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    • 10. 发明授权
    • Method and apparatus for wafer detection
    • 晶圆检测方法及装置
    • US06377060B1
    • 2002-04-23
    • US09552458
    • 2000-04-18
    • Vincent E. BurkhartDeepak Manaoharlal
    • Vincent E. BurkhartDeepak Manaoharlal
    • G01R3102
    • H01L21/67288H01L21/67259H01L21/68H02N13/00
    • An apparatus and a method for detecting the presence and position of a wafer upon a semiconductor wafer support pedestal surface. Specifically, a wafer detector comprising a plurality of electrodes on a surface of the wafer support pedestal. The electrodes are coupled to a capacitance measurement circuit that measures the capacitance between the electrodes and generates a signal corresponding to a wafer's presence, location and chucking condition. The wafer's presence completes an electrical circuit between the electrodes, increasing the capacitance between the electrodes. As such, the presence of a wafer, the position of the wafer, and the condition of the wafer, i.e., wafer damage, can be detected upon a wafer support pedestal during wafer processing.
    • 一种用于在半导体晶片支撑基座表面上检测晶片的存在和位置的装置和方法。 具体地,晶片检测器在晶片支撑基座的表面上包括多个电极。 电极耦合到电容测量电路,其测量电极之间的电容,并产生对应于晶片存在,位置和夹持条件的信号。 晶圆的存在完成了电极之间的电路,增加了电极之间的电容。 因此,在晶片处理期间可以在晶片支撑基座上检测晶片的存在,晶片的位置和晶片的状态,即晶片损坏。