专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20100129647A1 Method of Weldbonding and a Device Comprising Weldbonded Components 有权
标题翻译：焊接方法和包含焊接部件的装置
公开(公告)号：US20100129647A1
公开(公告)日：2010-05-27
申请号：US12276786
申请日：2008-11-24
申请人： Venkata Adiseshaiah Bhagavatula , Roy Joseph Bourcier , Satish Chandra Chaparala , John Himmelreich
发明人： Venkata Adiseshaiah Bhagavatula , Roy Joseph Bourcier , Satish Chandra Chaparala , John Himmelreich
IPC分类号： B32B5/00 , B32B37/00
CPC分类号： G02B6/2551 , B29C65/1406 , B29C65/16 , B29C65/1616 , B29C65/1619 , B29C65/4815 , B29C65/4835 , B29C65/484 , B29C65/4845 , B29C65/72 , B29C66/21 , B29C66/3452 , B29C2035/0822 , B29C2035/0827 , G02B6/3801 , G02B6/4237 , G02B6/4239 , Y10T428/269 , Y10T428/31551 , Y10T428/31663 , Y10T428/31721
摘要： A method of assembling optoelectronic and/or photonic components, said method comprising: (i) providing at least two optoelectronic and/or photonic components; (ii) aligning and situating these components relative to one another and in close proximity with one another so as to: (a) provide optical coupling between these components; and (b) maintain the distance d between the adjacent parts of these components, where d is 0 to 100 μm; (iii) adhering these components to one another with while maintaining optical coupling therebetween; and (iv) laser welding these components together while maintaining optical coupling therebetween.
摘要翻译：一种组装光电子和/或光子组件的方法，所述方法包括：（i）提供至少两个光电子和/或光子分量; （ii）使这些部件相对于彼此并且彼此紧密地对准和定位，以便：（a）在这些部件之间提供光耦合; 和（b）保持这些组分的相邻部分之间的距离d，其中d为0至100μm; （iii）在保持它们之间的光耦合的同时将这些部件彼此粘合; 和（iv）将这些部件激光焊接在一起，同时保持它们之间的光耦合。

2. 发明授权

US08102887B2 Edge bonded optical packages 有权
标题翻译：边缘粘合光学封装
公开(公告)号：US08102887B2
公开(公告)日：2012-01-24
申请号：US12471681
申请日：2009-05-26
申请人： Venkata Adiseshaiah Bhagavatula , Satish Chandra Chaparala , John Himmelreich , Lawrence Charles Hughes, Jr.
发明人： Venkata Adiseshaiah Bhagavatula , Satish Chandra Chaparala , John Himmelreich , Lawrence Charles Hughes, Jr.
IPC分类号： H01S3/10
CPC分类号： G02B6/4245 , G02B6/4207 , G02B6/4228 , G02B6/4244 , G02B6/4265 , G02F1/37 , H01S5/0092 , H01S5/02216 , H01S5/02252
摘要： Particular embodiments of the present disclosure bring an SHG crystal, or other type of wavelength conversion device, into close proximity with a laser source to eliminate the need for coupling optics, reduce the number of package components, and reduce package volume. According to one embodiment of the present disclosure, an optical package is provided comprising a laser source subassembly comprising a laser base and a wavelength conversion device subassembly comprising a converter base. The bonding interface of the laser base is bonded the complementary bonding interface of the converter base such that the laser output face can be proximity-coupled to the converter input face at an predetermined interfacial spacing x. Additional embodiments are disclosed and claimed.
摘要翻译：本公开的特定实施例使得SHG晶体或其它类型的波长转换装置与激光源紧密相邻以消除对光耦合的需要，减少封装部件的数量并减小封装体积。根据本公开的一个实施例，提供了一种光学封装，其包括激光源子组件，其包括激光基座和包括转换器基座的波长转换器件子组件。激光基座的接合界面与转换器基座的互补接合界面结合，使得激光输出面可以以预定的界面间距x邻近耦合到转换器输入面。公开并要求保护附加实施例。

3. 发明申请

US20110129189A1 CLAD METAL SUBSTRATES IN OPTICAL PACKAGES 审中-公开
标题翻译：光学包装中的金属基材
公开(公告)号：US20110129189A1
公开(公告)日：2011-06-02
申请号：US12627762
申请日：2009-11-30
申请人： Venkata Adiseshaiah Bhagavatula , Satish Chandra Chaparala , John Himmelreich , Lawrence Charles Hughes, JR.
发明人： Venkata Adiseshaiah Bhagavatula , Satish Chandra Chaparala , John Himmelreich , Lawrence Charles Hughes, JR.
IPC分类号： G02B6/36
CPC分类号： H01S5/0092 , H01S5/02208 , H01S5/02248 , H01S5/02272 , H01S5/0228 , H01S5/02476
摘要： Embodiments of the present disclosure bring a wavelength conversion device into close proximity with a laser source to eliminate the need for coupling optics, reduce the number of package components, and reduce package volume. According to one embodiment of the present disclosure, an optical package is provided comprising a laser diode chip and a clad metal substrate. The clad metal substrate comprises a clad metal region that is mechanically coupled to a base metal region. The laser diode chip is coupled to the clad metal region. The clad metal region comprises a clad metal material having a thermal conductivity that is greater than a thermal conductivity of the base metal material. The clad metal region further comprises a coefficient of thermal expansion that is approximately equal to a coefficient of thermal expansion of the base metal material and is greater than a coefficient of thermal expansion of the laser diode chip.
摘要翻译：本公开的实施例使得波长转换装置与激光源紧密接合以消除对光耦合的需要，减少封装部件的数量并减小封装体积。根据本公开的一个实施例，提供了包括激光二极管芯片和复合金属基板的光学封装。复合金属基板包括机械耦合到基底金属区域的复合金属区域。激光二极管芯片耦合到复合金属区域。复合金属区域包括具有大于母材金属材料的导热率的导热率的复合金属材料。复合金属区域还包括大致等于贱金属材料的热膨胀系数的热膨胀系数，并且大于激光二极管芯片的热膨胀系数。

4. 发明申请

US20100303109A1 Proximity Coupled Athermal Optical Package Comprising Laser Source And Compound Facet Wavelength Conversion Device 审中-公开
标题翻译：包括激光源和复合面波长转换装置的接近耦合的热光学封装
公开(公告)号：US20100303109A1
公开(公告)日：2010-12-02
申请号：US12471666
申请日：2009-05-26
申请人： Venkata Adiseshaiah Bhagavatula , Satish Chandra Chaparala , John Himmelreich , Lawrence Charles Hughes, JR.
发明人： Venkata Adiseshaiah Bhagavatula , Satish Chandra Chaparala , John Himmelreich , Lawrence Charles Hughes, JR.
IPC分类号： H01S3/10 , G02F1/35
CPC分类号： G02B6/4203 , G02B6/4231
摘要： Particular embodiments of the present disclosure bring an SHG crystal, or other type of wavelength conversion device, into close proximity with a laser source to eliminate the need for coupling optics, reduce the number of package components, and reduce package volume. According to one embodiment of the present disclosure, an optical package is provided comprising a laser source and a wavelength conversion device. The laser source is positioned such that the output face of the laser source is proximity-coupled to a waveguide portion of the input face of the wavelength conversion device. The input face of the wavelength conversion device comprises an α-cut facet and β-cut facet. The α-cut facet of the input face is oriented at a horizontal angle α, relative to the waveguide of the wavelength conversion device to permit proximity coupling of the output face of the laser source and the input face of the wavelength conversion device. The β-cut facet of the input face is oriented at a horizontal angle β, relative to the waveguide of the wavelength conversion device to cooperate with the horizontal tilt angle of the device to reduce back reflections from the input face of the wavelength conversion device into the laser source. Additional embodiments are disclosed.
摘要翻译：本公开的特定实施例使得SHG晶体或其它类型的波长转换装置与激光源紧密相邻以消除对光耦合的需要，减少封装部件的数量并减小封装体积。根据本公开的一个实施例，提供了包括激光源和波长转换装置的光学封装。激光源被定位成使得激光源的输出面被接近耦合到波长转换装置的输入面的波导部分。波长转换装置的输入面包括α切面和切面。输入面的α切面相对于波长转换装置的波导以水平角α取向，以允许激光源的输出面与波长转换装置的输入面的接近耦合。相对于波长转换装置的波导，输入面的＆amp;刻面面以水平角度＆amp; bgr取向，以与装置的水平倾斜角配合以减少来自波长转换的输入面的反射反射设备进入激光源。公开了另外的实施例。

5. 发明授权

US08790483B2 Method of weldbonding and a device comprising weldbonded components 有权
标题翻译：焊接方法和包括焊接部件的装置
公开(公告)号：US08790483B2
公开(公告)日：2014-07-29
申请号：US12276786
申请日：2008-11-24
申请人： Venkata Adiseshaiah Bhagavatula , Roy Joseph Bourcier , Satish Chandra Chaparala , John Himmelreich
发明人： Venkata Adiseshaiah Bhagavatula , Roy Joseph Bourcier , Satish Chandra Chaparala , John Himmelreich
IPC分类号： B29C65/16 , G02B6/255 , G02B6/26
CPC分类号： G02B6/2551 , B29C65/1406 , B29C65/16 , B29C65/1616 , B29C65/1619 , B29C65/4815 , B29C65/4835 , B29C65/484 , B29C65/4845 , B29C65/72 , B29C66/21 , B29C66/3452 , B29C2035/0822 , B29C2035/0827 , G02B6/3801 , G02B6/4237 , G02B6/4239 , Y10T428/269 , Y10T428/31551 , Y10T428/31663 , Y10T428/31721
摘要： A method of assembling optoelectronic and/or photonic components, said method comprising: (i) providing at least two optoelectronic and/or photonic components; (ii) aligning and situating these components relative to one another and in close proximity with one another so as to: (a) provide optical coupling between these components; and (b) maintain the distance d between the adjacent parts of these components, where d is 0 to 100 μm; (iii) adhering these components to one another with while maintaining optical coupling therebetween; and (iv) laser welding these components together while maintaining optical coupling therebetween.
摘要翻译：一种组装光电子和/或光子组件的方法，所述方法包括：（i）提供至少两个光电子和/或光子分量; （ii）使这些部件相对于彼此并且彼此紧密地对准和定位，以便：（a）在这些部件之间提供光耦合; 和（b）保持这些组分的相邻部分之间的距离d，其中d为0至100μm; （iii）在保持它们之间的光耦合的同时将这些部件彼此粘合; 和（iv）将这些部件激光焊接在一起，同时保持它们之间的光耦合。

6. 发明授权

US08036508B2 Methods for passively aligning opto-electronic component assemblies on substrates 有权
标题翻译：在基板上被动对准光电组件的方法
公开(公告)号：US08036508B2
公开(公告)日：2011-10-11
申请号：US12563449
申请日：2009-09-21
申请人： Venkata Adiseshaiah Bhagavatula , Satish Chandra Chaparala , John Himmelreich
发明人： Venkata Adiseshaiah Bhagavatula , Satish Chandra Chaparala , John Himmelreich
IPC分类号： G02B6/42 , G02B6/36
CPC分类号： H01S5/02268 , H01S5/02272
摘要： A method for aligning an opto-electronic component assembly (OECA) on a substrate includes positioning a substrate on an assembly surface and positioning an OECA on the substrate such that a first OECA alignment face projects from a first substrate alignment face. The substrate and the OECA are advanced towards a contact face of a first assembly alignment mechanism such that the first substrate alignment face contacts the contact face of the first assembly alignment mechanism after the first OECA alignment face contacts the contact face. The OECA is displaced relative to the first substrate alignment face when the first OECA alignment face contacts the contact face and the substrate continues to move towards the contact face thereby aligning the OECA on the substrate relative to the first substrate alignment face.
摘要翻译：用于将光电子部件组件（OECA）对准在衬底上的方法包括将衬底定位在组件表面上并将OECA定位在衬底上，使得第一OECA对准面从第一衬底对准面突出。衬底和OECA朝向第一组件对准机构的接触面前进，使得第一衬底对准面在第一OECA对准面接触接触面之后接触第一组件对准机构的接触面。当第一OECA对准面接触接触面时，OECA相对于第一衬底对准面移位，并且衬底继续向接触面移动，从而使衬底上的OECA相对于第一衬底对准面对齐。

7. 发明申请

US20110069929A1 Methods for Passively Aligning Opto-Electronic Component Assemblies on Substrates 有权
标题翻译：基板上光电子元器件被动对准的方法
公开(公告)号：US20110069929A1
公开(公告)日：2011-03-24
申请号：US12563449
申请日：2009-09-21
申请人： Venkata Adiseshaiah Bhagavatula , Satish Chandra Chaparala , John Himmelreich
发明人： Venkata Adiseshaiah Bhagavatula , Satish Chandra Chaparala , John Himmelreich
IPC分类号： G02B6/36 , G02B6/42
CPC分类号： H01S5/02268 , H01S5/02272
摘要： A method for aligning an opto-electronic component assembly (OECA) on a substrate includes positioning a substrate on an assembly surface and positioning an OECA on the substrate such that a first OECA alignment face projects from a first substrate alignment face. The substrate and the OECA are advanced towards a contact face of a first assembly alignment mechanism such that the first substrate alignment face contacts the contact face of the first assembly alignment mechanism after the first OECA alignment face contacts the contact face. The OECA is displaced relative to the first substrate alignment face when the first OECA alignment face contacts the contact face and the substrate continues to move towards the contact face thereby aligning the OECA on the substrate relative to the first substrate alignment face.
摘要翻译：用于将光电子部件组件（OECA）对准在衬底上的方法包括将衬底定位在组件表面上并将OECA定位在衬底上，使得第一OECA对准面从第一衬底对准面突出。衬底和OECA朝向第一组件对准机构的接触面前进，使得第一衬底对准面在第一OECA对准面接触接触面之后接触第一组件对准机构的接触面。当第一OECA对准面接触接触面时，OECA相对于第一衬底对准面移位，并且衬底继续向接触面移动，从而使衬底上的OECA相对于第一衬底对准面对齐。

8. 发明申请

US20100303110A1 Edge Bonded Optical Packages 有权
标题翻译：边缘光纤封装
公开(公告)号：US20100303110A1
公开(公告)日：2010-12-02
申请号：US12471681
申请日：2009-05-26
申请人： Venkata Adiseshaiah Bhagavatula , Satish Chandra Chaparala , John Himmelreich , Lawrence Charles Hughes, JR.
发明人： Venkata Adiseshaiah Bhagavatula , Satish Chandra Chaparala , John Himmelreich , Lawrence Charles Hughes, JR.
IPC分类号： H01S3/10
CPC分类号： G02B6/4245 , G02B6/4207 , G02B6/4228 , G02B6/4244 , G02B6/4265 , G02F1/37 , H01S5/0092 , H01S5/02216 , H01S5/02252
摘要： Particular embodiments of the present disclosure bring an SHG crystal, or other type of wavelength conversion device, into close proximity with a laser source to eliminate the need for coupling optics, reduce the number of package components, and reduce package volume. According to one embodiment of the present disclosure, an optical package is provided comprising a laser source subassembly comprising a laser base and a wavelength conversion device subassembly comprising a converter base. The bonding interface of the laser base is bonded the complementary bonding interface of the converter base such that the laser output face can be proximity-coupled to the converter input face at an predetermined interfacial spacing x. Additional embodiments are disclosed and claimed.
摘要翻译：本公开的特定实施例使得SHG晶体或其它类型的波长转换装置与激光源紧密相邻以消除对光耦合的需要，减少封装部件的数量并减小封装体积。根据本公开的一个实施例，提供了一种光学封装件，其包括激光源子组件，该激光源子组件包括激光器基座和包括转换器基座的波长转换器件子组件。激光基座的接合界面与转换器基座的互补接合界面结合，使得激光输出面可以以预定的界面间距x邻近耦合到转换器输入面。公开并要求保护附加实施例。

9. 发明申请

US20110267682A1 PROXIMITY COUPLED ATHERMAL OPTICAL PACKAGE COMPRISING LASER SOURCE AND COMPOUND FACET WAVELENGTH CONVERSION DEVICE 审中-公开
标题翻译：包含激光源和化合物波长变换器件的近似光耦合光学封装
公开(公告)号：US20110267682A1
公开(公告)日：2011-11-03
申请号：US13178782
申请日：2011-07-08
申请人： Venkata Adisehaiah Bhagavatula , Satish Chandra Chaparala , John Himmelreich , Lawrence Charles Hughes, JR.
发明人： Venkata Adisehaiah Bhagavatula , Satish Chandra Chaparala , John Himmelreich , Lawrence Charles Hughes, JR.
IPC分类号： G02F1/35
CPC分类号： G02B6/4203 , G02B6/4231
摘要： Particular embodiments of the present disclosure bring an SHG crystal, or other type of wavelength conversion device, into close proximity with a laser source to eliminate the need for coupling optics, reduce the number of package components, and reduce package volume. According to one embodiment of the present disclosure, an optical package is provided comprising a laser source and a wavelength conversion device. The laser source is positioned such that the output face of the laser source is proximity-coupled to a waveguide portion of the input face of the wavelength conversion device. The input face of the wavelength conversion device comprises an α-cut facet and β-cut facet. The α-cut facet of the input face is oriented at a horizontal angle α, relative to the waveguide of the wavelength conversion device to permit proximity coupling of the output face of the laser source and the input face of the wavelength conversion device. The β-cut facet of the input face is oriented at a horizontal angle β, relative to the waveguide of the wavelength conversion device to cooperate with the horizontal tilt angle of the device to reduce back reflections from the input face of the wavelength conversion device into the laser source. Additional embodiments are disclosed.
摘要翻译：本公开的特定实施例使得SHG晶体或其它类型的波长转换装置与激光源紧密相邻以消除对光耦合的需要，减少封装部件的数量并减小封装体积。根据本公开的一个实施例，提供了包括激光源和波长转换装置的光学封装。激光源被定位成使得激光源的输出面被接近耦合到波长转换装置的输入面的波导部分。波长转换装置的输入面包括α切面和切面。相对于波长转换装置的波导，输入面的α切面朝向水平角α，以允许激光源的输出面与波长转换装置的输入面的接近耦合。相对于波长转换装置的波导，输入面的＆amp;刻面面以水平角度＆amp; bgr取向，以与装置的水平倾斜角配合以减少来自波长转换的输入面的反射反射设备进入激光源。公开了另外的实施例。

10. 发明申请

US20100265982A1 Fracture Resistant Metallization Pattern For Semiconductor Lasers 有权
标题翻译：半导体激光器的耐断裂金属化模式
公开(公告)号：US20100265982A1
公开(公告)日：2010-10-21
申请号：US12426563
申请日：2009-04-20
申请人： Satish Chandra Chaparala , Martin Hai Hu , Lawrence Charles Hughes, JR. , Chung-En Zah
发明人： Satish Chandra Chaparala , Martin Hai Hu , Lawrence Charles Hughes, JR. , Chung-En Zah
IPC分类号： H01S5/00 , H01S5/026
CPC分类号： H01S5/0425 , H01S5/0092 , H01S5/06256
摘要： Metallization patterns are provided to reduce the probability of chip fracture in semiconductor lasers. According to one embodiment disclosed herein, the pad edges of a metallization pattern extend across a plurality of crystallographic planes in the laser substrate. In this manner, cracks initiated at any given stress concentration would need to propagate across many crystallographic planes in the substrate to reach a significant size. Additional embodiments of the present disclosure relate to the respective geometries and orientations of adjacent pairs of contact pads. Still further embodiments are disclosed and claimed.
摘要翻译：提供金属化模式以减少半导体激光器中芯片断裂的可能性。根据本文公开的一个实施例，金属化图案的焊盘边缘延伸穿过激光基板中的多个结晶平面。以这种方式，在任何给定的应力集中开始的裂纹将需要传播到衬底中的许多结晶平面以达到显着的尺寸。本公开的另外的实施例涉及相邻的接触垫对的各自的几何形状和取向。公开和要求保护的另外的实施例。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式