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1. 发明申请

WO2020068722A1 IMPLANTABLE MEDICAL DEVICES WITH MICROFABRICATED LEADS 审中-公开
公开(公告)号：WO2020068722A1
公开(公告)日：2020-04-02
申请号：PCT/US2019/052556
申请日：2019-09-24
申请人： VERILY LIFE SCIENCES LLC
发明人： KARICHERLA, Annapurna , LU, Bo , AU, Cindy , PEPIN, Brian
IPC分类号： A61N1/05
摘要： Embodiments relate to an implantable device. Specifically, a device includes a flexible connection component that includes a set of conductive filaments that connect a set of electrodes (or traces connected to the electrodes) and circuitry that receives and/or transmits electronic signals from and/or to the electrodes.

2. 发明申请

WO2020101839A1 BRANCHED PROXIMAL CONNECTORS FOR HIGH DENSITY NEURAL INTERFACES 审中-公开
公开(公告)号：WO2020101839A1
公开(公告)日：2020-05-22
申请号：PCT/US2019/057178
申请日：2019-10-21
申请人： VERILY LIFE SCIENCES LLC
发明人： LU, Bo , SHAH, Kedar
IPC分类号： A61N1/05 , H05K3/10 , A61N1/36 , H01R12/59
摘要： The present disclosure relates to branched proximal connectors for high density neural interfaces and methods of microfabricating the branched proximal connectors. Particularly, aspects of the present disclosure are directed to a branched connector that includes a main body having a base portion of a supporting structure and a plurality of conductive traces formed on the base portion, and a plurality of plugs extending from the main body. Each plug of the plurality of plugs include an end portion of the supporting structure comprised of the one or more layers of dielectric material, and a subset of conductive traces from the plurality of conductive traces. Each trace from the subset of conductive traces terminates at a bond pad exposed on a surface of the end portion of the supporting structure.

3. 发明申请

WO2020060882A1 STIMULATION SYSTEM WITH MONOLITHIC-LEAD COMPONENT CONNECTED TO SKULL MOUNT PACKAGE 审中-公开
公开(公告)号：WO2020060882A1
公开(公告)日：2020-03-26
申请号：PCT/US2019/051168
申请日：2019-09-13
申请人： VERILY LIFE SCIENCES LLC
发明人： SABESAN, Shivkumar , LU, Bo , KARICHERLA, Annapurna
IPC分类号： A61N1/05 , A61N1/375 , A61N1/36 , A61B5/04 , A61B5/0478 , A61B5/00
摘要： A stimulation system can include one or more stimulating components, each of which can include one or more electrodes and one or more leads. Each lead can be connected at a first end of the lead to an electrode of the one or more electrodes and can be connected at a second end of the lead to a bonding pad of the one or more bonding pads. The stimulation system can also include a cylindrical substrate. Each stimulating component can be secured to a surface of the cylindrical substrate. The stimulation system can further include a skull-mount package that includes electronics that identify stimulation parameters. The bonding pads can be electrically connected to the electronics. The skull-mount package can further include one or more bonding pads. Each lead can be directly electrically and physically connected to a bonding pad of the one or more bonding pads.

4. 发明申请

WO2020060881A1 MONOLITHIC LEAD ASSEMBLY AND METHODS OF MICROFABRICATING A MONOLITHIC LEAD ASSEMBLY 审中-公开
公开(公告)号：WO2020060881A1
公开(公告)日：2020-03-26
申请号：PCT/US2019/051165
申请日：2019-09-13
申请人： VERILY LIFE SCIENCES LLC
发明人： KARICHERLA, Annapurna , LU, Bo , SHAH, Kedar
IPC分类号： A61N1/04 , A61N1/36 , H01B7/02 , H01B7/08 , H01B13/06 , H01B13/16
摘要： The present disclosure relates to a monolithic thin-film lead assembly and methods of microfabricating a monolithic thin-film lead assembly. Particularly, aspects of the present disclosure are directed to a monolithic thin-film lead assembly that includes a cable having a proximal end, a distal end, a supporting structure that extends from the proximal end to the distal end, and a plurality of conductive traces formed on a portion of the supporting structure. The supporting structure includes one or more layers of dielectric material. The monolithic thin-film lead assembly may further include an electrode assembly formed on the supporting structure at the distal end of the cable. The electrode assembly includes one or more electrodes in electrical connection with one or more conductive traces of the plurality of conductive traces.

5. 发明申请

WO2018212833A1 THIN-FILM ELECTRODE ASSEMBLY WITH SOFT OVERMOLD 审中-公开
公开(公告)号：WO2018212833A1
公开(公告)日：2018-11-22
申请号：PCT/US2018/024705
申请日：2018-03-28
申请人： VERILY LIFE SCIENCES LLC
发明人： PEPIN, Brian , SABESAN, Shiv , LU, Bo
IPC分类号： A61N1/05 , H05K1/02
摘要： The present disclosure relates to implantable neuromodulation devices and methods of fabrication, and in particular to a thin-film electrode assemblies and methods of fabricating the thin-film electrode assembly to include a soft overmold. Particularly, aspects of the present invention are directed to a thin-film electrode assembly that includes an overmold and a supporting structure formed within a portion of the overmold. The overmold includes a first polymer and the supporting structure includes a second polymer, different from the first polymer. The thin-film electrode assembly also includes a wire formed within a portion of the supporting structure, and an electrode formed on a top surface of the supporting structure and in electrical contact with the wire. The electrode has a top surface that is raised above a top surface of the overmold by a predetermined distance.

6. 发明申请

WO2020263534A1 THIN FILM MAPPING CATHETER 审中-公开
公开(公告)号：WO2020263534A1
公开(公告)日：2020-12-30
申请号：PCT/US2020/036355
申请日：2020-06-05
申请人： VERILY LIFE SCIENCES LLC
发明人： YAFFE, Benjamin, K. , LU, Bo , KARICHERLA, Annapurna , RYS, Ken , KWON, Ohseung
IPC分类号： A61M25/10 , A61B5/042
摘要： The present disclosure relates to mapping catheters, and in particular to mapping catheters having thin film electrodes used in sensing electrical activity within a patient. Particularly, aspects of the present disclosure are directed to a medical device having a hollow core, a balloon disposed over at least a portion of the hollow core, and a flexible framework having one or more thin film elements formed on at least a portion of the balloon. The one or more thin film elements comprise a plurality of mapping electrodes.

7. 发明申请

WO2021091901A1 ANATOMICALLY CONTOURED STIMULATION LEADS FOR HIGH DENSITY NEURAL INTERFACE 审中-公开
公开(公告)号：WO2021091901A1
公开(公告)日：2021-05-14
申请号：PCT/US2020/058713
申请日：2020-11-03
申请人： VERILY LIFE SCIENCES LLC
发明人： LU, Bo , RYS, Ken
IPC分类号： A61N1/05 , A61N1/36 , H01R13/40 , H01R13/46
摘要： The present disclosure relates to implantable neuromodulation devices and methods of fabrication, and in particular to anatomically contoured spinal cord stimulation leads for high density neural interfaces and methods of microfabricating the stimulation leads. Particularly, aspects are directed to a thin film lead assembly that includes a cable having: a first supporting structure formed of dielectric material, a first set of conductive traces formed on the first supporting structure, a second supporting structure formed of dielectric material, and a second set of conductive traces formed on the second supporting structure. The thin film lead assembly also includes an electrode assembly having: a third supporting structure formed of dielectric material, a first set of electrodes in electrical connection with the first set of conductive traces, and a second set of electrodes in electrical connection with the second set of conductive traces.

8. 发明申请

WO2020263535A1 CONNECTORS FOR HIGH DENSITY NEURAL INTERFACES 审中-公开
公开(公告)号：WO2020263535A1
公开(公告)日：2020-12-30
申请号：PCT/US2020/036362
申请日：2020-06-05
申请人： VERILY LIFE SCIENCES LLC
发明人： YAFFE, Benjamin K. , RYS, Ken , LU, Bo
IPC分类号： A61B5/04 , A61N1/05 , H01R24/00
摘要： The present disclosure relates to connectors for high density neural interfaces and methods of microfabricating the connectors. Particularly, aspects of the present disclosure are directed to a connector having a main body, a first plug extending from the main body, a flexible bridge extending from the main body or the first plug, and a second plug extending from the flexible bridge. This structure allows for the main body, the first plug, and the second plug to be arranged in tandem on a longitudinal axis of the main body, which enables the connector to be passed through a narrow diameter cannula. This structure also allows for the first plug and the second plug to be arranged in a spread out orientation, which enables the connector to be electrically connected with a neurostimulator.

9. 发明申请

WO2018017285A1 METHOD OF MANUFACTURING FLEXIBLE ELECTRONIC CIRCUITS HAVING CONFORMAL MATERIAL COATINGS 审中-公开
标题翻译：制造具有均匀材料涂层的柔性电子电路的方法
公开(公告)号：WO2018017285A1
公开(公告)日：2018-01-25
申请号：PCT/US2017/039089
申请日：2017-06-23
申请人： VERILY LIFE SCIENCES LLC
发明人： PEPIN, Brain, Marc , LU, Bo
IPC分类号： H01L23/498 , H01L21/48
摘要： A method of manufacturing a flexible electronic circuit is provided. The method may include forming a positive photoresist mold on a flexible polymer substrate having a plurality of metal traces. The method may also include applying a conformal material coating over the positive photoresist mold, the flexible polymer substrate, and the metal traces. The method may further include removing an excess of the conformal material coating by running a blade over the positive photoresist mold. The method may also include removing the positive photoresist mold to reveal a cavity defined by the conformal material coating. The method may further include dispensing an anisotropic conductive paste into the cavity and inserting a chip into the cavity and bonding the chip to the metal traces.
摘要翻译：提供了一种制造柔性电子电路的方法。该方法可以包括在具有多个金属迹线的柔性聚合物衬底上形成正型光刻胶模具。该方法还可以包括在正型光刻胶模具，柔性聚合物基板和金属迹线上施加保形材料涂层。该方法可以进一步包括通过在正型光致抗蚀剂模具上运行刀片去除过量的保形材料涂层。该方法还可以包括去除正型光刻胶模具以露出由共形材料涂层限定的空腔。该方法可以进一步包括将各向异性导电浆料分配到腔体中并将芯片插入腔体中并将芯片结合到金属迹线上。

10. 发明申请

WO2017143192A3 EXTRANEURAL CUFF WITH SPIKE-SHAPED ELECTRODES FOR STIMULATION AND RECORDING 审中-公开
公开(公告)号：WO2017143192A3
公开(公告)日：2017-08-24
申请号：PCT/US2017/018372
申请日：2017-02-17
申请人： VERILY LIFE SCIENCES LLC , LU, Bo
发明人： LU, Bo , PEPIN, Brian, Marc
IPC分类号： A61N1/05 , A61N1/375 , A61N1/36 , A61N1/372
摘要： An electrode system for neuromodulation and for recording of nerve activity is provided. The system can include a plurality of raised, spike-shaped electrodes provided on a flexible, non-conductive substrate. The substrate can be rolled into a cuff for encircling a nerve bundle of a patient. The plurality of electrodes on the cuff can be connected to a controller provided either on the cuff or in the patient's body in close proximity to the cuff. The controller can instruct the electrodes to deliver electrical pulses to the nerve fiber to stimulate it and/or to sense nerve activity from the nerve fiber. The spike shape of the electrodes can allow them to penetrate the myelin sheet of a nerve bundle and come in closer contact with the nerve fiber, which in turn can increase specificity, improve the signal-to-noise ratio of acquired neuro signals, and allow lower currents to be used for neuromodulation.

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