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1. 再颁专利

USRE44429E1 Light-emitting semiconductor device having enhanced brightness 失效
标题翻译：具有增强的亮度的发光半导体器件
公开(公告)号：USRE44429E1
公开(公告)日：2013-08-13
申请号：US11976615
申请日：2007-10-25
申请人： Wei-En Chien , Chih-Sung Chang , Tzer-Perng Chen , Pai-Hsiang Wang
发明人： Wei-En Chien , Chih-Sung Chang , Tzer-Perng Chen , Pai-Hsiang Wang
IPC分类号： H01L29/205
CPC分类号： H01L33/38 , H01L33/387 , H01L33/42
摘要： This invention this invention provides a light-emitting semiconductor device having enhanced brightness, to ensure even current distribution emitted by a front contact of the light emitting diodes so as to improve the light-emitting efficiency of the active layer. This invention adopts the method to manufacture the light-emitting device, comprising the steps of: forming an active layer on a substrate; forming a capping layer on the active layer to enhance current distribution, where a back contact is located on another side of the substrate and a front contact is located above the capping layer. This invention is characterized by: re-designing the front contact, by reducing the width of a metallic pattern constructing fingers or Mesh lines and increasing the number of the fingers or Mesh lines, so as to resolve the current crowding problem.
摘要翻译：本发明提供了一种具有增强的亮度的发光半导体器件，以确保由发光二极管的前触点发射的均匀的电流分布，从而提高有源层的发光效率。本发明采用制造发光器件的方法，包括以下步骤：在衬底上形成有源层; 在有源层上形成覆盖层以增强电流分布，其中背面接触位于衬底的另一侧上，并且前触点位于覆盖层上方。本发明的特征在于：通过减少构成手指或网格线的金属图案的宽度和增加手指或网格线的数量来重新设计前触点，以便解决当前的拥挤问题。

2. 发明申请

US20090181480A1 LED heat-radiating substrate and method for making the same 审中-公开
标题翻译： LED散热基板及其制造方法
公开(公告)号：US20090181480A1
公开(公告)日：2009-07-16
申请号：US12406978
申请日：2009-03-19
申请人： Chih-Sung Chang , Tzer-Perng Chen , Pai-Hsiang Wang
发明人： Chih-Sung Chang , Tzer-Perng Chen , Pai-Hsiang Wang
IPC分类号： H01L21/58
CPC分类号： H01S5/024 , H01L33/641
摘要： A method for making an LED is proposed. First a light-emitting structure is formed on a temporary substrate, and then a heat radiating substrate is formed on the light-emitting structure. Next the temporary substrate is removed. The heat radiating substrate includes a low expansion body and a high thermal conductivity body mutually connected.
摘要翻译：提出了制造LED的方法。首先，在临时衬底上形成发光结构，然后在发光结构上形成散热衬底。接下来，移除临时衬底。散热基板包括相互连接的低膨胀体和高导热体。

3. 发明授权

US07335522B2 Package structure for light emitting diode and method thereof 有权
公开(公告)号：US07335522B2
公开(公告)日：2008-02-26
申请号：US11243750
申请日：2005-10-04
申请人： Pai-Hsiang Wang , Chih-Sung Chang , Tzer-Perng Chen
发明人： Pai-Hsiang Wang , Chih-Sung Chang , Tzer-Perng Chen
IPC分类号： H01L21/00 , H01L33/00
CPC分类号： H01L33/647 , H01L25/0753 , H01L33/486 , H01L33/60 , H01L33/62 , H01L33/642 , H01L2224/16 , H01L2224/45144 , H01L2224/48091 , H01L2924/00014 , H01L2924/01079 , H01L2924/12041 , H01L2924/00 , H01L2224/0401
摘要： A package structure of a light emitting diode includes a substrate structure, a connection layer, and at least one conductive passage. The substrate structure sequentially includes a conduction board, an insulation layer, and a conductive layer. The insulation layer is configured to electrically insulate the conduction board from the conductive layer, and also to insulate a first portion from a second portion of the conduction board. The substrate structure has an opening to expose the conduction board. The connection layer configured to support and electrically couple to a first electrode of a light emitting diode (LED) is disposed in the opening. The connection layer is also configured to electrically couple to the conduction board and to be electrically insulated from at least one portion of the conductive layer, which is coupled to a second electrode of the LED. The conductive passage electrically couples the second portion of the conduction board and the portion of conductive layer, which is insulated from the connection layer.

4. 发明申请

US20060027829A1 Package structure for light emitting diode and method thereof 有权
公开(公告)号：US20060027829A1
公开(公告)日：2006-02-09
申请号：US11243634
申请日：2005-10-04
申请人： Pai-Hsiang Wang , Chih-Sung Chang , Tzer-Perng Chen
发明人： Pai-Hsiang Wang , Chih-Sung Chang , Tzer-Perng Chen
IPC分类号： H01L33/00
CPC分类号： H01L33/647 , H01L25/0753 , H01L33/486 , H01L33/60 , H01L33/62 , H01L33/642 , H01L2224/16 , H01L2224/45144 , H01L2224/48091 , H01L2924/00014 , H01L2924/01079 , H01L2924/12041 , H01L2924/00 , H01L2224/0401
摘要： A package structure of a light emitting diode includes a substrate structure, a connection layer, and at least one conductive passage. The substrate structure sequentially includes a conduction board, an insulation layer, and a conductive layer. The insulation layer is configured to electrically insulate the conduction board from the conductive layer, and also to insulate a first portion from a second portion of the conduction board. The substrate structure has an opening to expose the conduction board. The connection layer configured to support and electrically couple to a first electrode of a light emitting diode (LED) is disposed in the opening. The connection layer is also configured to electrically couple to the conduction board and to be electrically insulated from at least one portion of the conductive layer, which is coupled to a second electrode of the LED. The conductive passage electrically couples the second portion of the conduction board and the portion of conductive layer, which is insulated from the connection layer.

5. 发明授权

US07030423B2 Package structure for light emitting diode and method thereof 有权
标题翻译：发光二极管的封装结构及其方法
公开(公告)号：US07030423B2
公开(公告)日：2006-04-18
申请号：US10715863
申请日：2003-11-19
申请人： Chih-Sung Chang , Tzer-Perng Chen , Pai-Hsiang Wang
发明人： Chih-Sung Chang , Tzer-Perng Chen , Pai-Hsiang Wang
IPC分类号： H01L33/00
CPC分类号： H01L33/486 , H01L33/62 , H01L33/64 , H01L33/647 , H01L2224/32013 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/49171 , H01L2224/73265 , H01L2924/00014 , H01L2924/00
摘要： A package structure for a light emitting diode (LED) includes a substrate structure and a reflective layer. The substrate structure sequentially includes a conduction board, an insulation layer, and a conductive layer. The substrate structure has an opening to expose the conduction board. The reflective layer configured to support and electrically couple to a first electrode of the LED is disposed in the opening. The reflective layer is electrically coupled to the conduction board and electrically insulated from at least a portion of the conductivity layer, which is coupled to a second electrode of the LED.
摘要翻译：用于发光二极管（LED）的封装结构包括衬底结构和反射层。基板结构依次包括导电板，绝缘层和导电层。基板结构具有露出导电板的开口。构造成支撑并电耦合到LED的第一电极的反射层设置在开口中。反射层电耦合到导电板并与导电层的至少一部分电绝缘，该导电层耦合到LED的第二电极。

6. 发明授权

US06984852B2 Package structure for light emitting diode and method thereof 有权
标题翻译：发光二极管的封装结构及其方法
公开(公告)号：US06984852B2
公开(公告)日：2006-01-10
申请号：US10770921
申请日：2004-02-02
申请人： Pai-Hsiang Wang , Chih-Sung Chang , Tzer-Perng Chen
发明人： Pai-Hsiang Wang , Chih-Sung Chang , Tzer-Perng Chen
IPC分类号： H01L27/15
CPC分类号： H01L33/647 , H01L25/0753 , H01L33/486 , H01L33/60 , H01L33/62 , H01L33/642 , H01L2224/16 , H01L2224/45144 , H01L2224/48091 , H01L2924/00014 , H01L2924/01079 , H01L2924/12041 , H01L2924/00 , H01L2224/0401
摘要： A package structure of a light emitting diode includes a substrate structure, a connection layer, and at least one conductive passage. The substrate structure sequentially includes a conduction board, an insulation layer, and a conductive layer. The insulation layer is configured to electrically insulate the conduction board from the conductive layer, and also to insulate a first portion from a second portion of the conduction board. The substrate structure has an opening to expose the conduction board. The connection layer configured to support and electrically couple to a first electrode of a light emitting diode (LED) is disposed in the opening. The connection layer is also configured to electrically couple to the conduction board and to be electrically insulated from at least one portion of the conductive layer, which is coupled to a second electrode of the LED. The conductive passage electrically couples the second portion of the conduction board and the portion of conductive layer, which is insulated from the connection layer.
摘要翻译：发光二极管的封装结构包括衬底结构，连接层和至少一个导电通道。基板结构依次包括导电板，绝缘层和导电层。绝缘层被配置为使导电板与导电层电绝缘，并且还使第一部分与导电板的第二部分绝缘。基板结构具有露出导电板的开口。配置为支撑并电耦合到发光二极管（LED）的第一电极的连接层设置在开口中。连接层还被配置为电耦合到导电板并且与导电层的至少一部分电绝缘，该导电层耦合到LED的第二电极。导电通路电连接导电板的第二部分和导电层的与连接层绝缘的部分。

7. 发明申请

US20050274971A1 Light emitting diode and method of making the same 审中-公开
标题翻译：发光二极管及其制作方法
公开(公告)号：US20050274971A1
公开(公告)日：2005-12-15
申请号：US10866472
申请日：2004-06-10
申请人： Pai-Hsiang Wang , Chih-Sung Chang , Tzer-Perng Chen
发明人： Pai-Hsiang Wang , Chih-Sung Chang , Tzer-Perng Chen
IPC分类号： H01L29/06 , H01L33/00 , H01L33/40 , H01L33/46 , H01L33/64
CPC分类号： H01L33/641 , H01L33/0079 , H01L33/405 , H01L33/46 , H01L2224/48463 , H01L2224/49107
摘要： A light emitting diode (LED) and a method of making the same are disclosed. The present invention is featured in that the LED comprises a transparent heat-conductive glue, a reflective layer, and a carrier, etc, wherein the transparent heat-conductive glue is used to adhere the epitaxial structure and the carrier of the LED; the reflective layer can make the light emitted by the epitaxial structure to be reflected more efficiently; and the carrier is used to enhance the heat-dissipation effect of the LED. Moreover, the transparent heat-conductive glue and the reflective layer can be replaced with one single adhesive reflective layer having functions of adhesion and reflection simultaneously.
摘要翻译：公开了一种发光二极管（LED）及其制造方法。本发明的特征在于，LED包括透明导热胶，反射层和载体等，其中透明导热胶用于粘附LED的外延结构和载体; 反射层可以使由外延结构发射的光更有效地反射; 并且载体用于增强LED的散热效果。此外，透明导热胶和反射层可以由具有粘合和反射功能的一个单一粘合剂反射层代替。

8. 发明申请

US20080057603A1 Light Emitting Diode and Method of Making the Same 审中-公开
标题翻译：发光二极管及其制作方法
公开(公告)号：US20080057603A1
公开(公告)日：2008-03-06
申请号：US11936613
申请日：2007-11-07
申请人： Pai-Hsiang Wang , Chih-Sung Chang , Tzer-Perng Chen
发明人： Pai-Hsiang Wang , Chih-Sung Chang , Tzer-Perng Chen
IPC分类号： H01L33/00
CPC分类号： H01L33/641 , H01L33/0079 , H01L33/405 , H01L33/46 , H01L2224/48463 , H01L2224/49107
摘要： A light emitting diode (LED) and a method of making the same are disclosed. The present invention is featured in that the LED comprises a transparent heat-conductive glue, a reflective layer, and a carrier, etc, wherein the transparent heat-conductive glue is used to adhere the epitaxial structure and the carrier of the LED; the reflective layer can make the light emitted by the epitaxial structure to be reflected more efficiently; and the carrier is used to enhance the heat-dissipation effect of the LED. Moreover, the transparent heat-conductive glue and the reflective layer can be replaced with one single adhesive reflective layer having functions of adhesion and reflection simultaneously.
摘要翻译：公开了一种发光二极管（LED）及其制造方法。本发明的特征在于，LED包括透明导热胶，反射层和载体等，其中透明导热胶用于粘附LED的外延结构和载体; 反射层可以使由外延结构发射的光更有效地反射; 并且载体用于增强LED的散热效果。此外，透明导热胶和反射层可以由具有粘合和反射功能的一个单一粘合剂反射层代替。

9. 发明授权

US07335926B2 Package structure for light emitting diode and method thereof 有权
标题翻译：发光二极管的封装结构及其方法
公开(公告)号：US07335926B2
公开(公告)日：2008-02-26
申请号：US11243634
申请日：2005-10-04
申请人： Pai-Hsiang Wang , Chih-Sung Chang , Tzer-Perng Chen
发明人： Pai-Hsiang Wang , Chih-Sung Chang , Tzer-Perng Chen
IPC分类号： H01L33/00
CPC分类号： H01L33/647 , H01L25/0753 , H01L33/486 , H01L33/60 , H01L33/62 , H01L33/642 , H01L2224/16 , H01L2224/45144 , H01L2224/48091 , H01L2924/00014 , H01L2924/01079 , H01L2924/12041 , H01L2924/00 , H01L2224/0401
摘要： A package structure of a light emitting diode includes a substrate structure, a connection layer, and at least one conductive passage. The substrate structure sequentially includes a conduction board, an insulation layer, and a conductive layer. The insulation layer is configured to electrically insulate the conduction board from the conductive layer, and also to insulate a first portion from a second portion of the conduction board. The substrate structure has an opening to expose the conduction board. The connection layer configured to support and electrically couple to a first electrode of a light emitting diode (LED) is disposed in the opening. The connection layer is also configured to electrically couple to the conduction board and to be electrically insulated from at least one portion of the conductive layer, which is coupled to a second electrode of the LED. The conductive passage electrically couples the second portion of the conduction board and the portion of conductive layer, which is insulated from the connection layer.
摘要翻译：发光二极管的封装结构包括衬底结构，连接层和至少一个导电通道。基板结构依次包括导电板，绝缘层和导电层。绝缘层被配置为使导电板与导电层电绝缘，并且还使第一部分与导电板的第二部分绝缘。基板结构具有露出导电板的开口。配置为支撑并电耦合到发光二极管（LED）的第一电极的连接层设置在开口中。连接层还被配置为电耦合到导电板并且与导电层的至少一部分电绝缘，该导电层耦合到LED的第二电极。导电通路电连接导电板的第二部分和导电层的与连接层绝缘的部分。

10. 发明申请

US20060030063A1 Package structure for light emitting diode and method thereof 有权
公开(公告)号：US20060030063A1
公开(公告)日：2006-02-09
申请号：US11243750
申请日：2005-10-04
申请人： Pai-Hsiang Wang , Chih-Sung Chang , Tzer-Perng Chen
发明人： Pai-Hsiang Wang , Chih-Sung Chang , Tzer-Perng Chen
IPC分类号： H01L21/00
CPC分类号： H01L33/647 , H01L25/0753 , H01L33/486 , H01L33/60 , H01L33/62 , H01L33/642 , H01L2224/16 , H01L2224/45144 , H01L2224/48091 , H01L2924/00014 , H01L2924/01079 , H01L2924/12041 , H01L2924/00 , H01L2224/0401
摘要： A package structure of a light emitting diode includes a substrate structure, a connection layer, and at least one conductive passage. The substrate structure sequentially includes a conduction board, an insulation layer, and a conductive layer. The insulation layer is configured to electrically insulate the conduction board from the conductive layer, and also to insulate a first portion from a second portion of the conduction board. The substrate structure has an opening to expose the conduction board. The connection layer configured to support and electrically couple to a first electrode of a light emitting diode (LED) is disposed in the opening. The connection layer is also configured to electrically couple to the conduction board and to be electrically insulated from at least one portion of the conductive layer, which is coupled to a second electrode of the LED. The conductive passage electrically couples the second portion of the conduction board and the portion of conductive layer, which is insulated from the connection layer.

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