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1. 发明授权

US07429502B2 Integrated circuit device incorporating metallurgical bond to enhance thermal conduction to a heat sink 有权
标题翻译：集成电路器件结合冶金结合，以增强对散热片的热传导
公开(公告)号：US07429502B2
公开(公告)日：2008-09-30
申请号：US11868624
申请日：2007-10-08
申请人： Vance D. Archer, III , Kouros Azimi , Daniel Patrick Chesire , Warren K Gladden , Seung H. Kang , Taeho Kook , Sailesh M. Merchant , Vivian Ryan
发明人： Vance D. Archer, III , Kouros Azimi , Daniel Patrick Chesire , Warren K Gladden , Seung H. Kang , Taeho Kook , Sailesh M. Merchant , Vivian Ryan
IPC分类号： H01L21/00
CPC分类号： H01L23/36 , H01L21/4871 , H01L25/165 , H01L2224/16 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2924/01019 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/15311 , H01L2924/16195 , H01L2924/00
摘要： An integrated circuit device incorporating a metallurgical bond to enhance thermal conduction to a heat sink. In a semiconductor device, a surface of an integrated circuit die is metallurgically bonded to a surface of a heat sink. In an exemplary method of manufacturing the device, the upper surface of a package substrate includes an inner region and a peripheral region. The integrated circuit die is positioned over the substrate surface and a first surface of the integrated circuit die is placed in contact with the package substrate. A metallic layer is formed on a second opposing surface of the integrated circuit die. A preform is positioned on the metallic layer and a heat sink is positioned over the preform. A joint layer is formed with the preform, metallurgically bonding the heat sink to the second surface of the integrated circuit die.
摘要翻译：一种集成电路装置，其包括冶金结合以增强对散热器的热传导。在半导体器件中，集成电路管芯的表面冶金地结合到散热器的表面。在制造器件的示例性方法中，封装衬底的上表面包括内部区域和周边区域。集成电路管芯位于衬底表面上，并且集成电路管芯的第一表面被放置成与封装衬底接触。金属层形成在集成电路管芯的第二相对表面上。预成型件定位在金属层上，并且散热器位于预制件上。用预成型件形成接合层，将散热器冶金结合到集成电路管芯的第二表面。

2. 发明授权

US07327029B2 Integrated circuit device incorporating metallurigical bond to enhance thermal conduction to a heat sink 有权
标题翻译：集成电路器件结合了金属结合，以增强散热片的热传导
公开(公告)号：US07327029B2
公开(公告)日：2008-02-05
申请号：US11235920
申请日：2005-09-27
申请人： Vance D. Archer, III , Kouros Azimi , Daniel Patrick Chesire , Warren K Gladden , Seung H. Kang , Taeho Kook , Sailesh M. Merchant , Vivian Ryan
发明人： Vance D. Archer, III , Kouros Azimi , Daniel Patrick Chesire , Warren K Gladden , Seung H. Kang , Taeho Kook , Sailesh M. Merchant , Vivian Ryan
IPC分类号： H01L23/34
CPC分类号： H01L23/36 , H01L21/4871 , H01L25/165 , H01L2224/16 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2924/01019 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/15311 , H01L2924/16195 , H01L2924/00
摘要： An integrated circuit device incorporating a metallurgical bond to enhance thermal conduction to a heat sink. In a semiconductor device, a surface of an integrated circuit die is metallurgically bonded to a surface of a heat sink. In an exemplary method of manufacturing the device, the upper surface of a package substrate includes an inner region and a peripheral region. The integrated circuit die is positioned over the substrate surface and a first surface of the integrated circuit die is placed in contact with the package substrate. A metallic layer is formed on a second opposing surface of the integrated circuit die. A preform is positioned on the metallic layer and a heat sink is positioned over the preform. A joint layer is formed with the preform, metallurgically bonding the heat sink to the second surface of the integrated circuit die.
摘要翻译：一种集成电路装置，其包括冶金结合以增强对散热器的热传导。在半导体器件中，集成电路管芯的表面冶金地结合到散热器的表面。在制造器件的示例性方法中，封装衬底的上表面包括内部区域和周边区域。集成电路管芯位于衬底表面上，并且集成电路管芯的第一表面被放置成与封装衬底接触。金属层形成在集成电路管芯的第二相对表面上。预成型件定位在金属层上，并且散热器位于预制件上。用预成型件形成接合层，将散热器冶金结合到集成电路管芯的第二表面。

3. 发明申请

US20070069368A1 Integrated circuit device incorporating metallurigacal bond to enhance thermal conduction to a heat sink 有权
标题翻译：集成电路装置结合了金属结合键，以增强散热片的热传导
公开(公告)号：US20070069368A1
公开(公告)日：2007-03-29
申请号：US11235920
申请日：2005-09-27
申请人： Vance Archer , Kouros Azimi , Daniel Chesire , Warren Gladden , Seung Kang , Taeho Kook , Sailesh Merchant , Vivian Ryan
发明人： Vance Archer , Kouros Azimi , Daniel Chesire , Warren Gladden , Seung Kang , Taeho Kook , Sailesh Merchant , Vivian Ryan
IPC分类号： H01L23/34
CPC分类号： H01L23/36 , H01L21/4871 , H01L25/165 , H01L2224/16 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2924/01019 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/15311 , H01L2924/16195 , H01L2924/00
摘要： An integrated circuit device incorporating a metallurgical bond to enhance thermal conduction to a heat sink. In a semiconductor device, a surface of an integrated circuit die is metallurgically bonded to a surface of a heat sink. In an exemplary method of manufacturing the device, the upper surface of a package substrate includes an inner region and a peripheral region. The integrated circuit die is positioned over the substrate surface and a first surface of the integrated circuit die is placed in contact with the package substrate. A metallic layer is formed on a second opposing surface of the integrated circuit die. A preform is positioned on the metallic layer and a heat sink is positioned over the preform. A joint layer is formed with the preform, metallurgically bonding the heat sink to the second surface of the integrated circuit die.
摘要翻译：一种集成电路装置，其包括冶金结合以增强对散热器的热传导。在半导体器件中，集成电路管芯的表面冶金地结合到散热器的表面。在制造器件的示例性方法中，封装衬底的上表面包括内部区域和周边区域。集成电路管芯位于衬底表面上，并且集成电路管芯的第一表面被放置成与封装衬底接触。金属层形成在集成电路管芯的第二相对表面上。预成型件定位在金属层上，并且散热器位于预制件上。用预成型件形成接合层，将散热器冶金结合到集成电路管芯的第二表面。

4. 发明申请

US20080026508A1 Integrated Circuit Device Incorporating Metallurgical Bond to Enhance Thermal Conduction to a Heat Sink 有权
标题翻译：集成电路装置结合冶金结合以增强散热片的导热
公开(公告)号：US20080026508A1
公开(公告)日：2008-01-31
申请号：US11868624
申请日：2007-10-08
申请人： Vance Archer , Kouros Azimi , Daniel Chesire , Warren Gladden , Seung Kang , Taeho Kook , Sailesh Merchant , Vivian Ryan
发明人： Vance Archer , Kouros Azimi , Daniel Chesire , Warren Gladden , Seung Kang , Taeho Kook , Sailesh Merchant , Vivian Ryan
IPC分类号： H01L21/00
CPC分类号： H01L23/36 , H01L21/4871 , H01L25/165 , H01L2224/16 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2924/01019 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/15311 , H01L2924/16195 , H01L2924/00
摘要： An integrated circuit device incorporating a metallurgical bond to enhance thermal conduction to a heat sink. In a semiconductor device, a surface of an integrated circuit die is metallurgically bonded to a surface of a heat sink. In an exemplary method of manufacturing the device, the upper surface of a package substrate includes an inner region and a peripheral region. The integrated circuit die is positioned over the substrate surface and a first surface of the integrated circuit die is placed in contact with the package substrate. A metallic layer is formed on a second opposing surface of the integrated circuit die. A preform is positioned on the metallic layer and a heat sink is positioned over the preform. A joint layer is formed with the preform, metallurgically bonding the heat sink to the second surface of the integrated circuit die.
摘要翻译：一种集成电路装置，其包括冶金结合以增强对散热器的热传导。在半导体器件中，集成电路管芯的表面冶金地结合到散热器的表面。在制造器件的示例性方法中，封装衬底的上表面包括内部区域和周边区域。集成电路管芯位于衬底表面上，并且集成电路管芯的第一表面被放置成与封装衬底接触。金属层形成在集成电路管芯的第二相对表面上。预成型件定位在金属层上，并且散热器位于预制件上。用预成型件形成接合层，将散热器冶金结合到集成电路管芯的第二表面。

5. 发明申请

US20120068762A1 Method and Apparatus for Regulating a Power Supply of an Integrated Circuit 有权
标题翻译：用于调节集成电路电源的方法和装置
公开(公告)号：US20120068762A1
公开(公告)日：2012-03-22
申请号：US13304759
申请日：2011-11-28
申请人： Kouros Azimi , Mohammad S. Mobin , Gregory W. Sheets , Lane A. Smith
发明人： Kouros Azimi , Mohammad S. Mobin , Gregory W. Sheets , Lane A. Smith
IPC分类号： H02J4/00
CPC分类号： H02J1/00
摘要： Disclosed is a circuit for adjusting a voltage supplied to an IC by a power supply circuit that produces a regulated-output voltage based on an output-control signal generated by a resistive voltage divider. The circuit includes a PVT detector configured to generate an interface control signal and an interface circuit (i) connected to PVT detector and to the resistive voltage divider and (ii) configured to adjust its resistance in response to the interface control signal. Adjusting the resistance of the interface circuit causes the voltage of the output-control signal to be adjusted, thus causing the power supply circuit to adjust the regulated output voltage.
摘要翻译：公开了一种用于通过电源电路来调节提供给IC的电压的电路，该电源电路基于由电阻分压器产生的输出控制信号产生调节输出电压。电路包括配置成产生接口控制信号的PVT检测器和连接到PVT检测器和电阻分压器的接口电路（i），以及（ii）被配置为响应于接口控制信号调整其电阻。调整接口电路的电阻可以调节输出控制信号的电压，从而使电源电路调整稳压输出电压。

6. 发明授权

US07977989B2 Method and apparatus for detecting and adjusting characteristics of a signal 失效
标题翻译：用于检测和调整信号特性的方法和装置
公开(公告)号：US07977989B2
公开(公告)日：2011-07-12
申请号：US12730671
申请日：2010-03-24
申请人： Kouros Azimi , Mohammad S. Mobin , Gregory W. Sheets , Lane A. Smith
发明人： Kouros Azimi , Mohammad S. Mobin , Gregory W. Sheets , Lane A. Smith
IPC分类号： H03K5/12
CPC分类号： H03K5/02 , H03K5/06 , H03K19/017581 , H04L25/0288
摘要： Disclosed is a circuit that adjusts a characteristic of a signal transmitted from a transmitter to a receiver over a communication channel (e.g., a wire, a backplane, etc.). The circuit includes a latch that receives the signal at a predetermined point in the circuit and samples a voltage of the signal many times after a threshold voltage is applied to the latch. The circuit also includes a processor that determines the characteristic of the signal when the sampled voltages indicate a transition point and that adjusts the threshold voltage when the sampled voltages do not indicate a transition point. The processor adjusts the characteristic of the signal by adjusting at least one of a current and a voltage of the transmitter when the characteristic of the signal is outside a predetermined range.
摘要翻译：公开了一种通过通信信道（例如，线，背板等）调整从发射机发射到接收机的信号的特性的电路。该电路包括一个锁存器，该锁存器在阈值电压施加到锁存器之后多次接收电路中预定点处的信号并对信号的电压进行多次采样。该电路还包括一个处理器，当采样电压指示转换点时，确定信号的特性，并且当采样电压不指示转换点时调整阈值电压。当信号的特性在预定范围之外时，处理器通过调节发射机的电流和电压中的至少一个来调整信号的特性。

7. 发明授权

US07948914B2 Power learning security in wireless routers 有权
标题翻译：无线路由器的电力学习安全
公开(公告)号：US07948914B2
公开(公告)日：2011-05-24
申请号：US12322028
申请日：2009-01-28
申请人： Kouros Azimi , Mohammad Mobin , Roger Fratti , Sailesh Merchant , Kenneth Paist
发明人： Kouros Azimi , Mohammad Mobin , Roger Fratti , Sailesh Merchant , Kenneth Paist
IPC分类号： G01R31/08
CPC分类号： H04W48/04 , H04W12/06 , H04W64/00
摘要： In described embodiments, elements of a wireless home network employ learned power security for the network. An access point, router, or other wireless base station emits and receives signals having corresponding signal strengths. Wireless devices coupled to the base station through a radio link are moved through the home network at boundary points of the home and the signal strength is measured at each device and communicated to the base station. Based on the signal strength information from the emitted signals measured at the boundary points and/or from measured signal strength information of signals received from the boundary points, the base station determines a network secure area. The base station declines permission of devices attempting to use or join the home network that exhibit signal strength characteristics less than boundary values for the network secure area.
摘要翻译：在所描述的实施例中，无线家庭网络的元件采用学习的网络安全性。接入点，路由器或其他无线基站发射和接收具有相应信号强度的信号。通过无线电链路耦合到基站的无线设备在家庭的边界点移动通过家庭网络，并且在每个设备处测量信号强度并将其传送到基站。基于从边界点测量的发射信号的信号强度信息和/或从边界点接收的信号的测量信号强度信息，基站确定网络安全区域。基站拒绝尝试使用或加入家庭网络的设备的权限，这些设备的信号强度特性小于网络安全区域的边界值。

8. 发明申请

US20100250234A1 Receipt Translation for Vouchering 审中-公开
标题翻译：收据翻译
公开(公告)号：US20100250234A1
公开(公告)日：2010-09-30
申请号：US12413958
申请日：2009-03-30
申请人： Kouros Azimi , Sailesh Merchant
发明人： Kouros Azimi , Sailesh Merchant
IPC分类号： G06F17/28
CPC分类号： G06F17/289
摘要： In described embodiments, a point of sale system, such as a cash register, provides for translation from standard language to desired native language on a receipt. Translation might be initiated through user (e.g., purchaser) input, manually or from a credit card, for example, and translation is accomplished through a database accessed by the point of sale system. Consequently, the point of sale system provides at least one receipt to the purchaser that identifies purchases as line item descriptions, and, in some cases, the price paid for each line item, in the purchaser's native language that might be used, for example, to accurately prepare vouchers.
摘要翻译：在所描述的实施例中，诸如收银机的销售点系统在收据上提供从标准语言到期望母语的翻译。可以例如通过用户（例如，购买者）手动地或从信用卡输入翻译，并且通过由销售点系统访问的数据库来实现翻译。因此，销售点系统向购买者提供至少一个识别订单项目描述的收货单，并且在某些情况下，以可能使用的购买者本地语言为每个行项目支付的价格，例如，准确准备优惠券。

9. 发明授权

US07791368B2 Method and apparatus for regulating a power supply of an integrated circuit 有权
标题翻译：用于调节集成电路的电源的方法和装置
公开(公告)号：US07791368B2
公开(公告)日：2010-09-07
申请号：US12012733
申请日：2008-02-05
申请人： Kouros Azimi , Mohammad S. Mobin , Gregory W. Sheets , Lane A. Smith
发明人： Kouros Azimi , Mohammad S. Mobin , Gregory W. Sheets , Lane A. Smith
IPC分类号： H03K17/16 , H03K19/003
CPC分类号： H02J1/06
摘要： Disclosed is a circuit for adjusting a voltage supplied to an IC by a power supply. The circuit includes a PVT detector configured to generate a control signal and an adjustable resistance device configured to adjust its resistance in response to the control signal.
摘要翻译：公开了一种用于通过电源调节提供给IC的电压的电路。电路包括被配置为产生控制信号的PVT检测器和被配置为响应于控制信号调整其电阻的可调电阻器件。

10. 发明授权

US06239510B1 Reduced impact power up/down mode in electrical circuits 有权
标题翻译：降低电路中的冲击功率上/下模式
公开(公告)号：US06239510B1
公开(公告)日：2001-05-29
申请号：US09359203
申请日：1999-07-22
申请人： Kouros Azimi , Bahram G. Kermani , Jonathan H. Fischer
发明人： Kouros Azimi , Bahram G. Kermani , Jonathan H. Fischer
IPC分类号： H02J100
CPC分类号： H02J1/14 , Y10T307/461
摘要： An apparatus and method for reducing variations in a supply voltage signal. The voltage signal which powers a circuit is regulated by adding or removing a series of redundant loads to the circuit. The redundant loads are normally not connected to the circuit. However, when one of the loads of the circuit is switched out of the circuit, one or more of the redundant loads are switched into the circuit, and then removed gradually from the circuit. When one of the loads of the circuit is to be switched into the circuit, one or more of the redundant loads are switched into the circuit first, then switched out of the circuit when the load is switched in. Thus, the voltage supply sees almost the same load during a turn-on and turn-off transition period, and variations in the voltage signal are reduced.
摘要翻译：一种用于减小电源电压信号变化的装置和方法。对电路供电的电压信号通过向电路中添加或删除一系列冗余负载来调节。冗余负载通常不连接到电路。然而，当电路的一个负载从电路切换出来时，一个或多个冗余负载被切换到电路中，然后逐渐从电路中移除。当电路中的一个负载切换到电路中时，首先将一个或多个冗余负载切换到电路中，然后在负载切换时切换到电路中。因此，电源几乎可以看到在导通和关断过渡期间的相同负载以及电压信号的变化减小。

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