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1. 发明申请

WO2018175321A1 IMPLANTABLE CONNECTOR 审中-公开
公开(公告)号：WO2018175321A1
公开(公告)日：2018-09-27
申请号：PCT/US2018/023143
申请日：2018-03-19
申请人： VERILY LIFE SCIENCES LLC
发明人： SHAH, Kedar
IPC分类号： A61N1/375 , A61N1/05
摘要： An implantable connector for connecting an electronics package and a neural interface is described. The connection between the electronics package and the neural interface is made by way of a set of compressible contacts (e.g., springs) that physical contact a set of corresponding exposed bond pads. The compressible contacts are held in compression with the exposed bond pads using a mechanical coupler. The compressible contacts are physically separated and electrically isolated from each other by way of a compressible gasket. The compressible gasket is also held in compression using the mechanical coupler.

2. 发明申请

WO2018089147A1 HERMETIC PACKAGE WITH INDUCTORS AND CAPACITORS INTEGRATED INTO CERAMIC HOUSING 审中-公开
标题翻译：带陶瓷外壳的电感和电容器密封包装
公开(公告)号：WO2018089147A1
公开(公告)日：2018-05-17
申请号：PCT/US2017/055796
申请日：2017-10-09
申请人： VERILY LIFE SCIENCES LLC
发明人： SHAH, Kedar , CONG, Peng
IPC分类号： A61N1/372 , A61N1/375
CPC分类号： A61N1/3754 , A61N1/0534 , A61N1/36038 , A61N1/37205 , A61N1/37223 , A61N1/37229 , A61N1/37512 , A61N1/37514 , A61N1/3756 , A61N1/3758 , A61N1/3787
摘要： An implantable device includes a cylindrical housing, a metallic feedthrough, a metallic collar, and a battery. The cylindrical housing has a sidewall and an internal cavity, and is formed from a ceramic. One or more electrical components are integrated into the sidewall. The metallic feedthrough is joined to a first end of the cylindrical housing. The metallic collar is joined to a second end of the cylindrical housing. The battery is joined to the metallic collar.
摘要翻译：可植入装置包括圆柱形壳体，金属引线，金属环和电池。圆柱形壳体具有侧壁和内腔，并且由陶瓷形成。一个或多个电气部件被集成到侧壁中。金属馈通件连接到圆柱形壳体的第一端。金属环被连接到圆柱形壳体的第二端。电池连接到金属环。

3. 发明申请

WO2018223020A1 HYBRID IMPLANTABLE CONNECTORS 审中-公开
公开(公告)号：WO2018223020A1
公开(公告)日：2018-12-06
申请号：PCT/US2018/035639
申请日：2018-06-01
申请人： VERILY LIFE SCIENCES LLC
发明人： SHAH, Kedar , SABESAN, Shiv , PEPIN, Brian , FLOYD, Jared
IPC分类号： A61N1/375 , A61N1/05
CPC分类号： A61N1/372 , A61B5/0031 , A61N1/05 , A61N1/0551 , A61N1/37 , A61N1/3752
摘要： A hybrid connector for connecting a bulk conductor to a planar strand of a flexible circuit is described. The hybrid connector can include a connector body, a first connector end, and a second connector end. The first connector end can be attached to the connector body and can define a first opening having a first cross-sectional shape that corresponds to a first distal end of the strand. The second connector end can be attached to the connector body opposite the first connector end and can define a second opening having a second cross-sectional shape that corresponds to a second distal end of the bulk conductor.

4. 发明申请

WO2018089895A3 MODULAR NEUROMODULATION SYSTEMS, METHODS OF MANUFACTURE, AND METHODS OF TREATING RHEUMATOID ARTHRITIS 审中-公开
公开(公告)号：WO2018089895A3
公开(公告)日：2018-05-17
申请号：PCT/US2017/061308
申请日：2017-11-13
申请人： VERILY LIFE SCIENCES LLC
发明人： SHAH, Kedar , SABESAN, Shiv
IPC分类号： A61N1/36 , A61N1/372 , A61N1/375
摘要： The present invention relates to implantable neuromodulation systems and methods, and in particular to modular neuromodulation systems suitable for implantation in a minimally invasive manner, methods of manufacturing the modular neuromodulation systems, and methods of treating rheumatoid arthritis using the modular neuromodulation systems. Particularly, aspects of the present invention are directed to a medical device that includes an implantable neurostimulator including a housing having a width of less than 10 mm and a height of less than 10 mm, one or more feedthroughs that pass through the housing, and an electronics module within the housing and connected to the one or more feedthroughs. The medical device further includes a lead assembly including a lead body including a conductor material, a lead connector that connects the conductor material to the one or more feedthroughs, and one or more electrodes connected to the conductor material.

5. 发明申请

WO2020101839A1 BRANCHED PROXIMAL CONNECTORS FOR HIGH DENSITY NEURAL INTERFACES 审中-公开
公开(公告)号：WO2020101839A1
公开(公告)日：2020-05-22
申请号：PCT/US2019/057178
申请日：2019-10-21
申请人： VERILY LIFE SCIENCES LLC
发明人： LU, Bo , SHAH, Kedar
IPC分类号： A61N1/05 , H05K3/10 , A61N1/36 , H01R12/59
摘要： The present disclosure relates to branched proximal connectors for high density neural interfaces and methods of microfabricating the branched proximal connectors. Particularly, aspects of the present disclosure are directed to a branched connector that includes a main body having a base portion of a supporting structure and a plurality of conductive traces formed on the base portion, and a plurality of plugs extending from the main body. Each plug of the plurality of plugs include an end portion of the supporting structure comprised of the one or more layers of dielectric material, and a subset of conductive traces from the plurality of conductive traces. Each trace from the subset of conductive traces terminates at a bond pad exposed on a surface of the end portion of the supporting structure.

6. 发明申请

WO2020060881A1 MONOLITHIC LEAD ASSEMBLY AND METHODS OF MICROFABRICATING A MONOLITHIC LEAD ASSEMBLY 审中-公开
公开(公告)号：WO2020060881A1
公开(公告)日：2020-03-26
申请号：PCT/US2019/051165
申请日：2019-09-13
申请人： VERILY LIFE SCIENCES LLC
发明人： KARICHERLA, Annapurna , LU, Bo , SHAH, Kedar
IPC分类号： A61N1/04 , A61N1/36 , H01B7/02 , H01B7/08 , H01B13/06 , H01B13/16
摘要： The present disclosure relates to a monolithic thin-film lead assembly and methods of microfabricating a monolithic thin-film lead assembly. Particularly, aspects of the present disclosure are directed to a monolithic thin-film lead assembly that includes a cable having a proximal end, a distal end, a supporting structure that extends from the proximal end to the distal end, and a plurality of conductive traces formed on a portion of the supporting structure. The supporting structure includes one or more layers of dielectric material. The monolithic thin-film lead assembly may further include an electrode assembly formed on the supporting structure at the distal end of the cable. The electrode assembly includes one or more electrodes in electrical connection with one or more conductive traces of the plurality of conductive traces.

7. 发明申请

WO2018223019A1 NEURAL INTERFACES INCLUDING EXTENSIBLE LEAD BODIES 审中-公开
公开(公告)号：WO2018223019A1
公开(公告)日：2018-12-06
申请号：PCT/US2018/035638
申请日：2018-06-01
申请人： VERILY LIFE SCIENCES LLC
发明人： SHAH, Kedar
IPC分类号： A61N1/05
摘要： A device is described that includes a neural interface and a lead body. The lead body and the neural interface are formed from a flexible circuit. The flexible circuit includes an exposed electrode. The lead body includes an elongate planar strand that is coiled about a central axis of the lead body. The elongate planar strand includes a conductive trace extending between the exposed electrode and a distal end of the elongate planar strand.

8. 发明申请

WO2018089895A2 MODULAR NEUROMODULATION SYSTEMS, METHODS OF MANUFACTURE, AND METHODS OF TREATING RHEUMATOID ARTHRITIS 审中-公开
标题翻译：模块化神经调节系统，制造方法和治疗类风湿性关节炎的方法
公开(公告)号：WO2018089895A2
公开(公告)日：2018-05-17
申请号：PCT/US2017/061308
申请日：2017-11-13
申请人： VERILY LIFE SCIENCES LLC
发明人： SHAH, Kedar , SABESAN, Shiv
IPC分类号： A61N1/36
摘要： The present invention relates to implantable neuromodulation systems and methods, and in particular to modular neuromodulation systems suitable for implantation in a minimally invasive manner, methods of manufacturing the modular neuromodulation systems, and methods of treating rheumatoid arthritis using the modular neuromodulation systems. Particularly, aspects of the present invention are directed to a medical device that includes an implantable neurostimulator including a housing having a width of less than 10 mm and a height of less than 10 mm, one or more feedthroughs that pass through the housing, and an electronics module within the housing and connected to the one or more feedthroughs. The medical device further includes a lead assembly including a lead body including a conductor material, a lead connector that connects the conductor material to the one or more feedthroughs, and one or more electrodes connected to the conductor material.
摘要翻译：本发明涉及可植入神经调节系统和方法，并且具体涉及适合以微创方式植入的模块化神经调节系统，制造所述模块化神经调节系统的方法以及使用治疗类风湿性关节炎的方法来治疗类风湿性关节炎模块化神经调节系统。具体而言，本发明的方面涉及一种医疗装置，其包括植入式神经刺激器，该植入式神经刺激器包括具有小于10mm的宽度和小于10mm的高度的外壳，穿过外壳的一个或多个馈通，以及电子模块在外壳内并连接到一个或多个馈通。该医疗装置还包括引线组件，该引线组件包括包含导体材料的引线主体，将导体材料连接到一个或多个馈通的引线连接器，以及连接到导体材料的一个或多个电极。

9. 发明申请

WO2021188824A1 THIN FILM ELECTRODES FOR BRAIN COMPUTER INTERFACE AND METHODS OF MICROFABRICATING 审中-公开
公开(公告)号：WO2021188824A1
公开(公告)日：2021-09-23
申请号：PCT/US2021/023013
申请日：2021-03-18
申请人： VERILY LIFE SCIENCES LLC
发明人： KARICHERLA, Annapurna , LU, Bo , SHAH, Kedar , CONG, Peng
IPC分类号： A61N1/04 , A61N1/05 , A61M25/09 , H01B7/08 , H01B13/00
摘要： The present disclosure relates to a monolithic thin-film lead assembly and methods of microfabricating a monolithic thin-film lead assembly. Particularly, aspects of the present disclosure are directed to a monolithic thin-film lead assembly that includes a cable having a proximal end, a distal end, a supporting structure that extends from the proximal end to the distal end, and conductive traces formed on a portion of the supporting structure. The supporting structure includes one or more layers of dielectric material. The monolithic thin-film lead assembly further includes an interface formed on the supporting structure at the distal end of the cable. The interface includes electrodes and/or sensors in electrical connection with the conductive traces, and the supporting structure has at least one curved portion disposed between a first set of electrodes and a second set of electrodes, and/or between a first set of sensors and a second set of sensors.

10. 发明申请

WO2020198120A1 THIN-FILM LEAD ASSEMBLIES AND NEURAL INTERFACES 审中-公开
公开(公告)号：WO2020198120A1
公开(公告)日：2020-10-01
申请号：PCT/US2020/024173
申请日：2020-03-23
申请人： VERILY LIFE SCIENCES LLC
发明人： SHAH, Kedar , KARICHERLA, Annapurna , AU, Cindy
IPC分类号： A61N1/05 , A61B5/04 , A61N1/04
摘要： The present disclosure relates to thin-film lead assemblies and neural interfaces, and methods of microfabricating thin-film lead assemblies and neural interfaces. Particularly, aspects of the present disclosure are directed to a thin-film neural interface that includes a proximal end, a distal end, a supporting structure that extends from the proximal end to the distal end, one or more of conductive traces formed on a portion of the supporting structure, one or more electrodes formed on the front side of the supporting structure in electrical connection with the one or more conductive traces, and a backing formed on the back side of the supporting structure. The supporting structure comprises one or more features to facilitate mechanical adhesion between the supporting structure and the backing.

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