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1. 发明授权

US06955543B2 Method and apparatus to form a reworkable seal on an electronic module 失效
标题翻译：在电子模块上形成可再加工密封件的方法和装置
公开(公告)号：US06955543B2
公开(公告)日：2005-10-18
申请号：US10604695
申请日：2003-08-11
申请人： Gaetano P. Messina , Patrick A. Coico , Lewis S. Goldmann , Richard F. Indyk , Vladimir Jambrih , Jeffrey A. Zitz
发明人： Gaetano P. Messina , Patrick A. Coico , Lewis S. Goldmann , Richard F. Indyk , Vladimir Jambrih , Jeffrey A. Zitz
IPC分类号： H01L21/50 , H01R12/00
CPC分类号： H01L21/50
摘要： A system and method to form a reworkable compression seal between an electronic module and a cap are disclosed. The system and method include an electronic module having a tapered edge configured on at least a portion of the edge defining a perimeter of the electronic module and the cap configured with an opening to receive the electronic module therein. A compression seal is disposed with the cap and is configured to surround one or more chips or other electronic components on the electronic module to form a seal between the electronic module and the cap. A plurality of side loaders are operably coupled to the cap and aligned to receive the tapered edge on the electronic module. Each side loader is configured to engage the tapered edge and provide sufficient compressive force to the compression seal disposed between the electronic module and the cap.
摘要翻译：公开了一种在电子模块和盖子之间形成可再加工的压缩密封的系统和方法。该系统和方法包括具有锥形边缘的电子模块，该锥形边缘被配置在限定电子模块的周边的边缘的至少一部分上，并且帽被配置有用于在其中接收电子模块的开口。压缩密封件与盖一起设置并且被配置为围绕电子模块上的一个或多个芯片或其它电子部件，以在电子模块和盖之间形成密封。多个侧装载器可操作地联接到盖并对准以接收电子模块上的锥形边缘。每个侧装载器构造成接合锥形边缘并且向设置在电子模块和盖之间的压缩密封件提供足够的压缩力。

2. 发明授权

US6049456A Electronic module adjustment design and process using shims 有权
标题翻译：电子模块调整设计和使用垫片的过程
公开(公告)号：US6049456A
公开(公告)日：2000-04-11
申请号：US152904
申请日：1998-09-14
申请人： Gaetano P. Messina , Armando S. Cammarano , Patrick A. Coico , Ronald L. Hering , Eric B. Hultmark , Raed A. Sherif
发明人： Gaetano P. Messina , Armando S. Cammarano , Patrick A. Coico , Ronald L. Hering , Eric B. Hultmark , Raed A. Sherif
IPC分类号： H01L23/40 , H05K7/20
CPC分类号： H01L23/4006 , H01L2023/405 , H01L2023/4087 , H01L2924/0002 , H01L2924/09701
摘要： A thermal conduction module for cooling one or more integrated circuit chips mounted on a substrate is described. At least one shim is disposed between the base plate and the cover plate of the module to establish a predetermined dimension between the cover plate and the integrated circuit chips mounted on the substrate for insertion of a thermal paste. The shims may be metal, engineered plastic, or thermally and electrically conductive or nonconductive creep resistant materials able to withstand the stress and load within the module over time. The shim may be a plurality of shims having the same thickness or a plurality of shims having a multiplicity of thicknesses. Most preferably, the shim conforms to the periphery of the cover plate or base plate. A method of determining the proper shim thickness is also described wherein an initial reading of the thickness of the cover plate and base plate of the module is obtained. A second reading of the thickness of the module is obtained after the substrate, mounted with at least one integrated circuit chip, is placed onto the base plate followed by a temporary spacer and the cover plate. One or more shims are selected which are equal to the difference between the initial reading and the second reading. The cover plate is removed and the spacer is replaced with the appropriate shim. The cover plate is then fastened to the base plate. Also described is a kit for fixing the thermal paste gap dimension in electronic modules comprising a base plate, cover plate, and a plurality of shims having a multiplicity of thicknesses.
摘要翻译：描述了用于冷却安装在基板上的一个或多个集成电路芯片的热传导模块。在基板和模块的盖板之间设置至少一个垫片，以在盖板和安装在基板上的用于插入热粘贴的集成电路芯片之间建立预定尺寸。垫片可以是金属，工程塑料，或导热或非导电的抗蠕变材料，能够经受住模块内的应力和负荷。垫片可以是具有相同厚度的多个垫片或具有多个厚度的多个垫片。最优选地，垫片符合盖板或底板的周边。还描述了确定适当垫片厚度的方法，其中获得了模块的盖板和基板的厚度的初始读数。在安装有至少一个集成电路芯片的基板被放置在基板上，之后是临时间隔件和盖板之后，获得模块厚度的二读。选择一个或多个垫片，其等于初始读数和第二读数之间的差。拆下盖板，并用适当的垫片更换垫片。然后将盖板固定在基板上。还描述了一种用于将热糊料间隙尺寸固定在包括基板，盖板和多个厚度的多个垫片的电子模块中的套件。

3. 发明授权

US5623394A Apparatus for cooling of chips using a plurality of customized thermally conductive materials 失效
标题翻译：使用多种定制导热材料冷却芯片的装置
公开(公告)号：US5623394A
公开(公告)日：1997-04-22
申请号：US690883
申请日：1996-08-02
申请人： Raed A. Sherif , Mark G. Courtney , David L. Edwards , Albert J. Fahey , Gregory S. Hopper , Sushumna Iruvanti , Charles F. Jones , Gaetano P. Messina
发明人： Raed A. Sherif , Mark G. Courtney , David L. Edwards , Albert J. Fahey , Gregory S. Hopper , Sushumna Iruvanti , Charles F. Jones , Gaetano P. Messina
IPC分类号： H01L23/373 , H01L23/42 , H01L23/64 , H01L25/065 , H05K7/20
CPC分类号： H01L24/32 , H01L23/3737 , H01L23/42 , H01L23/642 , H01L25/0655 , H01L2224/16225 , H01L2224/16227 , H01L2224/27013 , H01L2224/32245 , H01L2224/73253 , H01L2224/73257 , H01L2224/83051 , H01L2224/83385 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01033 , H01L2924/01075 , H01L2924/14 , H01L2924/16152 , H01L2924/19041 , Y10T29/49144
摘要： The present invention relates generally to a new apparatus and method for customized cooling of chips using a plurality of thermally conductive materials. More particularly, the invention encompasses an apparatus and a method that provides customized cooling of a MCM (Multi-Chip Module) by using a plurality of thermally conductive materials.
摘要翻译：本发明一般涉及使用多种导热材料定制冷却芯片的新设备和方法。更具体地，本发明包括通过使用多种导热材料提供MCM（多芯片模块）的定制冷却的装置和方法。

4. 发明授权

US5228502A Cooling by use of multiple parallel convective surfaces 失效
标题翻译：通过使用多个平行的对流表面进行冷却
公开(公告)号：US5228502A
公开(公告)日：1993-07-20
申请号：US754855
申请日：1991-09-04
申请人： Richard C. Chu , Gary F. Goth , Gaetano P. Messina , Kevin P. Moran , Michael L. Zumbrunnen
发明人： Richard C. Chu , Gary F. Goth , Gaetano P. Messina , Kevin P. Moran , Michael L. Zumbrunnen
IPC分类号： H01L23/433
CPC分类号： H01L23/4338 , H01L23/4336 , H01L2224/16 , H01L2924/3011 , Y10S165/908
摘要： An improved electronic cooling module having thermally optimized and fully integrated vertical water channels located between pistons. The water channels include directed jets matched to the piston localized performance and an inner tube locally attached to the channel hole providing parallel convective surfaces.
摘要翻译：一种改进的电子冷却模块，其具有位于活塞之间的热优化和完全集成的垂直水通道。水通道包括与活塞局部性能相匹配的定向喷嘴和局部附接到通道孔的内管，其提供平行的对流表面。

5. 发明授权

US06404638B1 Small gaps cooling technology 失效
标题翻译：小间隙冷却技术
公开(公告)号：US06404638B1
公开(公告)日：2002-06-11
申请号：US09727164
申请日：2000-11-30
申请人： Gaetano P. Messina
发明人： Gaetano P. Messina
IPC分类号： H05K720
CPC分类号： H01L23/4338 , H01L2924/0002 , H01L2924/09701 , H01L2924/00
摘要： The present invention provides a thermal conduction module assembly kit comprising a base being substantially planar in shape and adapted to receive on a top surface a substrate adapted to receive at least one integrated circuit having top and bottom surfaces. A cover is substantially rectangular, having top and bottom surfaces and an outer edge surface. The cover is designed to mate with the substrate such that the integrated circuit is positioned between the bottom surface of the cover and the top surface of the substrate. A removable shim member is planar in shape and has a definable vertical dimension positioned between the bottom surface of the cover and the top surface of the integrated circuit to provide a specified dimension between the top surface of the integrated circuit and the bottom surface of the cover. A positioning member has top, bottom, and inner surfaces, and is substantially circular. The inner surface of the positioning member is positioned to circumscribe and movably mate with the outside surface of the cover. The inner surface of the positioning member is affixable to the outer edge surface of the cover, and the bottom surface of the positioning member is contactable with the top surface of the substrate. The affixable inner surface of the spacer, and the bottom surface of the affixable positioning member, are capable of maintaining the vertical dimension between the bottom surface of the cover and the top surface of the integrated circuit defined by the specified vertical dimension of the shim member, and define a gap of the same specified vertical dimension after the removable shim member is removed. The gap substantially receives a thermally conductive medium.
摘要翻译：本发明提供了一种导热模块组装套件，其包括基本上基本上是平面的基部，并且适于在顶表面上容纳适于接纳至少一个具有顶表面和底表面的集成电路的衬底。盖子基本上是矩形的，具有顶表面和底表面以及外边缘表面。盖被设计成与基板配合，使得集成电路位于盖的底表面和基板的顶表面之间。可拆卸的垫片构件是平面的，并且具有定位在盖的底表面和集成电路的顶表面之间的垂直尺寸，以在集成电路的顶表面和盖的底表面之间提供特定的尺寸。定位构件具有顶部，底部和内部表面，并且基本上是圆形的。定位构件的内表面被定位成围绕并移动地与盖的外表面配合。定位构件的内表面可与盖的外边缘表面贴合，并且定位构件的底表面可与衬底的顶表面接触。间隔件的可固定内表面和可固定定位构件的底表面能够保持盖的底表面与由垫片构件的指定垂直尺寸限定的集成电路的顶表面之间的垂直尺寸并且在移除可拆卸的垫片构件之后定义相同的指定垂直尺寸的间隙。间隙基本上接收导热介质。

6. 发明授权

US5604978A Method for cooling of chips using a plurality of materials 失效
标题翻译：使用多种材料冷却芯片的方法
公开(公告)号：US5604978A
公开(公告)日：1997-02-25
申请号：US455463
申请日：1995-05-31
申请人： Raed A. Sherif , Mark G. Courtney , David L. Edwards , Albert J. Fahey , Gregory S. Hopper , Sushumna Iruvanti , Charles F. Jones , Gaetano P. Messina
发明人： Raed A. Sherif , Mark G. Courtney , David L. Edwards , Albert J. Fahey , Gregory S. Hopper , Sushumna Iruvanti , Charles F. Jones , Gaetano P. Messina
IPC分类号： H01L23/373 , H01L23/42 , H01L23/64 , H01L25/065 , H05K3/34
CPC分类号： H01L24/32 , H01L23/3737 , H01L23/42 , H01L23/642 , H01L25/0655 , H01L2224/16225 , H01L2224/16227 , H01L2224/27013 , H01L2224/32245 , H01L2224/73253 , H01L2224/73257 , H01L2224/83051 , H01L2224/83385 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01033 , H01L2924/01075 , H01L2924/14 , H01L2924/16152 , H01L2924/19041 , Y10T29/49144
摘要： The present invention relates generally to a new apparatus and method for customized cooling of chips using a plurality of thermally conductive materials. More particularly, the invention encompasses an apparatus and a method that provides customized cooling of a MCM (Multi-Chip Module) by using a plurality of thermally conductive materials.
摘要翻译：本发明一般涉及使用多种导热材料定制冷却芯片的新设备和方法。更具体地，本发明包括通过使用多种导热材料提供MCM（多芯片模块）的定制冷却的装置和方法。

7. 发明授权

US5517753A Adjustable spacer for flat plate cooling applications 失效
标题翻译：用于平板冷却应用的可调间隔件
公开(公告)号：US5517753A
公开(公告)日：1996-05-21
申请号：US418644
申请日：1995-04-06
申请人： Gaetano P. Messina
发明人： Gaetano P. Messina
IPC分类号： H01L23/40 , H05K3/30
CPC分类号： H01L23/4006 , H01L2023/4043 , H01L2023/4081 , H01L2924/0002 , H01L2924/09701 , Y10T29/4913 , Y10T29/49146
摘要： A thermal conduction module comprises a base plate for holding a chip substrate, an integrated circuit chip substrate mounted in the base plate and a cover plate having a surface facing the chip substrate. A movable spacer is secured adjacent to the periphery of the cover plate or the base plate, and is adjustable to a predetermined distance away from the cover plate or base plate. A gap for insertion of a thermally conductive paste may be created between chips mounted on the substrate and the cover plate surface facing the chip substrate by adjustment of the spacer to a desired distance from the cover plate or base plate.
摘要翻译：热传导模块包括用于保持芯片基板的基板，安装在基板中的集成电路芯片基板和具有面向芯片基板的表面的盖板。靠近盖板或基板的周边固定可移动的间隔件，并且可调整至距盖板或底板预定的距离。通过将间隔物调整到与盖板或基板所需的距离，可以在安装在基板上的芯片和面向芯片基板的盖板表面之间产生用于插入导热浆料的间隙。

8. 发明授权

US5239443A Blind hole cold plate cooling system 失效
标题翻译：盲孔冷板冷却系统
公开(公告)号：US5239443A
公开(公告)日：1993-08-24
申请号：US872567
申请日：1992-04-23
申请人： Albert J. Fahey , Gaetano P. Messina , John B. Pavelka , Raed A. Sherif
发明人： Albert J. Fahey , Gaetano P. Messina , John B. Pavelka , Raed A. Sherif
IPC分类号： H01L23/473
CPC分类号： H01L23/4735 , H01L2924/0002 , Y10S165/908
摘要： Disclosed is a blind hole cold plate cooling system including:a fluid inlet manifold having at least one jet nozzle;a heat transfer plate having a first and second principal surface, the first principal surface having a complementary cavity for receiving the jet nozzle, the second principal surface being planar for contact with at least one heat generatinq device; andan annular gap defined by the outer periphery of jet nozzle and the surface of the complementary cavity.
摘要翻译：盲孔冷板冷却系统包括：具有至少一个喷嘴的流体入口歧管; 具有第一和第二主表面的传热板，所述第一主表面具有用于接收喷射喷嘴的互补空腔，所述第二主表面是平面的，用于与至少一个热发生装置接触; 以及由喷嘴的外围和互补腔的表面限定的环形间隙。

9. 发明授权

US5239200A Apparatus for cooling integrated circuit chips 失效
标题翻译：集成电路芯片冷却装置
公开(公告)号：US5239200A
公开(公告)日：1993-08-24
申请号：US748004
申请日：1991-08-21
申请人： Gaetano P. Messina , Robert A. Brewster , Theodore J. Kara , Seaho Song
发明人： Gaetano P. Messina , Robert A. Brewster , Theodore J. Kara , Seaho Song
IPC分类号： H01L23/473
CPC分类号： H01L23/473 , F28F13/06 , F28F3/12 , H01L2224/16
摘要： An apparatus for cooling an array of integrated circuit chips mounted on a substrate comprises a thermally conductive cooling plate which has a plurality of integral, substantially parallel, closed-end channels. A cover which may be made of plastic is adapted to seal the periphery of the cooling member and is spaced from the channel-containing surface. The cover has a plurality of integral baffles extending toward the cooling member into and along the length of the channels. The baffles and the channels are spaced from each other to permit passage of a coolant between and through the channels in a flow direction normal to the channels. An inlet and outlet for the coolant are provided on opposite ends of the apparatus, and may be located in the cover. In an alternate embodiment, the cooling plate contains at least two sets of the channels, each set of channels receiving a separate flow of coolant, either in parallel or in series with each other.
摘要翻译：用于冷却安装在基板上的集成电路芯片的阵列的装置包括具有多个整体的，基本上平行的封闭端通道的导热冷却板。可以由塑料制成的盖适于密封冷却构件的周边并且与通道容纳表面间隔开。盖具有多个整体挡板，其朝向冷却构件延伸并沿着通道的长度延伸。挡板和通道彼此间隔开，以允许冷却剂在垂直于通道的流动方向上通过通道。用于冷却剂的入口和出口设置在设备的相对端上，并且可以位于盖中。在替代实施例中，冷却板包含至少两组通道，每组通道接收单独的冷却剂流，或者彼此平行或串联。

10. 发明授权

US06778393B2 Cooling device with multiple compliant elements 失效
标题翻译：具有多个兼容元件的冷却装置
公开(公告)号：US06778393B2
公开(公告)日：2004-08-17
申请号：US10308225
申请日：2002-12-02
申请人： Gaetano P. Messina , Lawrence S. Mok , Tsorng-Dih Yuan
发明人： Gaetano P. Messina , Lawrence S. Mok , Tsorng-Dih Yuan
IPC分类号： H05K720
CPC分类号： H01L23/4338 , H01L2924/0002 , H01L2924/00
摘要： A cooling device having a common cooling distribution unit with multiple compliant cooling elements. Mechanisms are built in to ensure the cooling elements are in good thermal contact with heat generating semiconductor chips of different heights and sizes on a common carrier. The cooling distribution unit has protection structures to prevent the leakage of coolant from the unit. Further reduction of the risk of accidental coolant leakage is provided with the onboard storage of coolant absorbent materials in the coolant distribution unit. The cooling elements have serpentine coolant channels to enhanced the cooling capacity. The compliance of the cooling elements can also be achieved by using concentric tubing to connect the coolant distribution unit to cooling heads on the cooling elements.
摘要翻译：一种冷却装置，具有具有多个顺应冷却元件的公共冷却分配单元。内置机构以确保冷却元件与公共载体上不同高度和大小的发热半导体芯片良好的热接触。冷却分配单元具有防止冷却液从单元泄漏的保护结构。通过冷却剂吸收材料在冷却剂分配单元中的机载存储来提供意外冷却剂泄漏的风险的进一步降低。冷却元件具有蛇形冷却剂通道，以增强冷却能力。冷却元件的顺应性也可以通过使用同心管将冷却剂分配单元连接到冷却元件上的冷却头来实现。

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