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1. 发明授权

US06657864B1 High density thermal solution for direct attach modules 有权
标题翻译：用于直接连接模块的高密度热解决方案
公开(公告)号：US06657864B1
公开(公告)日：2003-12-02
申请号：US10320845
申请日：2002-12-16
申请人： Warren D. Dyckman , Edward R. Pillai , Jeffrey A. Zitz
发明人： Warren D. Dyckman , Edward R. Pillai , Jeffrey A. Zitz
IPC分类号： H05K720
CPC分类号： H01L23/3675 , H01L23/3677 , H01L2224/16225 , H01L2224/32245 , H01L2224/73253 , H01L2924/09701 , H01L2924/1305 , H01L2924/15311 , H01L2924/16152 , H01L2924/3025 , H01L2924/00
摘要： A high power density thermal packaging solution. A highly efficient thermal path is provided using a lid of a unique design configuration that connects the chip back-side to both a heat sink and thermally conductive substrate vias thus establishing two thermal paths to carry heat from the die. The thermal interface between the chip back-side to lid and lid-to-substrate is enhanced with a thermally conductive elastomer. The heat is conducted through the substrate through thermal vias that are added to the perimeter of the substrate or which may be configured from preexisting electrical shielding structures that connect the top surface of the substrate to the bottom of the package. The bottom surface connection then conducts the heat to a copper ground plane in the printed circuit card. The heat from the die to the heat sink is transferred in the conventional method using the thin layer of thermally conductive elastomer to complete the thermal path from chip to lid to heat sink.
摘要翻译：高功率密度热封装解决方案。使用独特设计结构的盖子提供了高效的热路径，该盖子将芯片背面连接到散热片和导热基板通孔，从而建立两个热路径以从模具携带热量。利用导热弹性体，芯片后侧与盖与盖到基板之间的热界面得到增强。加热通过加热通孔的热通道穿过衬底，该通孔可以加到衬底的周边上，或者可以由将衬底的顶表面连接到封装的底部的预先存在的电屏蔽结构构成。底面连接然后将热量传导到印刷电路卡中的铜接地平面。使用导热弹性体薄层，以常规方法转移从模具到散热器的热量，以完成从芯片到盖子到散热片的热路径。

2. 发明授权

US08693200B2 Semiconductor device cooling module 有权
标题翻译：半导体器件冷却模块
公开(公告)号：US08693200B2
公开(公告)日：2014-04-08
申请号：US13368031
申请日：2012-02-07
申请人： Evan G. Colgan , Michael A. Gaynes , Jeffrey A. Zitz
发明人： Evan G. Colgan , Michael A. Gaynes , Jeffrey A. Zitz
IPC分类号： H05K7/20
CPC分类号： H01L23/4093 , H01L2924/0002 , H01L2924/00
摘要： A cooling module for cooling a semiconductor is provided and includes a land grid array (LGA) interposer, a substrate with an LGA side and a chip side, a cooler, a load frame attached to the substrate and formed to define an aperture in which the cooler is removably disposable, a spring clamp removably attachable to the load frame and configured to apply force from the load frame to the cooler such that the substrate and the cooler are urged together about the semiconductor and a load assembly device configured to urge the load frame and the LGA interposer together.
摘要翻译：提供了一种用于冷却半导体的冷却模块，其包括平台栅格阵列（LGA）插入器，具有LGA侧和芯片侧的衬底，冷却器，附接到衬底并形成以限定孔径的负载框架冷却器可拆卸地是一次性的，弹簧夹可移除地附接到负载框架并且构造成将力从负载框架施加到冷却器，使得衬底和冷却器围绕半导体被一起被推动在一起;以及负载组件装置，其构造成推动负载框架和LGA插入器在一起。

3. 发明授权

US08445331B2 Multichip electronic packages and methods of manufacture 失效
公开(公告)号：US08445331B2
公开(公告)日：2013-05-21
申请号：US13433468
申请日：2012-03-29
申请人： Suresh D. Kadakia , Kamal K. Sikka , Hilton T. Toy , Jeffrey A. Zitz
发明人： Suresh D. Kadakia , Kamal K. Sikka , Hilton T. Toy , Jeffrey A. Zitz
IPC分类号： H01L21/44
CPC分类号： H01L21/50 , H01L23/04 , H01L23/10 , H01L23/433 , H01L23/4338 , H01L2924/0002 , H01L2924/00
摘要： A multi-chip electronic package and methods of manufacture are provided. The multi-chip package includes a plurality of chips mounted on a chip carrier. The multi-chip package further includes a lid mounted on the chip carrier using a bonding material or compression seal, and at least one single piston extending from the lid. Each piston covers an entirety of multiple chips of the plurality of chips.

4. 发明申请

US20120326294A1 MULTICHIP ELECTRONIC PACKAGES AND METHODS OF MANUFACTURE 失效
标题翻译： MULTICHIP电子包装及其制造方法
公开(公告)号：US20120326294A1
公开(公告)日：2012-12-27
申请号：US13169394
申请日：2011-06-27
申请人： KAMAL K. SIKKA , Hilton T. Toy , Krishna R. Tunga , Jeffrey A. Zitz
发明人： KAMAL K. SIKKA , Hilton T. Toy , Krishna R. Tunga , Jeffrey A. Zitz
IPC分类号： H01L23/12 , H01L21/60
CPC分类号： H01L23/04 , H01L21/50 , H01L23/10 , H01L23/562 , H01L24/32 , H01L24/83 , H01L2224/32245 , H01L2224/83191 , H01L2924/01322 , H01L2924/16251 , H01L2924/164 , H01L2924/166 , H01L2924/00
摘要： A multi-chip electronic package and methods of manufacture are provided. The method comprises adjusting a piston position of one or more pistons with respect to one or more chips on a chip carrier. The adjusting comprises placing a chip shim on the chips and placing a seal shim between a lid and the chip carrier. The seal shim is thicker than the chip shim. The adjusting further comprise lowering the lid until the pistons contact the chip shim. The method further comprises separating the lid and the chip carrier and removing the chip shim and the seal shim. The method further comprises dispensing thermal interface material on the chips and lowering the lid until a gap filled with the thermal interface material is about a particle size of the thermal interface material. The method further comprises sealing the lid to the chip carrier with sealant.
摘要翻译：提供了一种多芯片电子封装及其制造方法。该方法包括相对于芯片载体上的一个或多个芯片来调节一个或多个活塞的活塞位置。该调整包括将芯片垫片放置在芯片上并将密封垫片放置在盖子和芯片载体之间。密封垫片比芯片垫片厚。调节还包括降低盖直到活塞接触芯片垫片。该方法还包括分离盖子和芯片载体并移除芯片垫片和密封垫片。该方法还包括将热界面材料分配在芯片上并降低盖子，直到填充有热界面材料的间隙大约为热界面材料的粒度。该方法还包括用密封剂将盖子密封到芯片载体上。

5. 发明申请

US20080123311A1 IC CHIP PACKAGE HAVING FORCE-ADJUSTABLE MEMBER BETWEEN STIFFENER AND PRINTED CIRCUIT BOARD 失效
标题翻译：具有强化器和印刷电路板之间的可调节成员的IC芯片包
公开(公告)号：US20080123311A1
公开(公告)日：2008-05-29
申请号：US11470434
申请日：2006-09-06
申请人： Lewis S. Goldmann , Jeffrey A. Zitz
发明人： Lewis S. Goldmann , Jeffrey A. Zitz
IPC分类号： H05K7/00 , H05K3/00
CPC分类号： H05K3/325 , H05K1/0271 , H05K3/0061 , H05K2201/10409 , H05K2201/10719 , H05K2201/10734 , H05K2201/2009 , Y10T29/49124
摘要： An IC chip package and related method are disclosed. The IC chip package may include a printed circuit board (PCB) coupled to a chip carrier by a land grid array (LGA) connector; a metal stiffener including at least one force-adjustable member contacting an underside of the PCB; and at least two couplers for coupling the metal stiffener to a lid or a heat sink, with the PCB, the chip carrier and the LGA connector therebetween. The force-adjustable member reduces the required assembly forces and accommodates natural and non-systematic out-of flatness tolerances of the PCB and the chip carrier.
摘要翻译：公开了一种IC芯片封装及相关方法。 IC芯片封装可以包括通过平面栅格阵列（LGA）连接器耦合到芯片载体的印刷电路板（PCB）; 金属加强件，其包括接触PCB底面的至少一个力可调节构件; 以及用于将金属加强件耦合到盖或散热器的至少两个耦合器，其中PCB，芯片载体和LGA连接器在其间。力可调节构件减小了所需的组装力并且适应PCB和芯片载体的自然和非系统的平坦度公差。

6. 发明申请

US20120080784A1 MULTICHIP ELECTRONIC PACKAGES AND METHODS OF MANUFACTURE 失效
公开(公告)号：US20120080784A1
公开(公告)日：2012-04-05
申请号：US12897933
申请日：2010-10-05
申请人： SURESH D. KADAKIA , Kamal K. Sikka , Hilton T. Toy , Jeffrey A. Zitz
发明人： SURESH D. KADAKIA , Kamal K. Sikka , Hilton T. Toy , Jeffrey A. Zitz
IPC分类号： H01L23/04 , H01L21/50
CPC分类号： H01L21/50 , H01L23/04 , H01L23/10 , H01L23/433 , H01L23/4338 , H01L2924/0002 , H01L2924/00
摘要： A multi-chip electronic package and methods of manufacture are provided. The multi-chip package includes a plurality of chips mounted on a chip carrier. The multi-chip package further includes a lid mounted on the chip carrier using a bonding material or compression seal, and at least one single piston extending from the lid. Each piston covers an entirety of multiple chips of the plurality of chips.

7. 发明授权

US07250576B2 Chip package having chip extension and method 失效
标题翻译：芯片封装具有芯片扩展和方法
公开(公告)号：US07250576B2
公开(公告)日：2007-07-31
申请号：US10908615
申请日：2005-05-19
申请人： Evan G. Colgan , David L. Edwards , Benjamin V. Fasano , Kamal K. Sikka , Jeffrey A. Zitz , Wei Zou
发明人： Evan G. Colgan , David L. Edwards , Benjamin V. Fasano , Kamal K. Sikka , Jeffrey A. Zitz , Wei Zou
IPC分类号： H05K1/16
CPC分类号： H01L23/04 , H01L23/3675 , H01L23/433 , H01L24/31 , H01L2224/16225 , H01L2224/27013 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2224/83051 , H01L2224/83102 , H01L2224/92125 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01047 , H01L2924/01074 , H01L2924/15311 , H01L2924/16152 , H01L2924/16195 , H01L2924/00 , H01L2924/00012 , H01L2224/0401
摘要： A chip package including a chip extension for containing thermal interface material (TIM) and improves chip cooling, and a related method, are disclosed. In particular, the chip package includes a chip, a cooling structure coupled to the chip via a TIM, and a chip extension may be thermally coupled to an outer edge of the chip. A TIM placed between the chip and the cooling structure is contained during thermal cycling by the chip extension such that void formation at the edge of the chip, which can move between the chip and cooling structure, is suppressed. The chip extension also improves lateral heat dissipation by providing a greater thermal contact area between the cooling structure and the chip and, if needed, the substrate at a much lower cost than using larger die with lower production unit output from a wafer.
摘要翻译：公开了一种包括用于包含热界面材料（TIM）并提高芯片冷却的芯片延伸的芯片封装以及相关方法。特别地，芯片封装包括芯片，经由TIM耦合到芯片的冷却结构，并且芯片延伸部可热耦合到芯片的外边缘。放置在芯片和冷却结构之间的TIM被芯片延伸部的热循环期间包含，从而可以抑制可在芯片和冷却结构之间移动的芯片边缘处的空隙形成。芯片延伸还通过在冷却结构和芯片之间提供更大的热接触面积，并且如果需要，以比使用具有较低的晶片生产单位输出的较大模具的成本低得多的成本来改善侧向散热。

8. 发明授权

US06955543B2 Method and apparatus to form a reworkable seal on an electronic module 失效
标题翻译：在电子模块上形成可再加工密封件的方法和装置
公开(公告)号：US06955543B2
公开(公告)日：2005-10-18
申请号：US10604695
申请日：2003-08-11
申请人： Gaetano P. Messina , Patrick A. Coico , Lewis S. Goldmann , Richard F. Indyk , Vladimir Jambrih , Jeffrey A. Zitz
发明人： Gaetano P. Messina , Patrick A. Coico , Lewis S. Goldmann , Richard F. Indyk , Vladimir Jambrih , Jeffrey A. Zitz
IPC分类号： H01L21/50 , H01R12/00
CPC分类号： H01L21/50
摘要： A system and method to form a reworkable compression seal between an electronic module and a cap are disclosed. The system and method include an electronic module having a tapered edge configured on at least a portion of the edge defining a perimeter of the electronic module and the cap configured with an opening to receive the electronic module therein. A compression seal is disposed with the cap and is configured to surround one or more chips or other electronic components on the electronic module to form a seal between the electronic module and the cap. A plurality of side loaders are operably coupled to the cap and aligned to receive the tapered edge on the electronic module. Each side loader is configured to engage the tapered edge and provide sufficient compressive force to the compression seal disposed between the electronic module and the cap.
摘要翻译：公开了一种在电子模块和盖子之间形成可再加工的压缩密封的系统和方法。该系统和方法包括具有锥形边缘的电子模块，该锥形边缘被配置在限定电子模块的周边的边缘的至少一部分上，并且帽被配置有用于在其中接收电子模块的开口。压缩密封件与盖一起设置并且被配置为围绕电子模块上的一个或多个芯片或其它电子部件，以在电子模块和盖之间形成密封。多个侧装载器可操作地联接到盖并对准以接收电子模块上的锥形边缘。每个侧装载器构造成接合锥形边缘并且向设置在电子模块和盖之间的压缩密封件提供足够的压缩力。

9. 发明授权

US5533256A Method for directly joining a chip to a heat sink 失效
标题翻译：将芯片直接连接到散热片的方法
公开(公告)号：US5533256A
公开(公告)日：1996-07-09
申请号：US461814
申请日：1995-06-05
申请人： Anson J. Call , Stephen H. Meisner , Frank L. Pompeo , Jeffrey A. Zitz
发明人： Anson J. Call , Stephen H. Meisner , Frank L. Pompeo , Jeffrey A. Zitz
IPC分类号： H01L23/40 , H01L21/58 , H01L23/367 , H01L23/42 , H01L23/498 , H01L23/64 , H05K3/34
CPC分类号： H01L24/83 , H01L23/3675 , H01L23/42 , H01L23/49816 , H01L23/642 , H01L24/29 , H01L2224/16225 , H01L2224/2919 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2224/8319 , H01L2224/8385 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/0102 , H01L2924/01033 , H01L2924/01039 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/14 , H01L2924/15311 , H01L2924/15312 , H01L2924/16152 , H01L2924/16315 , H01L2924/19041 , H01L2924/19105 , Y10T29/49144
摘要： The present invention relates generally to a new apparatus and method for directly joining a chip to a heat sink. More particularly, the invention encompasses an apparatus and a method that uses a double-sided, pressure-sensitive, thermally-conductive adhesive tape to directly join a chip or similar such device to a heat sink.
摘要翻译：本发明一般涉及将芯片直接连接到散热器的新装置和方法。更具体地说，本发明包括一种使用双面，压敏导热胶粘带直接将芯片或类似的装置连接到散热器的装置和方法。

10. 发明授权

US09105500B2 Non-hermetic sealed multi-chip module package 有权
标题翻译：非密封多芯片模块封装
公开(公告)号：US09105500B2
公开(公告)日：2015-08-11
申请号：US13548232
申请日：2012-07-13
申请人： Paul F. Bodenweber , Hilton T. Toy , Krishna R. Tunga , Jeffrey A. Zitz
发明人： Paul F. Bodenweber , Hilton T. Toy , Krishna R. Tunga , Jeffrey A. Zitz
IPC分类号： H05K5/02 , H01L23/10 , H01L21/50 , H01L23/40
CPC分类号： H01L23/10 , H01L21/50 , H01L23/40 , H01L2924/0002 , Y10T29/49822 , H01L2924/00
摘要： A multi-chip module (MCM) package is provided and includes a substrate and a hat assembly. The substrate includes a surface on which chips of the MCM are re-workable. The hat assembly is configured to be non-hermetically sealed to the substrate. The hat assembly and the substrate are configured for tension-type disassembly in a dimension oriented substantially normally with respect to a plane of the substrate surface.
摘要翻译：提供了多芯片模块（MCM）封装并且包括基板和帽子组件。基板包括MCM的芯片可再生的表面。帽子组件被配置为非气密地密封到基底。帽子组件和基底被构造成用于基本上相对于衬底表面的平面定向的尺寸的张力型拆卸。

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