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    • 6. 发明授权
    • Utilizing inverse reactive ion etching lag in double patterning contact formation
    • 在双重图案化接触形成中利用反向离子蚀刻滞后
    • US07786017B1
    • 2010-08-31
    • US12561612
    • 2009-09-17
    • Bradley J. MorgenfeldScott D. AllenColin J. BrodskyWai-Kin Li
    • Bradley J. MorgenfeldScott D. AllenColin J. BrodskyWai-Kin Li
    • H01L21/302
    • H01L21/31144H01L21/31116H01L21/76816
    • Solutions for solutions for utilizing Inverse Reactive Ion Etching lag in double patterning contact formation are disclosed. In one embodiment, a method includes providing a CMOS device including: an NMOS device having an NMOS gate and a PMOS device having a PMOS gate; a shallow trench isolation located between the NMOS device and the PMOS device; and an inter-level dielectric located over the NMOS device, the PMOS device and the shallow trench isolation; performing a double-patterning etch process on the CMOS device under conditions causing inverse reactive ion etching lag, the performing including forming a first opening, a second opening and a third opening, the second opening being wider than the first opening, and the third opening being contiguous with the second opening; and forming a first contact in the first opening and forming a second contact in both of the second opening and the third opening.
    • 公开了用于在双重图案化接触形成中利用反向离子蚀刻滞后的解决方案。 在一个实施例中,一种方法包括提供CMOS器件,其包括:具有NMOS栅极和PMOS器件的NMOS器件,具有PMOS栅极; 位于NMOS器件和PMOS器件之间的浅沟槽隔离; 以及位于NMOS器件,PMOS器件和浅沟槽隔离之上的级间电介质; 在引起反向离子蚀刻滞后的条件下在CMOS器件上进行双图案化蚀刻工艺,其特征在于包括形成第一开口,第二开口和第三开口,第二开口比第一开口宽,第三开口 与第二个开口连续; 以及在所述第一开口中形成第一触点并且在所述第二开口和所述第三开口中形成第二触点。
    • 10. 发明授权
    • Method of preventing pinhole defects through co-polymerization
    • 通过共聚防止针孔缺陷的方法
    • US07632631B2
    • 2009-12-15
    • US11029813
    • 2005-01-05
    • Steven A. ScheerColin J. Brodsky
    • Steven A. ScheerColin J. Brodsky
    • G03F7/00
    • G03F7/168G03F7/091G03F7/11Y10S430/136
    • A method is provided for forming a stable thin film on a substrate. The method includes depositing a co-polymer composition having a first component and a second component onto a substrate to form a stable film having a first thickness. The first component has first dielectric properties not enabling the first component by itself to produce the stable film having the first thickness. However, the second component has second dielectric properties which impart stability to the film at the first thickness. In a preferred embodiment, the second component includes a leaving group, and the method further includes first thermal processing the film to cause a solvent but not the leaving group to be removed from the film, after which second thermal processing is performed to at least substantially remove the leaving group from the film. As a result, the film is reduced to a second thickness smaller than the first thickness, and the film remains stable during both the first and the second thermal processing.
    • 提供了在基板上形成稳定的薄膜的方法。 该方法包括将具有第一组分和第二组分的共聚物组合物沉积到基底上以形成具有第一厚度的稳定膜。 第一组分具有不能使第一组分本身产生具有第一厚度的稳定膜的第一介电性质。 然而,第二组分具有赋予第一厚度的薄膜稳定性的第二介电特性。 在优选的实施方案中,第二组分包括离去基团,并且该方法还包括首先热处理膜以引起溶剂而不是离开基团从膜中除去,之后进行第二热处理至少基本上 从电影中删除离开组。 结果,膜被还原成小于第一厚度的第二厚度,并且在第一和第二热处理期间膜保持稳定。