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1. 发明授权

US5711271A Throttle apparatus for an internal combustion engine 失效
标题翻译：内燃机油门装置
公开(公告)号：US5711271A
公开(公告)日：1998-01-27
申请号：US765253
申请日：1997-02-12
申请人： Walter Schlagmueller , Gerhard Schellenberg , Thomas Wiesa , Rolf Litzinger , Harald Laue , Jurgen Rottler , Ralph Schimitzek , Peter Jauernig
发明人： Walter Schlagmueller , Gerhard Schellenberg , Thomas Wiesa , Rolf Litzinger , Harald Laue , Jurgen Rottler , Ralph Schimitzek , Peter Jauernig
IPC分类号： F02D9/02 , F02D9/10 , F02D11/10 , F02D35/00 , F02M69/32 , F02M3/00
CPC分类号： F02D11/10 , F02D9/10 , F02D9/1065 , F02D2009/0294 , F02D2400/18 , F02D9/107
摘要： Electronic engine control systems have a plurality of individual components on the intake tube, some of them located relatively far from one another. For electrically connecting the individual components to the electronic control unit, relatively long electric connecting lines and a relatively large number of plug connections are therefore necessary. This invention sets forth a preassembled throttle apparatus which includes at least one throttle device, rotatably accommodated in a throttle valve support, and an idling adjuster in a housing; the throttle apparatus has a bypass conduit, which bypasses the throttle device and which can be varied by the idling adjuster, into which a regeneration valve can output fuel, the regeneration valve being triggerable by an electronic control unit that is also accommodated in the housing. The throttle apparatus of the invention is intended particularly for mixture-compressing internal combustion engines with externally supplied ignition.
摘要翻译： PCT No.PCT / DE96 / 00394 Sec。 371日期1997年2月12日 102（e）日期1997年2月12日PCT 1995年3月6日PCT PCT。第WO96 / 35047号公报日期1996年11月7日电子发动机控制系统在进气管上具有多个单独的部件，其中一些部件位于相对较远的位置。为了将各个组件电连接到电子控制单元，因此需要相对长的电连接线和相对大量的插头连接。本发明提出了一种预组装的节流装置，其包括可旋转地容纳在节气门支撑件中的至少一个节流装置和壳体中的空转调节器; 节气门装置具有旁路管道，该旁路管道绕过节流装置并且可以由空转调节器改变，再生阀可以输入燃料，再生阀可由也容纳在壳体中的电子控制单元触发。本发明的节气门装置特别用于混合压缩具有外部点火的内燃机。

2. 发明授权

US5771859A Method and arrangement for controlling the idle of an internal combustion engine 失效
标题翻译：用于控制内燃机的空转的方法和装置
公开(公告)号：US5771859A
公开(公告)日：1998-06-30
申请号：US731738
申请日：1996-10-18
申请人： Walter Schlagmueller , Thomas Wiesa , Rolf Litzinger , Juergen Rottler , Ralph Schimitzek , Peter Jauernig
发明人： Walter Schlagmueller , Thomas Wiesa , Rolf Litzinger , Juergen Rottler , Ralph Schimitzek , Peter Jauernig
IPC分类号： F02P5/15 , F02D41/00 , F02D41/02 , F02D41/08 , F02D41/16 , F02D41/22 , F02D43/00 , F02D45/00 , F02M25/08
CPC分类号： F02D41/221 , F02D41/004 , F02D41/0042 , F02D2041/227 , F02M25/08
摘要： The invention is directed to a method for controlling the idle of an internal combustion engine having an intake channel for conducting air to the engine. The method utilizes sensors for generating signals characterizing the operating state of the engine and for supplying the signals to a control apparatus. A tank-venting valve is provided through which air can be conducted into the intake channel when the tank-venting valve is open. Control quantities are computed in the control apparatus in dependence upon the signals for at least the following: the tank-venting valve, an idle adjuster device, a fuel metering device and an ignition device. The air supplied to the engine is controlled with the aid of the tank-venting valve. The invention is also directed to an arrangement for carrying out the method.
摘要翻译：本发明涉及一种用于控制具有用于将空气传导到发动机的进气通道的内燃机的空转的方法。该方法利用传感器来产生表征发动机工作状态的信号，并将信号提供给控制装置。提供通气阀，当排气阀打开时，空气可以通过该通气阀进入进气通道。根据至少以下的信号，在控制装置中计算控制量：排气阀，怠速调节装置，燃料计量装置和点火装置。供给发动机的空气借助于排气阀进行控制。本发明还涉及一种用于实施该方法的装置。

3. 发明授权

US5880935A Device for using in an electronic controller 失效
标题翻译：在电子控制器中使用的装置
公开(公告)号：US5880935A
公开(公告)日：1999-03-09
申请号：US800950
申请日：1997-02-14
申请人： Thomas Wiesa , Ralph Schimitzek , Dieter Karr
发明人： Thomas Wiesa , Ralph Schimitzek , Dieter Karr
IPC分类号： H05K1/00 , H05K1/14 , H05K1/18 , H05K3/00 , H05K3/28 , H05K3/34 , H05K3/36
CPC分类号： H05K1/147 , H05K1/141 , H05K3/363 , H05K1/0298 , H05K1/181 , H05K2201/10666 , H05K3/284 , H05K3/341 , H05K3/4691 , Y10T29/49128
摘要： A device, in particular for use in an electronic controller, includes a card rack and a subassembly. The device is manufactured by soldering over a large area the unpopulated back side of the subassembly to this card rack. The soldering can be performed using a reflow soldering process and can be automated, and thus suitable for mass production. The electrical connections of the subassembly are led spatially and electrically separately from the mechanical attachment of the subassembly to the card rack. The subassembly can be an additional component mounted on the card rack with a new additional function, so that the controller can be flexibly adapted to a given requirement profile in a simple manner by combining, in a flexible manner, a plurality of subassemblies with different layouts and modes of operation on the card rack.
摘要翻译：特别是用于电子控制器的装置包括卡架和子组件。该装置是通过将大部分未组装的子组件的背面焊接到该卡架上来制造的。焊接可以使用回流焊接工艺进行，并且可以自动化，因此适合于批量生产。子组件的电气连接在空间上和电气上分开地从子组件的机械附件引导到卡架上。子组件可以是安装在卡架上的附加部件，具有新的附加功能，使得通过以灵活的方式组合具有不同布局的多个子组件，控制器可以以简单的方式灵活地适应给定的需求简档和卡架上的操作模式。

4. 发明授权

US5925210A Method for manufacturing a composite arrangement 失效
标题翻译：制造复合布置的方法
公开(公告)号：US5925210A
公开(公告)日：1999-07-20
申请号：US803654
申请日：1997-02-21
申请人： Walter Wagenbrenner , Thomas Wiesa , Ralph Schimitzek
发明人： Walter Wagenbrenner , Thomas Wiesa , Ralph Schimitzek
IPC分类号： H05K3/00 , H05K3/34
CPC分类号： H05K3/0061 , H05K3/3447 , H05K2201/0367 , H05K2201/09036 , H05K2201/09063 , H05K2201/10901 , H05K2203/1178 , H05K2203/1394 , H05K3/0094 , Y10T156/16
摘要： In a method for manufacturing a composite arrangement, at least one printed circuit board substrate is joined with a support under the influence of an applied pressure exerted by a press die over a weave layer (prepreg) impregnated with resin, such that the resin in the region of an opening of the printed circuit board substrate does not flow into this opening. The applied pressure is, therefore, at least partially reduced in the region of the opening of the printed circuit board substrate.
摘要翻译：在制造复合布置的方法中，至少一个印刷电路板基板在由压模施加的施加压力在浸渍有树脂的编织层（预浸料坯）的影响下与支撑体接合，使得树脂在印刷电路板基板的开口的区域不流入该开口。因此，在印刷电路板基板的开口区域中施加的压力至少部分地减小。

5. 发明授权

US5539618A Electrical device, in particular switching or controlling device for motor vehicle 失效
标题翻译：电气装置，特别是用于机动车辆的开关或控制装置
公开(公告)号：US5539618A
公开(公告)日：1996-07-23
申请号：US461671
申请日：1995-06-05
申请人： Thomas Wiesa , Ralph Schimitzek
发明人： Thomas Wiesa , Ralph Schimitzek
IPC分类号： B60R16/02 , B60R16/023 , H05K1/02 , H05K1/05 , H05K1/18 , H05K3/00 , H05K7/20
CPC分类号： B60R16/0239 , H05K1/0206 , H05K7/205 , H05K1/05 , H05K1/181 , H05K2201/09572 , H05K2201/10166 , H05K2201/10969 , H05K3/0061
摘要： An electrical device has a printed circuit foil carrying an electrical circuit and having a throughgoing opening, a heat conductive carrier plate located at a lower side of the foil, a heating power conductor located at an upper of the foil, and a solderable edge layer located at the upper side of the printed circuit foil under the power component having dimensions corresponding to the dimensions of the power component. The edge layer limits the throughgoing opening and the foil from inside. The throughgoing opening has a side which is measured parallel to the upper side of the foil and is greater than a corresponding size of the edge layer. The throughgoing opening is filled with a heat conductive mass.
摘要翻译：电气设备具有承载电路并具有通孔的印刷电路箔，位于箔的下侧的导热载体板，位于箔的上部的加热电力导体和位于在功率部件下方的印刷电路箔的上侧具有对应于功率部件的尺寸的尺寸。边缘层从内部限制通孔和箔。通过的开口具有平行于箔的上侧测量并且大于边缘层的相应尺寸的一侧。通孔开口填充有导热块。

6. 发明申请

US20110205711A1 HEAT DISSIPATION FROM A CONTROL UNIT 有权
标题翻译：从控制单元散热
公开(公告)号：US20110205711A1
公开(公告)日：2011-08-25
申请号：US13003749
申请日：2009-06-17
申请人： Andre Lischeck , Thomas Wiesa
发明人： Andre Lischeck , Thomas Wiesa
IPC分类号： H05K7/20 , H05K13/00
CPC分类号： H05K7/20454 , H05K7/20854 , Y10T29/49002
摘要： A control unit, in particular for a motor vehicle, the control unit having a housing, which has at least one heat dissipating area in which at least one electrical and/or electronic module having at least one heat dissipating element is situated, it being provided that the heat dissipating element is heat conductively connected to the heat dissipating area via a heat conducting medium which is introduced into the interior of the housing through at least one housing opening and which has a paste-like consistency, at least when introduced. A corresponding method for manufacturing a control unit is also described.
摘要翻译：控制单元，特别是用于机动车辆的控制单元，该控制单元具有壳体，该壳体具有至少一个散热区域，至少一个具有至少一个散热元件的电气和/或电子模块位于该散热区域中，所述散热元件通过导热介质导热地连接到散热区域，所述导热介质至少在被引入时通过至少一个壳体开口被引入到所述壳体的内部并且具有糊状稠度。还描述了用于制造控制单元的相应方法。

7. 发明授权

US08885343B2 Heat dissipation from a control unit 有权
标题翻译：来自控制单元的散热
公开(公告)号：US08885343B2
公开(公告)日：2014-11-11
申请号：US13003749
申请日：2009-06-17
申请人： Andre Lischeck , Thomas Wiesa
发明人： Andre Lischeck , Thomas Wiesa
IPC分类号： H05K7/20 , H05K1/00 , H01J5/00 , F28F7/00
CPC分类号： H05K7/20454 , H05K7/20854 , Y10T29/49002
摘要： A control unit, in particular for a motor vehicle, the control unit having a housing, which has at least one heat dissipating area in which at least one electrical and/or electronic module having at least one heat dissipating element is situated, it being provided that the heat dissipating element is heat conductively connected to the heat dissipating area via a heat conducting medium which is introduced into the interior of the housing through at least one housing opening and which has a paste-like consistency, at least when introduced. A corresponding method for manufacturing a control unit is also described.
摘要翻译：控制单元，特别是用于机动车辆的控制单元，该控制单元具有壳体，该壳体具有至少一个散热区域，至少一个具有至少一个散热元件的电气和/或电子模块位于该散热区域中，所述散热元件通过导热介质导热地连接到散热区域，所述导热介质至少在被引入时通过至少一个壳体开口被引入到所述壳体的内部并且具有糊状稠度。还描述了用于制造控制单元的相应方法。

8. 发明授权

US06197208B1 Method for metallizing at least one printed circuit board or at least one pressed screen and at least one hybrid 失效
标题翻译：用于对至少一个印刷电路板或至少一个压制屏幕和至少一个混合物进行金属化的方法
公开(公告)号：US06197208B1
公开(公告)日：2001-03-06
申请号：US09214665
申请日：1999-01-07
申请人： Thomas Wiesa
发明人： Thomas Wiesa
IPC分类号： H05K336
CPC分类号： H05K1/148 , H05K1/141 , H05K1/142 , H05K3/0041 , H05K3/361 , H05K3/363 , H05K3/4092 , H05K2201/0154
摘要： A method for contacting at least one printed circuit board or at least one punched grid and at least one hybrid includes the steps of: forming contact elements in a contacting foil, positioning the contacting foil over the hybrid in such a way that the contact elements are arranged at preselected positions between the printed circuit traces of the hybrid and the printed circuit traces of the printed circuit board, and etching away at least a portion of the contacting foil, such that the contact elements are at least partially freely accessible.
摘要翻译：用于接触至少一个印刷电路板或至少一个冲孔格栅和至少一个混合物的方法包括以下步骤：在接触箔中形成接触元件，将接触箔定位在混合物上，使得接触元件为布置在混合物的印刷电路迹线和印刷电路板的印刷电路迹线之间的预选位置处，并蚀刻掉接触箔的至少一部分，使得接触元件至少部分地可自由接近。

9. 发明授权

US5375039A Circuit board heat dissipation layering arrangement 失效
标题翻译：电路板散热分层布置
公开(公告)号：US5375039A
公开(公告)日：1994-12-20
申请号：US127150
申请日：1993-09-27
申请人： Thomas Wiesa
发明人： Thomas Wiesa
IPC分类号： H05K1/02 , H05K3/42 , H05K7/20 , H05H7/20
CPC分类号： H05K1/0206 , H05K7/205 , H05K1/0272 , H05K2201/0338 , H05K2201/09054 , H05K2201/09745 , H05K3/0061 , H05K3/42
摘要： A circuit board layering arrangement is capable of dissipating, into a heat sink, the heat produced by power components mounted on the circuit board, without permitting the short circuiting of electricity between the power components and other components or the heat sink. The arrangement comprises a circuit board, at least one power component and a heat sink. A plurality of through contacts are introduced into the circuit board, and a plurality of conductive tracks are disposed on first and second surfaces of the circuit board. The plurality of conductive tracks include two large-surface conductive tracks, one on each surface of the circuit board. One or more power components are surface-mounted on a first surface of the circuit board on a first large-surface conductive track. The second large-surface conductive track is thermally coupled to the first large-surface conductive track and to the heat sink. A layer of metal, preferably copper, may be disposed between the second large-surface conductive track and the heat sink, and a layer of glass cloth may be disposed between the second large-surface conductive track and the layer of metal.
摘要翻译：电路板层叠装置能够将安装在电路板上的功率部件产生的热量散发到散热器中，而不会使功率部件和其它部件或散热器之间的电短路。该装置包括电路板，至少一个功率部件和散热器。多个贯通接点被引入到电路板中，并且多个导电轨道设置在电路板的第一和第二表面上。多个导电轨道包括两个大表面导电轨道，一个在电路板的每个表面上。一个或多个功率部件被表面安装在第一大表面导电轨道上的电路板的第一表面上。第二大表面导电轨道热耦合到第一大表面导电轨道和散热器。可以在第二大表面导电轨道和散热器之间设置金属层，优选铜层，并且可以在第二大表面导电轨道和金属层之间设置一层玻璃布。

10. 发明授权

US09345139B2 Control module for a transmission control installed in an automatic transmission 有权
标题翻译：控制模块，用于安装在自动变速箱中的变速箱控制
公开(公告)号：US09345139B2
公开(公告)日：2016-05-17
申请号：US13490245
申请日：2012-06-06
申请人： Rolf Becker , Christian Lammers , Juergen Jerg , Joachim Wolff , Volker Hochholzer , Ulrich Trescher , Helmut Bubeck , Klaus Voigtlaender , Jan Benzler , Thomas Raica , Willi Kuehn , Thomas Wiesa , Michael Krapp
发明人： Rolf Becker , Christian Lammers , Juergen Jerg , Joachim Wolff , Volker Hochholzer , Ulrich Trescher , Helmut Bubeck , Klaus Voigtlaender , Jan Benzler , Thomas Raica , Willi Kuehn , Thomas Wiesa , Michael Krapp
IPC分类号： H05K1/18 , H05K7/20 , H05K5/00 , F16H61/00 , H05K1/02 , H05K3/32
CPC分类号： H05K1/18 , F16H61/0006 , H01L2924/0002 , H05K1/0206 , H05K3/325 , H05K5/0082 , H05K7/20463 , H05K7/205 , H05K7/20854 , H05K2201/10151 , H05K2201/10189 , H05K2201/10371 , H05K2201/10446 , H05K2203/1147 , H05K2203/1572 , Y10T29/49002 , Y10T29/49117 , Y10T29/4913 , Y10T29/49146 , H01L2924/00
摘要： The use of a control module having at least one housing part and a multi-layer printed circuit board as the electrical connection between the inner space of the housing and components that are situated outside of the housing part is described. The multi-layer printed circuit board is the carrier for the electrical components of an electronic circuit, and is at the same time the thermal contacting to a housing part and/or a cooling element, particularly a hydraulic plate of the transmission, for a transmission control installed in an automatic transmission.
摘要翻译：描述了使用具有至少一个壳体部分和多层印刷电路板的控制模块作为壳体的内部空间与位于壳体部分外部的部件之间的电连接。多层印刷电路板是用于电子电路的电气部件的载体，并且同时与用于传输的壳体部分和/或冷却元件，特别是变速器的液压板的热接触控制安装在自动变速器中。

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