPC分类号： B23K26/0648 , B23K26/0622 , B23K26/0652 , B23K26/082 , B23K26/0861 , B23K26/364 , B23K2101/42 , B23K2103/42 , B23K2103/50
摘要： Laser direct ablation (LDA) produces patterns cut into a dielectric layer for the formation of electrically conductive traces with controlled signal propagation characteristics. LDA processing includes selecting a dose fluence for removing a desired depth of material along a scribe line on a surface of a workpiece, selecting a temporal pulsewidth for each laser pulse in a series of laser pulses, and selecting a pulse repetition frequency for the series of laser pulse. The pulse repetition frequency is based at least in part on the selected temporal pulsewidth to maintain the selected dose fluence along the scribe line. The selected pulse repetition frequency provides a predetermined minimum overlap of laser spots along the scribe line. The LDA process further includes generating a laser beam including the series of laser pulses according to the selected dose fluence, temporal pulsewidth, and pulse repetition frequency.
摘要翻译：激光直接消融（LDA）产生切割成电介质层的图案，以形成具有受控信号传播特性的导电迹线。 LDA处理包括选择剂量注量以沿着工件表面上的划线去除期望的材料深度，在一系列激光脉冲中选择每个激光脉冲的时间脉冲宽度，以及选择一系列激光脉冲的脉冲重复频率激光脉冲。脉冲重复频率至少部分地基于所选择的时间脉冲宽度，以维持沿着划线的所选择的剂量注量。所选择的脉冲重复频率提供沿着划线的激光点的预定的最小重叠。 LDA工艺还包括根据所选择的剂量注量，时间脉冲宽度和脉冲重复频率产生包括一系列激光脉冲的激光束。

8. 发明申请

US20120248075A1 LASER DIRECT ABLATION WITH PICOSECOND LASER PULSES AT HIGH PULSE REPETITION FREQUENCIES 有权
标题翻译：激光直接与高脉冲重复频率下的PICOSECOND激光脉冲相关
公开(公告)号：US20120248075A1
公开(公告)日：2012-10-04
申请号：US13076754
申请日：2011-03-31
申请人： Mehmet E. Alpay , Hisashi Matsumoto , Mark A. Unrath , Guangyu Li
发明人： Mehmet E. Alpay , Hisashi Matsumoto , Mark A. Unrath , Guangyu Li
IPC分类号： B23K26/36 , B23K26/04
CPC分类号： B23K26/0648 , B23K26/0622 , B23K26/0652 , B23K26/082 , B23K26/0861 , B23K26/364 , B23K2101/42 , B23K2103/42 , B23K2103/50
摘要： Laser direct ablation (LDA) produces patterns cut into a dielectric layer for the formation of electrically conductive traces with controlled signal propagation characteristics. LDA processing includes selecting a dose fluence for removing a desired depth of material along a scribe line on a surface of a workpiece, selecting a temporal pulsewidth for each laser pulse in a series of laser pulses, and selecting a pulse repetition frequency for the series of laser pulse. The pulse repetition frequency is based at least in part on the selected temporal pulsewidth to maintain the selected dose fluence along the scribe line. The selected pulse repetition frequency provides a predetermined minimum overlap of laser spots along the scribe line. The LDA process further includes generating a laser beam including the series of laser pulses according to the selected dose fluence, temporal pulsewidth, and pulse repetition frequency.
摘要翻译：激光直接消融（LDA）产生切割成电介质层的图案，以形成具有受控信号传播特性的导电迹线。 LDA处理包括选择剂量注量以沿着工件表面上的划线去除期望的材料深度，在一系列激光脉冲中选择每个激光脉冲的时间脉冲宽度，以及选择一系列激光脉冲的脉冲重复频率激光脉冲。脉冲重复频率至少部分地基于所选择的时间脉冲宽度，以维持沿着划线的所选择的剂量注量。所选择的脉冲重复频率提供沿着划线的激光点的预定的最小重叠。 LDA工艺还包括根据所选择的剂量注量，时间脉冲宽度和脉冲重复频率产生包括一系列激光脉冲的激光束。

9. 发明授权

US08878095B2 Reducing back-reflection in laser micromachining systems 有权
标题翻译：减少激光微加工系统中的反射反射
公开(公告)号：US08878095B2
公开(公告)日：2014-11-04
申请号：US12972021
申请日：2010-12-17
申请人： Guangyu Li , Mehmet E. Alpay
发明人： Guangyu Li , Mehmet E. Alpay
IPC分类号： B23K26/06 , B23K26/08 , H01S3/00
CPC分类号： B23K26/066 , H01S3/0064
摘要： Systems and methods reduce or prevent back-reflections in a laser processing system. A system includes a laser source to generate an incident laser beam, a laser beam output to direct the incident laser beam toward a work surface along a beam path, and a spatial filter. The system further includes a beam expander to expand a diameter of the incident laser beam received through the spatial filter, and a scan lens to focus the expanded incident laser beam at a target location on a work surface. A reflected laser beam from the work surface returns through the scan lens to the beam expander, which reduces a diameter of the reflected beam and increases a divergence angle of the reflected laser beam. The spatial filter blocks a portion of the diverging reflected laser beam from passing through the aperture and returning to the laser beam output.
摘要翻译：系统和方法减少或防止激光加工系统中的反射。一种系统包括用于产生入射激光束的激光源，将入射激光束沿着光束路径引向工作表面的激光束输出和空间滤光器。该系统还包括扩束器，以扩大通过空间滤波器接收的入射激光束的直径;以及扫描透镜，以将扩大的入射激光束聚焦在工作表面上的目标位置。来自工作表面的反射激光束通过扫描透镜返回到光束扩展器，这减小了反射光束的直径并增加了反射激光束的发散角。空间滤波器阻挡发散反射激光束的一部分通过孔并返回到激光束输出。

10. 发明申请

US20120152918A1 REDUCING BACK-REFLECTION IN LASER MICROMACHINING SYSTEMS 有权
标题翻译：减少激光微型系统中的反射
公开(公告)号：US20120152918A1
公开(公告)日：2012-06-21
申请号：US12972021
申请日：2010-12-17
申请人： Guangyu Li , Mehmet E. Alpay
发明人： Guangyu Li , Mehmet E. Alpay
IPC分类号： B23K26/06 , H01S3/10
CPC分类号： B23K26/066 , H01S3/0064
摘要： Systems and methods reduce or prevent back-reflections in a laser processing system. A system includes a laser source to generate an incident laser beam, a laser beam output to direct the incident laser beam toward a work surface along a beam path, and a spatial filter. The system further includes a beam expander to expand a diameter of the incident laser beam received through the spatial filter, and a scan lens to focus the expanded incident laser beam at a target location on a work surface. A reflected laser beam from the work surface returns through the scan lens to the beam expander, which reduces a diameter of the reflected beam and increases a divergence angle of the reflected laser beam. The spatial filter blocks a portion of the diverging reflected laser beam from passing through the aperture and returning to the laser beam output.
摘要翻译：系统和方法减少或防止激光加工系统中的反射。一种系统包括用于产生入射激光束的激光源，将入射激光束沿着光束路径引向工作表面的激光束输出和空间滤光器。该系统还包括扩束器，以扩大通过空间滤波器接收的入射激光束的直径;以及扫描透镜，以将扩大的入射激光束聚焦在工作表面上的目标位置。来自工作表面的反射激光束通过扫描透镜返回到光束扩展器，这减小了反射光束的直径并增加了反射激光束的发散角。空间滤波器阻挡发散反射激光束的一部分通过孔并返回到激光束输出。

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