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1. 发明授权

US5081051A Method for conditioning the surface of a polishing pad 失效
标题翻译：调整抛光垫表面的方法
公开(公告)号：US5081051A
公开(公告)日：1992-01-14
申请号：US581292
申请日：1990-09-12
申请人： Wayne A. Mattingly , Seiichi Morimoto , Spencer E. Preston
发明人： Wayne A. Mattingly , Seiichi Morimoto , Spencer E. Preston
IPC分类号： B24B53/007 , B24B53/017
CPC分类号： B24B53/017
摘要： An improved method for conditioning the surface of a pad for polishing a dielectric layer formed on a semiconductor substrate is disclosed. In one embodiment, the serrated edge of an elongated blade member is first placed in radial contact with the surface of the polishing pad. The table and the pad are then rotated relative to the blade member. At the same time, the blade member is pressed downwardly against the pad surface such that the serrated edge cuts a plurality of substantially circumferential grooves into the pad surface. These grooves are dimensioned so as to facilitate the polishing process by creating point contacts which increases the pad area and allows more slurry to applied to the substrate per unit area. Depending on the type of pad employed, the number of teeth per inch on the serrated edge, the type of slurry used, etc., the downward force applied to the blade member in the rotational speed of the table are optimized to obtain the resultant polishing rate and uniformity desired.
摘要翻译：公开了一种用于调节用于抛光形成在半导体衬底上的电介质层的焊盘表面的改进方法。在一个实施例中，细长叶片构件的锯齿状边缘首先被放置成与抛光垫的表面径向接触。然后桌子和垫子相对于叶片构件旋转。同时，刀片构件被向下压靠在衬垫表面上，使得锯齿形边缘将多个基本上周向的凹槽切割成垫表面。这些槽的尺寸被设计成便于通过产生点接触来促进抛光过程，这增加了焊盘面积，并允许更多的浆料被施加到每单位面积的衬底上。根据所使用的垫的类型，锯齿形边缘上每英寸的齿数，所使用的浆料的类型等，优化了以工作台转速施加到叶片构件的向下的力，以获得所得到的抛光所需的速率和均匀性。

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