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1. 发明授权

US07066657B2 Optical subassembly 有权
标题翻译：光学组件
公开(公告)号：US07066657B2
公开(公告)日：2006-06-27
申请号：US09752881
申请日：2000-12-28
申请人： Venkatesan Murali , Douglas E. Crafts , Suresh Ramalingam , Brett M. Zaborsky , Siegfried B. Fleischer
发明人： Venkatesan Murali , Douglas E. Crafts , Suresh Ramalingam , Brett M. Zaborsky , Siegfried B. Fleischer
IPC分类号： G02B6/42 , G02B6/30
CPC分类号： G02B6/4246 , G02B6/4214 , G02B6/4292
摘要： An apparatus including a base having a first opening of a dimension suitable to pass a light emission therethrough, a first side wall coupled to the base and having a second opening of a dimension suitable to pass a light emission therethrough, a second side wall coupled to the base and having a reflective component thereon, and the base, the first side wall, and the second side wall define an interior chamber with the reflective component disposed in the interior chamber; and a fiber connector extending from an exterior of the first side wall adjacent the second opening. A method including powering a laser disposed in a substrate coupling a fiber optic cable to an optical subassembly; and aligning the optical assembly over the transceiver board to capture the emitted light from the laser in the fiber optic cable.
摘要翻译：一种装置，包括具有第一开口的基座，该第一开口的尺寸适于通过其中的光发射;第一侧壁，其耦合到所述基座并且具有适于使光发射通过的尺寸的第二开口;第二侧壁，所述底座并且在其上具有反射部件，并且所述基座，所述第一侧壁和所述第二侧壁限定内部腔室，所述反射部件设置在所述内部腔室中; 以及从邻近第二开口的第一侧壁的外部延伸的光纤连接器。一种方法，包括为将光纤电缆耦合到光学子组件的基板中的激光器供电; 并且将光学组件对准在收发器板上以捕获来自光纤电缆中的激光器的发射光。

2. 发明授权

US06486440B1 Redundant package for optical components 有权
标题翻译：用于光学元件的冗余封装
公开(公告)号：US06486440B1
公开(公告)日：2002-11-26
申请号：US09901474
申请日：2001-07-09
申请人： Douglas E. Crafts , James F. Farrell , Mark B. Farrelly , Suresh Ramalingam
发明人： Douglas E. Crafts , James F. Farrell , Mark B. Farrelly , Suresh Ramalingam
IPC分类号： H05B100
CPC分类号： G02B6/30 , G02B6/1203 , G02B6/36
摘要： A redundant package for optical components includes an inner package enclosing the optical component, and an outer package enclosing the inner package. A heater may be disposed in the inner package proximate the optical component to control its temperature, and to maintain this temperature control, the outer package creates an isolated air pocket around the inner package which thermally insulates the inner package from the outside environment. The outer package is formed of a material having low thermal conductivity, to promote this insulating function. This package is especially useful if the optical component comprises a planar lightwave circuit (PLC), e.g., an arrayed waveguide grating (AWG), which requires tight temperature control and structural integrity to maintain the integrity of the optical paths.
摘要翻译：用于光学部件的冗余封装包括封装光学部件的内部封装以及封装内部封装的外部封装。加热器可以靠近光学部件设置在内部包装件中以控制其温度，并且为了保持该温度控制，外部包装围绕内部包装形成隔离的空气袋，其将内部包装与外部环境绝热。外包装由具有低导热性的材料形成，以促进该绝缘功能。如果光学组件包括平面光波电路（PLC），例如阵列波导光栅（AWG），则该封装是特别有用的，其需要严格的温度控制和结构完整性来维持光路的完整性。

3. 发明授权

US06697553B2 Compact, low insertion loss, high yield arrayed waveguide grating 有权
标题翻译：紧凑，低插入损耗，高产量阵列波导光栅
公开(公告)号：US06697553B2
公开(公告)日：2004-02-24
申请号：US10077581
申请日：2002-02-15
申请人： Jyoti Kiron Bhardwaj , Robert James Brainard , David J. Chapman , Douglas E. Crafts , Zi-Wen Dong , David Dougherty , Erik W. Egan , James F. Farrell , Mark B. Farrelly , Niranjan Gopinathan , Kenzo Ishida , David K. Nakamoto , Thomas Thuan Nguyen , Suresh Ramalingam , Steven M. Swain , Sanjay M. Thekdi , Anantharaman Vaidyanathan , Hiroaki Yamada , Yingchao Yan
发明人： Jyoti Kiron Bhardwaj , Robert James Brainard , David J. Chapman , Douglas E. Crafts , Zi-Wen Dong , David Dougherty , Erik W. Egan , James F. Farrell , Mark B. Farrelly , Niranjan Gopinathan , Kenzo Ishida , David K. Nakamoto , Thomas Thuan Nguyen , Suresh Ramalingam , Steven M. Swain , Sanjay M. Thekdi , Anantharaman Vaidyanathan , Hiroaki Yamada , Yingchao Yan
IPC分类号： G02B634
CPC分类号： G02B6/12011 , G02B6/105 , G02B6/12 , G02B6/12016 , G02B6/12021 , G02B6/12026
摘要： A planar lightwave circuit includes an arrayed waveguide grating (AWG), with input and output waveguides, partially curved array waveguides with respective length differences, and planar waveguide regions for focusing optical energy between the input/output and array waveguides. Optimal waveguide widths and spacing along the planar waveguide region facets are disclosed, which are largely determinative of AWG size and optical performance. Also disclosed are optimal cross-sectional waveguide dimensions (e.g., width and height); modified index of refraction difference between the waveguide core and cladding regions; and optimal array waveguide lengths, path length differences, and free spectral range. These features, especially when combined with advanced fiber attachment, passivation and packaging techniques, result in high-yield, high-performance AWGs (both gaussian and flattop versions).
摘要翻译：平面光波电路包括阵列波导光栅（AWG），其具有输入和输出波导，具有相应长度差的部分弯曲阵列波导和用于在输入/输出和阵列波导之间聚焦光能的平面波导区域。公开了沿着平面波导区域面的最佳波导宽度和间距，其主要决定于AWG尺寸和光学性能。还公开了最佳横截面波导尺寸（例如，宽度和高度）; 波导芯和包层区之间的折射率差异; 和最佳阵列波导长度，路径长度差和自由光谱范围。这些特性，特别是结合先进的光纤附着，钝化和封装技术，可以获得高产出，高性能的AWG（高斯型和平板型）。

4. 发明授权

US06664511B2 Package for optical components 有权
标题翻译：光学元件封装
公开(公告)号：US06664511B2
公开(公告)日：2003-12-16
申请号：US10281876
申请日：2002-10-28
申请人： Douglas E. Crafts , James F. Farrell , Mark B. Farrelly , Suresh Ramalingam , Kenzo Ishida
发明人： Douglas E. Crafts , James F. Farrell , Mark B. Farrelly , Suresh Ramalingam , Kenzo Ishida
IPC分类号： H05B100
CPC分类号： G02B6/30 , G02B6/1203 , G02B6/36
摘要： A package for optical components includes an inner package enclosing the optical component, and an outer package enclosing the inner package. A heater may be disposed in the inner package proximate the optical component to control its temperature, and to maintain this temperature control, the outer package creates an isolated air pocket around the inner package, which thermally insulates the inner package from the outside environment. The outer package is formed of a material having low thermal conductivity, to promote this insulating function. This package is especially useful if the optical component comprises a planar light-wave circuit (PLC), e.g. an arrayed waveguide grating (AWG), which requires tight temperature control and structural integrity to maintain the integrity of the optical paths.
摘要翻译：用于光学部件的封装包括封装光学部件的内部封装以及封装内部封装的外部封装。加热器可以在靠近光学部件的内部包装件中设置以控制其温度，并且为了保持该温度控制，外部包装围绕内部包装形成隔离的空气袋，其将内部包装与外部环境热绝缘。外包装由具有低导热性的材料形成，以促进该绝缘功能。如果光学部件包括平面光波电路（PLC），例如，阵列波导光栅（AWG），其需要严格的温度控制和结构完整性来维持光路的完整性。

5. 发明授权

US06606425B1 Transfer molded packages with embedded thermal insulation 有权
标题翻译：具有嵌入式保温的转移成型包装
公开(公告)号：US06606425B1
公开(公告)日：2003-08-12
申请号：US10100277
申请日：2002-03-18
申请人： Douglas E. Crafts , Kenzo Ishida , David J. Chapman , Duane Cook , James F. Farrell , Suresh Ramalingam , Steven M. Swain
发明人： Douglas E. Crafts , Kenzo Ishida , David J. Chapman , Duane Cook , James F. Farrell , Suresh Ramalingam , Steven M. Swain
IPC分类号： G02B612
CPC分类号： G02B6/12026 , G02B6/4253 , G02B6/4273
摘要： An optical component package, in which a transfer molded layer of material (e.g., syntactic foam in one embodiment) is formed at least partially around, or entirely around, the optical component to provide structural and thermal insulation around the component. The optical component may be a planar lightwave circuit (PLC), with a protective passivation layer formed between the PLC and the layer of syntactic foam, to de-couple stresses and thermal transfer between the PLC and the layer of syntactic foam. Strengthening caps, fiber assemblies, and a heater may be provided with the PLC assembly, around which the layer of syntactic foam can also be formed. The protective passivation layer can also be formed between these structures and the syntactic foam; in one embodiment between at least two strengthening caps formed on opposing edges of the PLC. The disclosed package provides numerous structural, thermal and size benefits.
摘要翻译：一种光学部件封装，其中材料的转移模制层（例如，一个实施例中的复合泡沫）至少部分地围绕或完全围绕光学部件形成，以在部件周围提供结构和隔热。光学部件可以是平面光波电路（PLC），在PLC和复合泡沫层之间形成保护钝化层，以解除PLC和复合泡沫层之间的应力和热传递。可以提供加强盖，纤维组件和加热器，PLC组件也可以形成层压泡沫层。保护钝化层也可以在这些结构和复合泡沫之间形成; 在一个实施例中，在形成在PLC的相对边缘上的至少两个加强盖之间。所公开的封装提供了许多结构，热和尺寸的优点。

6. 发明授权

US06331446B1 Process for underfilling a controlled collapse chip connection (C4) integrated circuit package with an underfill material that is heated to a partial gel state 有权
标题翻译：用于将加热到部分凝胶状态的底部填充材料用于底部填充受控崩溃芯片连接（C4）集成电路封装的工艺
公开(公告)号：US06331446B1
公开(公告)日：2001-12-18
申请号：US09261648
申请日：1999-03-03
申请人： Duane Cook , Venkatesan Murali , Suresh Ramalingam , Nagesh Vodrahalli
发明人： Duane Cook , Venkatesan Murali , Suresh Ramalingam , Nagesh Vodrahalli
IPC分类号： H01L2144
CPC分类号： H01L24/31 , H01L21/563 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/83951 , H01L2924/00014 , H01L2924/01006 , H01L2924/01015 , H01L2924/01082 , H01L2924/14 , H01L2924/00 , H01L2924/3512 , H01L2224/0401
摘要： A partial gel step in the underfilling of an integrated circuit that is mounted to a substrate. The process involves dispensing a first underfill material and then heating the underfill material to a partial gel state. The partial gel step may reduce void formation and improve adhesion performance during moisture loading.
摘要翻译：在安装到基板上的集成电路的底部填充中的部分凝胶步骤。该方法包括分配第一底部填充材料，然后将底部填充材料加热至部分凝胶状态。部分凝胶步骤可以减少空隙形成并改善湿气加载期间的粘附性能。

7. 发明授权

US07141448B2 Controlled collapse chip connection (C4) integrated circuit package which has two dissimilar underfill materials 有权
公开(公告)号：US07141448B2
公开(公告)日：2006-11-28
申请号：US09874666
申请日：2001-06-05
申请人： Suresh Ramalingam , Venkatesan Murali , Duane Cook
发明人： Suresh Ramalingam , Venkatesan Murali , Duane Cook
IPC分类号： H01L21/00 , H01L21/44 , H01L21/48 , H01L21/50
CPC分类号： H01L21/563 , H01L24/31 , H01L2224/16225 , H01L2224/73203 , H01L2224/83951 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01082 , H01L2924/14 , H01L2924/15787 , H01L2924/3512 , H01L2924/00 , H01L2224/0401
摘要： An integrated circuit package which may include the dispense of a second encapsulant material (or fillet) different from the first underfill material on an integrated circuit package which may include an integrated circuit that is mounted to a substrate. The package may further have a first underfill material and a second underfill material that are attached to the integrated circuit and the substrate. The second encapsulant material may be tailored to inhibit cracking of the epoxy itself that propagates into the substrate during thermo-mechanical loading.

8. 发明申请

US20050117853A1 OPTICAL SUBASSEMBLY 有权
标题翻译：光学分层
公开(公告)号：US20050117853A1
公开(公告)日：2005-06-02
申请号：US09752881
申请日：2000-12-28
申请人： Venkatesan Murali , Douglas Crafts , Suresh Ramalingam , Brett Zaborsky , Siegfried Fleischer
发明人： Venkatesan Murali , Douglas Crafts , Suresh Ramalingam , Brett Zaborsky , Siegfried Fleischer
IPC分类号： G02B6/42 , G02B6/36
CPC分类号： G02B6/4246 , G02B6/4214 , G02B6/4292
摘要： An apparatus including a base having a first opening of a dimension suitable to pass a light emission therethrough, a first side wall coupled to the base and having a second opening of a dimension suitable to pass a light emission therethrough, a second side wall coupled to the base and having a reflective component thereon, and the base, the first side wall, and the second side wall define an interior chamber with the reflective component disposed in the interior chamber; and a fiber connector extending from an exterior of the first side wall adjacent the second opening. A method including powering a laser disposed in a substrate coupling a fiber optic cable to an optical subassembly; and aligning the optical assembly over the transceiver board to capture the emitted light from the laser in the fiber optic cable.
摘要翻译：一种装置，包括具有第一开口的基座，该第一开口的尺寸适于通过其中的光发射;第一侧壁，其耦合到所述基座并且具有适于使光发射通过的尺寸的第二开口;第二侧壁，所述底座并且在其上具有反射部件，并且所述基座，所述第一侧壁和所述第二侧壁限定内部腔室，所述反射部件设置在所述内部腔室中; 以及从邻近第二开口的第一侧壁的外部延伸的光纤连接器。一种方法，包括为将光纤电缆耦合到光学子组件的基板中的激光器供电; 并且将光学组件对准在收发器板上以捕获来自光纤电缆中的激光器的发射光。

9. 发明授权

US06687427B2 Optic switch 有权
公开(公告)号：US06687427B2
公开(公告)日：2004-02-03
申请号：US09752901
申请日：2000-12-29
申请人： Suresh Ramalingam , Venkatesan Murali
发明人： Suresh Ramalingam , Venkatesan Murali
IPC分类号： G02B626
CPC分类号： G02F1/3132 , G02F1/0147 , G02F1/3137
摘要： An apparatus comprising a body having dimensions suitable for light transmission therethrough, the body comprising a core extending therethrough, a first portion of the core comprising an index of refraction different than a second portion of the core and a cladding disposed about the core. An optical electronic integrated circuit (OEIC) substrate comprising a plurality of waveguides and a light source emitter coupled to at least one of the plurality of waveguides. A method comprising providing optical signals to an optical electronic integrated circuit (OEIC) through a plurality of waveguides are arranged in a circuit of different paths; and selecting an optical path by the index of refraction of a portion of the core.

10. 发明授权

US06778727B2 Optic switch 失效
公开(公告)号：US06778727B2
公开(公告)日：2004-08-17
申请号：US10714414
申请日：2003-11-14
申请人： Suresh Ramalingam , Venkatesan Murali
发明人： Suresh Ramalingam , Venkatesan Murali
IPC分类号： G02B626
CPC分类号： G02F1/3132 , G02F1/0147 , G02F1/3137
摘要： An apparatus comprising a body having dimensions suitable for light transmission therethrough, the body comprising a core extending therethrough, a first portion of the core comprising an index of refraction different than a second portion of the core and a cladding disposed about the core. An optical electronic integrated circuit (OEIC) substrate comprising a plurality of waveguides and a light source emitter coupled to at least one of the plurality of waveguides. A method comprising providing optical signals to an optical electronic integrated circuit (OEIC) through a plurality of waveguides are arranged in a circuit of different paths; and selecting an optical path by the index of refraction of a portion of the core.

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