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1. 发明授权

US07405419B2 Unidirectionally conductive materials for interconnection 有权
标题翻译：用于互连的单向导电材料
公开(公告)号：US07405419B2
公开(公告)日：2008-07-29
申请号：US11321127
申请日：2005-12-28
申请人： Reza M. Golzarian , Robert P. Meagley , Seiichi Morimoto , Mansour Moinpour
发明人： Reza M. Golzarian , Robert P. Meagley , Seiichi Morimoto , Mansour Moinpour
IPC分类号： H01L47/00 , H01L23/52
CPC分类号： H01L21/76843 , H01L21/76849 , H01L23/53238 , H01L2924/0002 , H01L2924/00
摘要： A method of forming and a device including an interconnect structure having a unidirectional electrical conductive material is described. The unidirectional conductive material may overlie interconnect materials, and/or may surround interconnect materials, such as by lining the walls and base of a trench and via. The unidirectional conductive material may be configured to conduct electricity in a direction corresponding to a projection to or from a contact point and conductive material overlying the unidirectional conductive material, but have no substantial electrical conductivity in other directions. Moreover, the unidirectional conductive material may be electrically conductive in a direction normal to a surface over which it is formed or in directions along or across a plane, but have no substantial electrical conductivity in other directions. Finally, the unidirectional conductive material may have properties tending to reduce metal diffusion, reduce electron migration, provide adhesion or bonding, and/or act as an etch stop.
摘要翻译：描述了一种形成方法和包括具有单向导电材料的互连结构的器件。单向导电材料可以覆盖互连材料，和/或可以围绕互连材料，例如通过衬套沟槽和通孔的壁和底座。单向导电材料可以被配置为在对应于与接触点的突出物相对应的方向上导电，并且覆盖在单向导电材料上方的导电材料，但是在其它方向上没有实质的导电性。此外，单向导电材料可以在垂直于其形成的表面的方向或沿着或跨平面的方向上导电，但在其它方向上不具有实质的导电性。最后，单向导电材料可能具有倾向于减少金属扩散，减少电子迁移，提供粘附或粘结和/或用作蚀刻停止的性质。

2. 发明申请

US20050070096A1 Unidirectionally conductive materials for interconnection 失效
标题翻译：用于互连的单向导电材料
公开(公告)号：US20050070096A1
公开(公告)日：2005-03-31
申请号：US10676294
申请日：2003-09-30
申请人： Reza Golzarian , Robert Meagley , Seiichi Morimoto , Mansour Moinpour
发明人： Reza Golzarian , Robert Meagley , Seiichi Morimoto , Mansour Moinpour
IPC分类号： H01L21/44 , H01L21/4763 , H01L21/768 , H01L23/532
CPC分类号： H01L21/76843 , H01L21/76849 , H01L23/53238 , H01L2924/0002 , H01L2924/00
摘要： A method of forming and a device including an interconnect structure having a unidirectional electrical conductive material is described. The unidirectional conductive material may overlie interconnect materials, and/or may surround interconnect materials, such as by lining the walls and base of a trench and via. The unidirectional conductive material may be configured to conduct electricity in a direction corresponding to a projection to or from a contact point and conductive material overlying the unidirectional conductive material, but have no substantial electrical conductivity in other directions. Moreover, the unidirectional conductive material may be electrically conductive in a direction normal to a surface over which it is formed or in directions along or across a plane, but have no substantial electrical conductivity in other directions. Finally, the unidirectional conductive material may have properties tending to reduce metal diffusion, reduce electron migration, provide adhesion or bonding, and/or act as an etch stop.
摘要翻译：描述了一种形成方法和包括具有单向导电材料的互连结构的器件。单向导电材料可以覆盖互连材料，和/或可以围绕互连材料，例如通过衬套沟槽和通孔的壁和底座。单向导电材料可以被配置为在对应于与接触点的突出物相对应的方向上导电，并且覆盖在单向导电材料上方的导电材料，但是在其它方向上没有实质的导电性。此外，单向导电材料可以在垂直于其形成的表面的方向或沿着或跨平面的方向上导电，但在其它方向上不具有实质的导电性。最后，单向导电材料可能具有倾向于减少金属扩散，减少电子迁移，提供粘附或粘结和/或用作蚀刻停止的性质。

3. 发明授权

US5198732A Rotation control system for ultrasonic motor 失效
标题翻译：超声波电机旋转控制系统
公开(公告)号：US5198732A
公开(公告)日：1993-03-30
申请号：US750453
申请日：1991-08-27
申请人： Seiichi Morimoto
发明人： Seiichi Morimoto
IPC分类号： H01L41/04 , H02N2/14 , H02N2/16
CPC分类号： H02N2/14 , H02N2/142
摘要： A control system for a progressive wave type ultrasonic motor including an ultrasonic motor driver circuit which supplies driving electric power to an ultrasonic motor and a rotary encoder which is coupled with an output shaft of the ultrasonic motor and generates a pulse signal in accordance with rotation of the ultrasonic motor, comprising a reference clock signal generator which generates a clock signal and a phase locked loop circuit which transmits a control signal to an ultrasonic motor driver circuit based on the clock signal and the pulse signal from the rotary encoder, and controlling the speed of the ultrasonic motor; and a control apparatus, comprising a driving control means which transmits a driving signal to an ultrasonic motor driver in accordance with a command pulse instructing to start driving of the ultrasonic motor and transmits a suspension signal to the ultrasonic motor driver in accordance with the pulse signal from the rotary encoder, and driving the ultrasonic motor intermittently. In addition, an automatic frequency stabilizing circuit which may be used by combining with these control apparatus. More stabilized speed control and positioning control of an ultrasonic motor become possible.
摘要翻译：一种用于逐行波型超声波马达的控制系统，包括向超声波马达提供驱动电力的超声波马达驱动电路和与超声波马达的输出轴相连接的旋转编码器，并根据该超声波马达包括产生时钟信号的参考时钟信号发生器和基于时钟信号和来自旋转编码器的脉冲信号将控制信号发送到超声波马达驱动电路的锁相环电路，并控制速度的超声波马达; 以及控制装置，包括驱动控制装置，其根据指示开始驱动超声波马达的指令脉冲将驱动信号发送到超声波马达驱动器，并根据脉冲信号向超声波马达驱动器发送暂停信号并且间歇地驱动超声波马达。另外，可以与这些控制装置组合使用的自动频率稳定电路。可以实现超声波马达的更稳定的速度控制和定位控制。

4. 发明授权

US5104828A Method of planarizing a dielectric formed over a semiconductor substrate 失效
标题翻译：在半导体衬底上形成电介质的方法
公开(公告)号：US5104828A
公开(公告)日：1992-04-14
申请号：US487418
申请日：1990-03-01
申请人： Seiichi Morimoto , Robert J. Patterson
发明人： Seiichi Morimoto , Robert J. Patterson
IPC分类号： H01L21/304 , B24B37/10 , B24B49/14 , B24B55/02 , H01L21/3105 , H01L21/768
CPC分类号： B24B37/107 , B24B49/14 , B24B55/02 , H01L21/31053 , H01L21/76819 , Y10S148/017 , Y10S438/959
摘要： An improved method for planarizing the surface of an dielectric deposited over a semiconductor substrate. The substrate is pressed face down against a table which has been coated with an abrasive material. In this way, the upper surface of the interlayer dielectric contacts the abrasive. Rotational movement of the wafer relative to the table facilitates removal of the protruding portions of the interlayer dielectric by the abrasive. Post-planarization step height variation is minimized by simultaneously cooling the table and the abrasive material during the abrasive or polishing process. By maintaining the table and the abrasive at about 10 degrees Celsius the step height variation is reduced by a factor of 2 over that normally realized in the prior art.
摘要翻译：一种用于平坦化沉积在半导体衬底上的电介质的表面的改进方法。将基板面朝下压靠在已经涂覆有磨料的工作台上。以这种方式，层间电介质的上表面接触磨料。晶片相对于工作台的旋转运动有助于通过磨料去除层间电介质的突出部分。通过在研磨或抛光过程中同时冷却工作台和研磨材料，使平面后台阶高度变化最小化。通过将工作台和磨料保持在约10摄氏度，台阶高度变化比现有技术中通常实现的要高2倍。

5. 发明授权

US4948670A Vinyl chloride resin composition for coating electric wires 失效
标题翻译：用于涂覆电线的氯乙烯树脂组合物
公开(公告)号：US4948670A
公开(公告)日：1990-08-14
申请号：US332434
申请日：1989-03-31
申请人： Seiichi Morimoto , Kazuyuki Shiji , Hisahiro Kusu
发明人： Seiichi Morimoto , Kazuyuki Shiji , Hisahiro Kusu
IPC分类号： C08K5/12 , H01B3/44
CPC分类号： H01B3/443 , C08K5/12 , Y10T428/294 , Y10T428/2967
摘要： A vinyl chloride resin composition for coating electric wires, which comprises 100 parts by weight of a vinyl chloride resin and from 10 to 200 parts by weight of an alkyl biphenyltetracarboxylate.
摘要翻译：一种用于涂覆电线的氯乙烯树脂组合物，其包含100重量份的氯乙烯树脂和10至200重量份的联苯四羧酸烷基酯。

6. 发明授权

US4600477A Method of processing fermented liquid 失效
标题翻译：加工发酵液的方法
公开(公告)号：US4600477A
公开(公告)日：1986-07-15
申请号：US790810
申请日：1985-10-25
申请人： Takehiro Higashi , Michio Kobori , Zenichi Yoshino , Seiichi Morimoto
发明人： Takehiro Higashi , Michio Kobori , Zenichi Yoshino , Seiichi Morimoto
IPC分类号： B01D1/26 , B01D1/28 , B01D3/00 , C12P7/06
CPC分类号： B01D3/001 , B01D1/26 , B01D1/28 , Y02E50/17 , Y10S203/14
摘要： A method of processing fermented liquid comprising(a) feeding said fermented liquid into a vacuum vaporizer, (b) heating the feed in said vaporizer to separate it into a vapor and a concentrated liquid fraction, (c) recycling said vapor to said vaporizer by compression so as to achieve heat-exchange with said feed therein thereby generating a new vapor and a condensate fraction; said condensate being discharged as a distillate, (d) supplying the remaining compressed vapor to a multistage distilling column, (e) separating said compressed vapor into two fractions, one with a higher boiling point than the other, within said distilling column, (f) condensing said distillate with the lower boiling point to yield an alcohol-rich distillate, and (g) discharging said fraction with the higher boiling point as a bottom residue, and a processor therefor, thereby discharging to the outside the low COD-liquid alone and recovering useful substances such as drinkable alcohol, livestocks feed and antibiotic substances.
摘要翻译：一种处理发酵液体的方法，包括（a）将所述发酵液体进料到真空蒸发器中，（b）加热所述蒸发器中的进料以将其分离成蒸气和浓缩液体馏分，（c）将所述蒸气再循环至所述蒸发器压缩以便与所述进料在其中实现热交换，由此产生新的蒸气和冷凝物馏分; 所述冷凝物作为馏出物排出，（d）将剩余的压缩蒸气供应到多级蒸馏塔，（e）在所述蒸馏塔内将所述压缩蒸气分离成沸点高于另一馏分的两个馏分（f ）将所述馏出物冷凝至较低沸点以产生富含醇的馏出物，和（g）以较高沸点排出所述馏分作为底部残留物，以及其处理器，由此将低COD-液体单独排出到外部并回收有用物质如可饮用酒精，牲畜饲料和抗生素物质。

7. 发明授权

US4554255A Determination of sulfurous acid in liquids and an apparatus therefor 失效
标题翻译：液体中亚硫酸的测定及其设备
公开(公告)号：US4554255A
公开(公告)日：1985-11-19
申请号：US511147
申请日：1983-07-06
申请人： Katsuyoshi Ishii , Michio Kobori , Seiichi Morimoto
发明人： Katsuyoshi Ishii , Michio Kobori , Seiichi Morimoto
IPC分类号： G01N27/26 , G01N27/416 , G01N31/16 , G01N33/14 , G01N33/00
CPC分类号： G01N27/4167 , Y10T436/11 , Y10T436/116664 , Y10T436/12 , Y10T436/156666
摘要： A method and an apparatus providing a simple and speedy determination of a slight amount of sulfurous acid contained in liquids by means of pH meters, based on the Modified Rankine's method in principle, and wherein the pH of a first sample of liquid is determined before and after adding an amount of hydrogen peroxide thereto, the pH of a second sample of liquid is determined before and after adding an amount of an acid or lower pH buffer solution thereto, and the concentration of sulfurous acid in the liquid is calculated from the measured pH values and an equation derived from the functional relationship:c=f(.DELTA.pH.sub.A, .DELTA.pH.sub.B)wherein c is the concentration of sulfurous acid.
摘要翻译：原理上基于改良兰金方法，通过pH计简单快速地测定液体中所含的少量亚硫酸，并且其中首先测定第一液体样品的pH，向其中加入过氧化氢之后，在向其中加入一定量的酸或较低pH缓冲溶液之前和之后测定第二液体样品的pH，并从测量的pH计算液体中的亚硫酸浓度值和从功能关系得出的方程式：c = f（DELTA pHA，DELTA pHB）其中c是亚硫酸的浓度。

8. 发明授权

US08334184B2 Polish to remove topography in sacrificial gate layer prior to gate patterning 有权
标题翻译：用于在栅极图案化之前去除牺牲栅极层中的形貌
公开(公告)号：US08334184B2
公开(公告)日：2012-12-18
申请号：US12646450
申请日：2009-12-23
申请人： Joseph M. Steigerwald , Uday Shah , Seiichi Morimoto , Nancy Zelick
发明人： Joseph M. Steigerwald , Uday Shah , Seiichi Morimoto , Nancy Zelick
IPC分类号： H01L21/336 , H01L21/70
CPC分类号： H01L29/66795 , H01L21/28123 , H01L29/66545 , H01L29/785
摘要： Techniques are disclosed for fabricating FinFET transistors (e.g., double-gate, trigate, etc). A sacrificial gate material (such as polysilicon or other suitable material) is deposited on fin structure, and polished to remove topography in the sacrificial gate material layer prior to gate patterning. A flat, topography-free surface (e.g., flatness of 50 nm or better, depending on size of minimum feature being formed) enables subsequent gate patterning and sacrificial gate material opening (via polishing) in a FinFET process flow. Use of the techniques described herein may manifest in structural ways. For instance, a top gate surface is relatively flat (e.g., flatness of 5 to 50 nm, depending on minimum gate height or other minimum feature size) as the gate travels over the fin. Also, a top down inspection of gate lines will generally show no or minimal line edge deviation or perturbation as the line runs over a fin.
摘要翻译：公开了用于制造FinFET晶体管（例如，双栅极，三极管等）的技术。牺牲栅极材料（例如多晶硅或其他合适的材料）沉积在鳍结构上，并且在栅极图案化之前抛光以去除牺牲栅极材料层中的形貌。平坦的，无地形的表面（例如，取决于形成的最小特征的尺寸，平均度为50nm或更好）使得后续的栅极图案化和牺牲栅极材料在FinFET工艺流程中打开（经由抛光）。使用本文描述的技术可以以结构方式表现。例如，当栅极在翅片上行进时，顶栅表面相对平坦（例如，平均度为5至50nm，取决于最小栅极高度或其他最小特征尺寸）。此外，栅极线的自顶向下检查通常将显示没有或最小的线边缘偏离或扰动，因为线在翅片上延伸。

9. 发明授权

US5672095A Elimination of pad conditioning in a chemical mechanical polishing process 失效
标题翻译：在化学机械抛光过程中消除垫调节
公开(公告)号：US5672095A
公开(公告)日：1997-09-30
申请号：US536570
申请日：1995-09-29
申请人： Seiichi Morimoto , Ebrahim Andideh
发明人： Seiichi Morimoto , Ebrahim Andideh
IPC分类号： B24B37/04 , B24B53/00 , B24B1/00
CPC分类号： B24B37/042
摘要： A method and apparatus for polishing a film formed over a semiconductor substrate. The substrate is pressed up against an abrasive pad so that the film contacts the pad. The pad has a diameter which is less than approximately two times a diameter of the substrate. While pressure is applied to the back of the substrate, the pad is rotated with respect to the wafer and an abrasive ceria slurry is introduced onto the pad to polish the film.
摘要翻译：一种用于抛光形成在半导体衬底上的膜的方法和设备。将衬底压靠在研磨垫上，使得膜接触衬垫。焊盘的直径小于基板直径的大约两倍。当压力施加到基板的背面时，垫相对于晶片旋转，并且磨料二氧化铈浆料被引入到垫上以抛光该膜。

10. 发明授权

US5081051A Method for conditioning the surface of a polishing pad 失效
标题翻译：调整抛光垫表面的方法
公开(公告)号：US5081051A
公开(公告)日：1992-01-14
申请号：US581292
申请日：1990-09-12
申请人： Wayne A. Mattingly , Seiichi Morimoto , Spencer E. Preston
发明人： Wayne A. Mattingly , Seiichi Morimoto , Spencer E. Preston
IPC分类号： B24B53/007 , B24B53/017
CPC分类号： B24B53/017
摘要： An improved method for conditioning the surface of a pad for polishing a dielectric layer formed on a semiconductor substrate is disclosed. In one embodiment, the serrated edge of an elongated blade member is first placed in radial contact with the surface of the polishing pad. The table and the pad are then rotated relative to the blade member. At the same time, the blade member is pressed downwardly against the pad surface such that the serrated edge cuts a plurality of substantially circumferential grooves into the pad surface. These grooves are dimensioned so as to facilitate the polishing process by creating point contacts which increases the pad area and allows more slurry to applied to the substrate per unit area. Depending on the type of pad employed, the number of teeth per inch on the serrated edge, the type of slurry used, etc., the downward force applied to the blade member in the rotational speed of the table are optimized to obtain the resultant polishing rate and uniformity desired.
摘要翻译：公开了一种用于调节用于抛光形成在半导体衬底上的电介质层的焊盘表面的改进方法。在一个实施例中，细长叶片构件的锯齿状边缘首先被放置成与抛光垫的表面径向接触。然后桌子和垫子相对于叶片构件旋转。同时，刀片构件被向下压靠在衬垫表面上，使得锯齿形边缘将多个基本上周向的凹槽切割成垫表面。这些槽的尺寸被设计成便于通过产生点接触来促进抛光过程，这增加了焊盘面积，并允许更多的浆料被施加到每单位面积的衬底上。根据所使用的垫的类型，锯齿形边缘上每英寸的齿数，所使用的浆料的类型等，优化了以工作台转速施加到叶片构件的向下的力，以获得所得到的抛光所需的速率和均匀性。

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