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    • 4. 发明申请
    • SYSTEM FOR MONITORING STRUCTURAL ASSETS
    • 监测结构资产的制度
    • US20120125118A1
    • 2012-05-24
    • US12949113
    • 2010-11-18
    • Cornel CobianuFrank TurnbullIon GeorgescuViorel Avramescu
    • Cornel CobianuFrank TurnbullIon GeorgescuViorel Avramescu
    • G01N29/04
    • G01N29/2462G01N29/223G01N2291/0232G01N2291/2634
    • A system for detection of stress and deformation in a structural asset, for instance, one of reinforced concrete. An area on the asset may have a structure interface, such as a patch, attached to it with a fastening mechanism which may be a layer of an epoxy or other material, or be items such as screws, bolts, welds, or the like. One or more surface acoustic wave (SAW) strain sensors may be attached to the interface with an adhesive layer of epoxy or other material, or with mechanical items. Stress may be transmitted by the interface to the strain sensors. The sensors may be interrogated with a wire or wireless reader to obtain strain measurements. The measurements may indicate stress and deformations such as bulges and breaks in the asset. The measurements may also be a basis for determining location and extent of the stress and deformations.
    • 一种用于检测结构资产中的应力和变形的系统,例如钢筋混凝土之一。 资产上的区域可以具有附接到其上的结构界面,例如贴片,其具有可以是环氧树脂或其它材料层的紧固机构,或者诸如螺钉,螺栓,焊接等的物品。 一个或多个表面声波(SAW)应变传感器可以与环氧树脂或其它材料或机械物品的粘合剂层附接到界面。 应力可以通过接口传递到应变传感器。 传感器可以用线或无线读取器询问以获得应变测量值。 测量结果可能表示压力和变形,如资产中的凸起和断裂。 测量也可能是确定应力和变形的位置和程度的基础。
    • 6. 发明授权
    • System for monitoring structural assets
    • 监测结构性资产的制度
    • US08479590B2
    • 2013-07-09
    • US12949113
    • 2010-11-18
    • Cornel CobianuFrank TurnbullIon GeorgescuViorel Avramescu
    • Cornel CobianuFrank TurnbullIon GeorgescuViorel Avramescu
    • G01N29/04G01N3/00
    • G01N29/2462G01N29/223G01N2291/0232G01N2291/2634
    • A system for detection of stress and deformation in a structural asset, for instance, one of reinforced concrete. An area on the asset may have a structure interface, such as a patch, attached to it with a fastening mechanism which may be a layer of an epoxy or other material, or be items such as screws, bolts, welds, or the like. One or more surface acoustic wave (SAW) strain sensors may be attached to the interface with an adhesive layer of epoxy or other material, or with mechanical items. Stress may be transmitted by the interface to the strain sensors. The sensors may be interrogated with a wire or wireless reader to obtain strain measurements. The measurements may indicate stress and deformations such as bulges and breaks in the asset. The measurements may also be a basis for determining location and extent of the stress and deformations.
    • 一种用于检测结构资产中的应力和变形的系统,例如钢筋混凝土之一。 资产上的区域可以具有附接到其上的结构界面,例如贴片,其具有可以是环氧树脂或其它材料层的紧固机构,或者诸如螺钉,螺栓,焊接等的物品。 一个或多个表面声波(SAW)应变传感器可以与环氧树脂或其它材料或机械物品的粘合剂层附接到界面。 应力可以通过接口传递到应变传感器。 传感器可以用线或无线读取器询问以获得应变测量值。 测量结果可能表示压力和变形,如资产中的凸起和断裂。 测量也可能是确定应力和变形的位置和程度的基础。
    • 10. 发明申请
    • Quartz SAW sensor based on direct quartz bonding
    • 石英SAW传感器基于直接石英粘接
    • US20070164633A1
    • 2007-07-19
    • US11331632
    • 2006-01-13
    • Cornel CobianuViorel AvramescuIon Georgescu
    • Cornel CobianuViorel AvramescuIon Georgescu
    • H03H9/145
    • G01L9/008G01L9/0025
    • A SAW sensor module can be produced with a true all quartz sensor package (TAQSP) attached to a substrate. The TAQSP has a quartz cover direct quartz bonded to a SAW sensor on a quartz substrate. The TAQSP can be mass produced by direct quartz bonding a quartz cover wafer, having many covers, to a quartz sensor wafer, having many sensors, thereby producing a wafer tandem. The wafer tandem can be further processed because the bond protects the sensors within. Individual sensor packages can be obtained by cutting stripes out of the cover wafer, revealing SAW sensor bonding pads, and then dicing the wafer tandem. A SAW sensor module results when the sensor packages are attached to an antenna bearing substrate and then sealed.
    • SAW传感器模块可以使用附着在基板上的真正的所有石英传感器封装(TAQSP)来生产。 TAQSP具有石英盖直接石英结合到石英基板上的SAW传感器。 TAQSP可以通过将具有许多盖的石英盖晶片直接石英粘合到具有许多传感器的石英传感器晶片上进行批量生产,从而制造晶圆串联。 晶圆串联可以进一步处理,因为焊接保护传感器内部。 可以通过从盖晶片上切割条纹,露出SAW传感器接合焊盘,然后将晶片串联切割来获得各个传感器封装。 当传感器封装安装在天线轴承衬底上,然后密封时,会产生SAW传感器模块。