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1. 发明申请

US20100188987A1 Power learning security in wireless routers 有权
标题翻译：无线路由器的电力学习安全
公开(公告)号：US20100188987A1
公开(公告)日：2010-07-29
申请号：US12322028
申请日：2009-01-28
申请人： Kouros Azimi , Roger Fratti , Sailesh Merchant , Mohammad Mobin , Kenneth Paist
发明人： Kouros Azimi , Roger Fratti , Sailesh Merchant , Mohammad Mobin , Kenneth Paist
IPC分类号： G08C15/00
CPC分类号： H04W48/04 , H04W12/06 , H04W64/00
摘要： In described embodiments, elements of a wireless home network employ learned power security for the network. An access point, router, or other wireless base station emits and receives signals having corresponding signal strengths. Wireless devices coupled to the base station through a radio link are moved through the home network at boundary points of the home and the signal strength is measured at each device and communicated to the base station. Based on the signal strength information from the emitted signals measured at the boundary points and/or from measured signal strength information of signals received from the boundary points, the base station determines a network secure area. The base station declines permission of devices attempting to use or join the home network that exhibit signal strength characteristics less than boundary values for the network secure area.
摘要翻译：在所描述的实施例中，无线家庭网络的元件采用学习的网络安全性。接入点，路由器或其他无线基站发射和接收具有相应信号强度的信号。通过无线电链路耦合到基站的无线设备在家庭的边界点移动通过家庭网络，并且在每个设备处测量信号强度并将其传送到基站。基于从边界点测量的发射信号的信号强度信息和/或从边界点接收的信号的测量信号强度信息，基站确定网络安全区域。基站拒绝尝试使用或加入家庭网络的设备的权限，这些设备的信号强度特性小于网络安全区域的边界值。

2. 发明申请

US20100331628A1 Wireless Monitoring and Control of Medical Devices 审中-公开
标题翻译：医疗器械无线监控
公开(公告)号：US20100331628A1
公开(公告)日：2010-12-30
申请号：US12493608
申请日：2009-06-29
申请人： Sailesh Merchant , Kouros Azimi , Mohammad Mobin
发明人： Sailesh Merchant , Kouros Azimi , Mohammad Mobin
IPC分类号： A61B5/00 , G08B23/00
CPC分类号： A61B5/02 , A61B5/00
摘要： In described embodiments, a data collection device receives signals from one or more patient monitoring devices, the signals representing patient data and other vital signs measured at a patient. The data collection device employs statistical quality algorithms to track irregular behavior and out-of-bound events, the behavior and events either being pre-set, adaptively set, or otherwise defined within pre-determined limits. The data collection device communicates alerting signals to a caregiver's handheld device when the irregular behavior and out-of-bound events occur. The alerting signals contain information related to the patient data, irregular behavior and out-of-bound events, thereby allowing a caregiver to take appropriate action.
摘要翻译：在所描述的实施例中，数据收集装置从一个或多个患者监视装置接收信号，该信号表示在患者处测量的患者数据和其他生命体征。数据收集装置采用统计质量算法来跟踪不规则行为和超出事件，行为和事件被预先设定，自适应地设置或以其他方式定义在预定的限度内。当发生不规则行为和超出事件时，数据收集设备将警报信号传达给照顾者的手持设备。警报信号包含与患者数据相关的信息，不规则行为和超出事件，从而允许照顾者采取适当的行动。

3. 发明申请

US20080026508A1 Integrated Circuit Device Incorporating Metallurgical Bond to Enhance Thermal Conduction to a Heat Sink 有权
标题翻译：集成电路装置结合冶金结合以增强散热片的导热
公开(公告)号：US20080026508A1
公开(公告)日：2008-01-31
申请号：US11868624
申请日：2007-10-08
申请人： Vance Archer , Kouros Azimi , Daniel Chesire , Warren Gladden , Seung Kang , Taeho Kook , Sailesh Merchant , Vivian Ryan
发明人： Vance Archer , Kouros Azimi , Daniel Chesire , Warren Gladden , Seung Kang , Taeho Kook , Sailesh Merchant , Vivian Ryan
IPC分类号： H01L21/00
CPC分类号： H01L23/36 , H01L21/4871 , H01L25/165 , H01L2224/16 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2924/01019 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/15311 , H01L2924/16195 , H01L2924/00
摘要： An integrated circuit device incorporating a metallurgical bond to enhance thermal conduction to a heat sink. In a semiconductor device, a surface of an integrated circuit die is metallurgically bonded to a surface of a heat sink. In an exemplary method of manufacturing the device, the upper surface of a package substrate includes an inner region and a peripheral region. The integrated circuit die is positioned over the substrate surface and a first surface of the integrated circuit die is placed in contact with the package substrate. A metallic layer is formed on a second opposing surface of the integrated circuit die. A preform is positioned on the metallic layer and a heat sink is positioned over the preform. A joint layer is formed with the preform, metallurgically bonding the heat sink to the second surface of the integrated circuit die.
摘要翻译：一种集成电路装置，其包括冶金结合以增强对散热器的热传导。在半导体器件中，集成电路管芯的表面冶金地结合到散热器的表面。在制造器件的示例性方法中，封装衬底的上表面包括内部区域和周边区域。集成电路管芯位于衬底表面上，并且集成电路管芯的第一表面被放置成与封装衬底接触。金属层形成在集成电路管芯的第二相对表面上。预成型件定位在金属层上，并且散热器位于预制件上。用预成型件形成接合层，将散热器冶金结合到集成电路管芯的第二表面。

4. 发明授权

US07948914B2 Power learning security in wireless routers 有权
标题翻译：无线路由器的电力学习安全
公开(公告)号：US07948914B2
公开(公告)日：2011-05-24
申请号：US12322028
申请日：2009-01-28
申请人： Kouros Azimi , Mohammad Mobin , Roger Fratti , Sailesh Merchant , Kenneth Paist
发明人： Kouros Azimi , Mohammad Mobin , Roger Fratti , Sailesh Merchant , Kenneth Paist
IPC分类号： G01R31/08
CPC分类号： H04W48/04 , H04W12/06 , H04W64/00
摘要： In described embodiments, elements of a wireless home network employ learned power security for the network. An access point, router, or other wireless base station emits and receives signals having corresponding signal strengths. Wireless devices coupled to the base station through a radio link are moved through the home network at boundary points of the home and the signal strength is measured at each device and communicated to the base station. Based on the signal strength information from the emitted signals measured at the boundary points and/or from measured signal strength information of signals received from the boundary points, the base station determines a network secure area. The base station declines permission of devices attempting to use or join the home network that exhibit signal strength characteristics less than boundary values for the network secure area.
摘要翻译：在所描述的实施例中，无线家庭网络的元件采用学习的网络安全性。接入点，路由器或其他无线基站发射和接收具有相应信号强度的信号。通过无线电链路耦合到基站的无线设备在家庭的边界点移动通过家庭网络，并且在每个设备处测量信号强度并将其传送到基站。基于从边界点测量的发射信号的信号强度信息和/或从边界点接收的信号的测量信号强度信息，基站确定网络安全区域。基站拒绝尝试使用或加入家庭网络的设备的权限，这些设备的信号强度特性小于网络安全区域的边界值。

5. 发明申请

US20100250234A1 Receipt Translation for Vouchering 审中-公开
标题翻译：收据翻译
公开(公告)号：US20100250234A1
公开(公告)日：2010-09-30
申请号：US12413958
申请日：2009-03-30
申请人： Kouros Azimi , Sailesh Merchant
发明人： Kouros Azimi , Sailesh Merchant
IPC分类号： G06F17/28
CPC分类号： G06F17/289
摘要： In described embodiments, a point of sale system, such as a cash register, provides for translation from standard language to desired native language on a receipt. Translation might be initiated through user (e.g., purchaser) input, manually or from a credit card, for example, and translation is accomplished through a database accessed by the point of sale system. Consequently, the point of sale system provides at least one receipt to the purchaser that identifies purchases as line item descriptions, and, in some cases, the price paid for each line item, in the purchaser's native language that might be used, for example, to accurately prepare vouchers.
摘要翻译：在所描述的实施例中，诸如收银机的销售点系统在收据上提供从标准语言到期望母语的翻译。可以例如通过用户（例如，购买者）手动地或从信用卡输入翻译，并且通过由销售点系统访问的数据库来实现翻译。因此，销售点系统向购买者提供至少一个识别订单项目描述的收货单，并且在某些情况下，以可能使用的购买者本地语言为每个行项目支付的价格，例如，准确准备优惠券。

6. 发明申请

US20070069368A1 Integrated circuit device incorporating metallurigacal bond to enhance thermal conduction to a heat sink 有权
标题翻译：集成电路装置结合了金属结合键，以增强散热片的热传导
公开(公告)号：US20070069368A1
公开(公告)日：2007-03-29
申请号：US11235920
申请日：2005-09-27
申请人： Vance Archer , Kouros Azimi , Daniel Chesire , Warren Gladden , Seung Kang , Taeho Kook , Sailesh Merchant , Vivian Ryan
发明人： Vance Archer , Kouros Azimi , Daniel Chesire , Warren Gladden , Seung Kang , Taeho Kook , Sailesh Merchant , Vivian Ryan
IPC分类号： H01L23/34
CPC分类号： H01L23/36 , H01L21/4871 , H01L25/165 , H01L2224/16 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2924/01019 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/15311 , H01L2924/16195 , H01L2924/00
摘要： An integrated circuit device incorporating a metallurgical bond to enhance thermal conduction to a heat sink. In a semiconductor device, a surface of an integrated circuit die is metallurgically bonded to a surface of a heat sink. In an exemplary method of manufacturing the device, the upper surface of a package substrate includes an inner region and a peripheral region. The integrated circuit die is positioned over the substrate surface and a first surface of the integrated circuit die is placed in contact with the package substrate. A metallic layer is formed on a second opposing surface of the integrated circuit die. A preform is positioned on the metallic layer and a heat sink is positioned over the preform. A joint layer is formed with the preform, metallurgically bonding the heat sink to the second surface of the integrated circuit die.
摘要翻译：一种集成电路装置，其包括冶金结合以增强对散热器的热传导。在半导体器件中，集成电路管芯的表面冶金地结合到散热器的表面。在制造器件的示例性方法中，封装衬底的上表面包括内部区域和周边区域。集成电路管芯位于衬底表面上，并且集成电路管芯的第一表面被放置成与封装衬底接触。金属层形成在集成电路管芯的第二相对表面上。预成型件定位在金属层上，并且散热器位于预制件上。用预成型件形成接合层，将散热器冶金结合到集成电路管芯的第二表面。

7. 发明申请

US20070069394A1 SOLDER BUMP STRUCTURE FOR FLIP CHIP SEMICONDUCTOR DEVICES AND METHOD OF MANUFACTURE THEREFORE 有权
标题翻译：片状半导体器件的焊接结构及其制造方法
公开(公告)号：US20070069394A1
公开(公告)日：2007-03-29
申请号：US11459249
申请日：2006-07-21
申请人： Mark Bachman , Donald Bitting , Sailesh Chittipeddi , Seung Kang , Sailesh Merchant
发明人： Mark Bachman , Donald Bitting , Sailesh Chittipeddi , Seung Kang , Sailesh Merchant
IPC分类号： H01L23/48
CPC分类号： H01L24/14 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L2224/02125 , H01L2224/0401 , H01L2224/05006 , H01L2224/05022 , H01L2224/05093 , H01L2224/05096 , H01L2224/05556 , H01L2224/05568 , H01L2224/13007 , H01L2224/13023 , H01L2224/13099 , H01L2224/131 , H01L2224/13111 , H01L2224/13139 , H01L2224/13147 , H01L2924/0001 , H01L2924/00014 , H01L2924/0002 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01028 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01073 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/04941 , H01L2924/04953 , H01L2924/05042 , H01L2924/14 , H01L2924/00012 , H01L2224/05552
摘要： The invention provides, in one aspect, a semiconductor device that comprises an interconnect layer located over a semiconductor substrate. A passivation layer is located over the interconnect layer and having a solder bump support opening formed therein. Support pillars that comprise a conductive material are located within the solder bump support opening.
摘要翻译：本发明在一个方面提供一种半导体器件，其包括位于半导体衬底之上的互连层。钝化层位于互连层上并且具有形成在其中的焊料凸块支撑开口。包括导电材料的支撑柱位于焊料凸块支撑开口内。

8. 发明申请

US20060065969A1 Reinforced bond pad for a semiconductor device 有权
标题翻译：用于半导体器件的加强焊盘
公开(公告)号：US20060065969A1
公开(公告)日：2006-03-30
申请号：US10955913
申请日：2004-09-30
申请人： Joze Antol , Philip Seitzer , Daniel Chesire , Rafe Mengel , Vance Archer , Thomas Gans , Taeho Kook , Sailesh Merchant
发明人： Joze Antol , Philip Seitzer , Daniel Chesire , Rafe Mengel , Vance Archer , Thomas Gans , Taeho Kook , Sailesh Merchant
IPC分类号： H01L23/053
CPC分类号： H01L24/05 , H01L23/3171 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2224/02166 , H01L2224/04042 , H01L2224/05073 , H01L2224/05093 , H01L2224/05166 , H01L2224/05181 , H01L2224/05187 , H01L2224/05553 , H01L2224/05554 , H01L2224/05624 , H01L2224/05644 , H01L2224/05647 , H01L2224/451 , H01L2224/48463 , H01L2224/49175 , H01L2924/00014 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01022 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01073 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/04941 , H01L2924/04953 , H01L2924/05042 , H01L2924/14 , H01L2224/45099 , H01L2924/00015
摘要： Disclosed herein are novel support structures for pad reinforcement in conjunction with new bond pad designs for semiconductor devices. The new bond pad designs avoid the problems associated with probe testing by providing a probe region that is separate from a wire bond region. Separating the probe region 212 from the wire bond region 210 and forming the bond pad 211 over active circuitry has several advantages. By separating the probe region 212 from the wire bond region 210, the wire bond region 210 is not damaged by probe testing, allowing for more reliable wire bonds. Also, forming the bond pad 211 over active circuitry, including metal interconnect layers, allows the integrated circuit to be smaller.
摘要翻译：这里公开了用于衬垫加强的新型支撑结构以及用于半导体器件的新的接合焊盘设计。新的焊盘设计通过提供与引线键合区域分离的探针区域来避免与探针测试相关的问题。将探针区域212与引线接合区域210分离并通过有源电路形成接合焊盘211具有若干优点。通过将探针区域212与引线键合区域210分离，引线键合区域210不会被探针测试所损坏，从而允许更可靠的引线键合。此外，在包括金属互连层的有源电路上形成接合焊盘211允许集成电路更小。

9. 发明申请

US20120282980A1 MOBILE COMMUNICATION DEVICE APPARATUS HAVING MULTIPLE MOBILE DEVICES 审中-公开
标题翻译：具有多个移动设备的移动通信设备装置
公开(公告)号：US20120282980A1
公开(公告)日：2012-11-08
申请号：US13101222
申请日：2011-05-05
申请人： Joseph Michael Freund , Anthony Grewe , Sailesh Merchant , David Herring
发明人： Joseph Michael Freund , Anthony Grewe , Sailesh Merchant , David Herring
IPC分类号： H04W88/02
CPC分类号： H04M1/0256 , H04M1/0216 , H04M1/72527
摘要： A mobile communication device having a plurality of mobile devices coupled to one another. The mobile communication device includes a first mobile device that has a screen display portion and a user input portion. The mobile communication device also includes at least one second mobile device detachably coupled to the first mobile device. The first mobile device is configured to function as a first standalone mobile communication device, and the second mobile device is configured to function as a second standalone mobile communication device when detached from the first mobile device. The second mobile device is detachably coupled to the first mobile device in such a way that the first mobile device continues to include the display screen portion and the user input portion when the second mobile device is detached from the first mobile device.
摘要翻译：一种具有彼此耦合的多个移动设备的移动通信设备。移动通信设备包括具有屏幕显示部分和用户输入部分的第一移动设备。移动通信设备还包括可拆卸地耦合到第一移动设备的至少一个第二移动设备。第一移动设备被配置为用作第一独立移动通信设备，并且第二移动设备被配置为当与第一移动设备分离时用作第二独立移动通信设备。第二移动设备可拆卸地耦合到第一移动设备，使得当第二移动设备与第一移动设备分离时，第一移动设备继续包括显示屏部分和用户输入部分。

10. 发明申请

US20060066335A1 Semiconductor test device with heating circuit 审中-公开
标题翻译：带加热电路的半导体测试装置
公开(公告)号：US20060066335A1
公开(公告)日：2006-03-30
申请号：US10952453
申请日：2004-09-28
申请人： Seung Kang , Subramanian Karthikeyan , Sailesh Merchant , Lisa Mullin
发明人： Seung Kang , Subramanian Karthikeyan , Sailesh Merchant , Lisa Mullin
IPC分类号： G01R31/02
CPC分类号： G01R31/2877 , G01R31/2856
摘要： A semiconductor test device includes a test circuit having contacts for applying an electrical signal and measuring electrical parameters of the test circuit. The semiconductor test device also includes an integrally formed heating circuit comprising at least one circuit meander positioned adjacent the test circuit for raising a temperature within a portion of the test circuit.
摘要翻译：半导体测试装置包括具有用于施加电信号和测量测试电路的电参数的触点的测试电路。半导体测试装置还包括整体形成的加热电路，其包括邻近测试电路定位的至少一个电路弯道，用于升高测试电路的一部分内的温度。

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