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    • 2. 发明授权
    • DRAM with vertical transistor and trench capacitor memory cells and methods of fabrication
    • DRAM具有垂直晶体管和沟槽电容器存储单元及其制造方法
    • US06621112B2
    • 2003-09-16
    • US09731343
    • 2000-12-06
    • Venkatachalam C. JaiprakashMihel SeitzNorbert Arnold
    • Venkatachalam C. JaiprakashMihel SeitzNorbert Arnold
    • H01L27108
    • H01L27/10867
    • A semiconductor Dynamic Random Access Memory (DRAM) cell is fabricated using a vertical access transistor and a storage capacitor formed in a vertical trench. A Shallow Trench Isolation (STI) region is used as a masking region to confine the channel region of the access transistor, the first and second output regions of the access transistor, and a strap region connecting the second output region to the storage capacitor, to a narrow portion of the trench. The so confined second output region of the access transistor has reduced leakage to similar second output regions of adjacent memory cells. Adjacent memory cells can then be placed closer to one another without an increase in leakage and cross-talk between adjacent memory cells.
    • 使用垂直存取晶体管和形成在垂直沟槽中的存储电容器制造半导体动态随机存取存储器(DRAM)单元。 浅沟槽隔离(STI)区域用作屏蔽区域,以将存取晶体管的沟道区域,存取晶体管的第一和第二输出区域以及将第二输出区域连接到存储电容器的带区域限制到 沟槽的一小部分。 存取晶体管的如此限制的第二输出区域减少了泄漏到相邻存储器单元的类似的第二输出区域。 相邻的存储器单元然后可以彼此更靠近地放置,而不会增加相邻存储单元之间的泄漏和串扰。
    • 3. 发明授权
    • DRAM with vertical transistor and trench capacitor memory cells and method of fabrication
    • DRAM具有垂直晶体管和沟槽电容器存储单元及其制造方法
    • US06849496B2
    • 2005-02-01
    • US10617511
    • 2003-07-11
    • Venkatachalam C. JaiprakashMihel SeitzNorbert Arnold
    • Venkatachalam C. JaiprakashMihel SeitzNorbert Arnold
    • H01L21/8242
    • H01L27/10867
    • A semiconductor Dynamic Random Access Memory (DRAM) cell is fabricated using a vertical access transistor and a storage capacitor formed in a vertical trench. A Shallow Trench Isolation (STI) region is used as a masking region to confine the channel region of the access transistor, the first and second output regions of the access transistor, and a strap region connecting the second output region to the storage capacitor, to a narrow portion of the trench. The so confined second output region of the access transistor has reduced leakage to similar second output regions of adjacent memory cells. Adjacent memory cells can then be placed closer to one another without an increase in leakage and cross-talk between adjacent memory cells.
    • 使用垂直存取晶体管和形成在垂直沟槽中的存储电容器制造半导体动态随机存取存储器(DRAM)单元。 浅沟槽隔离(STI)区域用作屏蔽区域,以将存取晶体管的沟道区域,存取晶体管的第一和第二输出区域以及将第二输出区域连接到存储电容器的带区域限制到 沟槽的一小部分。 存取晶体管的如此限制的第二输出区域减少了泄漏到相邻存储器单元的类似的第二输出区域。 相邻的存储器单元然后可以彼此更靠近地放置,而不会增加相邻存储单元之间的泄漏和串扰。
    • 4. 发明授权
    • Vertical 8F2 cell dram with active area self-aligned to bit line
    • 垂直8F2单元格,有源区自对齐到位线
    • US06884676B2
    • 2005-04-26
    • US10447065
    • 2003-05-28
    • Norbert ArnoldVenkatachalam C. Jaiprakash
    • Norbert ArnoldVenkatachalam C. Jaiprakash
    • H01L21/8242H01L27/108
    • H01L27/10864H01L27/10876H01L27/10888H01L27/10891
    • A memory cell is formed in a memory cell array comprised of a plurality of memory cells arranged in rows and columns. A deep trench structure is formed within a semiconductor substrate and includes at least one conducting region. A patterned bit line structure is formed atop of, and electrically isolated from, the insulating region of the deep trench structure and atop of, but contacting at least part of, regions of the semiconductor substrate. Exposed portions of the semiconductor substrate are etched to form at least one isolation trench adjoining the deep trench structure using the patterned bit line structure as an etch mask. The isolation trench is filled with a dielectric material. A contact region to the conducting region of the deep trench structure is formed within the dielectric material of the isolation trench and is electrically isolated from the bit line structure. A word line structure that connects to the contact region is formed and is at least partly atop of, but electrically isolated from, the bit line structure.
    • 存储单元形成在由排列成行和列的多个存储单元组成的存储单元阵列中。 深沟槽结构形成在半导体衬底内并且包括至少一个导电区域。 图案化的位线结构形成在深沟槽结构的绝缘区域的顶部并与其电隔离,并且与半导体衬底的至少部分区域接触。 蚀刻半导体衬底的暴露部分,以形成与所述深沟槽结构相邻的至少一个隔离沟槽,使用所述图案化位线结构作为蚀刻掩模。 绝缘沟槽填充有电介质材料。 在深沟槽结构的导电区域的接触区域形成在隔离沟槽的电介质材料内,并且与位线结构电绝缘。 形成连接到接触区域的字线结构,并且至少部分地位于位线结构的顶部,但是与位线结构电隔离。
    • 9. 发明授权
    • DRAM with very shallow trench isolation
    • DRAM具有非常浅的沟槽隔离
    • US07034352B2
    • 2006-04-25
    • US10777332
    • 2004-02-11
    • Mihel SeitzVenkatachalam C. Jaiprakash
    • Mihel SeitzVenkatachalam C. Jaiprakash
    • H01L27/108
    • H01L27/10867H01L21/76224H01L27/10864
    • The methods and structures of the present invention involve providing a vertical dynamic random access memory (DRAM) cell device comprising a buried strap which can be laterally constrained, thereby maintaining freedom from cross talk, even at 6F2 scaling, in the absence of adjacent Shallow Trench Isolation (STI). The methods and structures of the present invention involve the further recognition that the STI can therefore be vertically confined, freed of any need to extend down below the level of the buried strap. The reduction of the buried strap to 1F width and the concomitant reduction in the depth of the STI together permit a significantly reduced aspect ratio, permitting critically improved manufacturability.
    • 本发明的方法和结构包括提供垂直动态随机存取存储器(DRAM)单元装置,其包括可以被横向约束的埋地带,从而即使在6F2缩放下,在没有相邻的浅沟槽的情况下也可以保持免受串扰的自由 隔离(STI)。 本发明的方法和结构涉及进一步的认识,因此STI可以被垂直地限制,而不需要向下延伸到埋藏带的水平以下。 将掩埋带减少到1F宽度并且伴随着STI的深度的降低允许显着减小的纵横比,从而允许严格改进的可制造性。