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1. 发明授权

US10500794B2 Method of joining resin tubes 有权
公开(公告)号：US10500794B2
公开(公告)日：2019-12-10
申请号：US15559394
申请日：2016-03-03
申请人： Ushio Denki Kabushiki Kaisha
发明人： Fumitoshi Takemoto , Makoto Wasamoto , Shinji Suzuki
IPC分类号： B29C65/00 , B29C65/14 , B29C59/14 , B29C59/16 , B29C59/08 , B29C59/10 , A61M25/00 , A61M25/10
CPC分类号： B29C66/028 , A61M25/0015 , A61M25/1025 , B29C59/085 , B29C59/103 , B29C59/142 , B29C59/165 , B29C65/1406 , B29C65/1496 , B29C66/11 , B29C66/52272 , B29C66/12821 , B29C66/929
摘要： An object of the present invention is to provide a method of joining resin tubes, in which the degree of freedom of selecting a tube material is large, and further a defect such as stiffness and contraction at joining portions of the tubes is not developed. The method of joining resin tubes according to the present invention is a method of joining resin tubes so that a first tube is joined to a second tube, the first tube and the second tube each being made of synthetic resin, the method comprising: a surface activation step of activating each of a joining region of the first tube and a joining region of the second tube; and an adhesion step of adhering the joining region of the first tube obtained via the surface activation step with the joining region of the second tube obtained via the surface activation step to each other.

2. 发明申请

US20140265869A1 LIGHT SOURCE APPARATUS 有权
标题翻译：光源设备
公开(公告)号：US20140265869A1
公开(公告)日：2014-09-18
申请号：US14207709
申请日：2014-03-13
申请人： USHIO DENKI KABUSHIKI KAISHA
发明人： Fumitoshi Takemoto
IPC分类号： H05B41/39
CPC分类号： H05B41/39
摘要： A light source apparatus is adapted to be shared by excimer lamps. An IC tag is disposed at each lamp, and the IC tag stores information identifying the lamp. A storage unit of the light source apparatus stores information identifying a usable lamp (or usable lamps) for the light source apparatus, an emission wavelength of the lamp, and a sensitivity correction value of an optical sensor that corresponds to the emission wavelength. When the light source apparatus is driven to cause the lamp to light, the information stored in the IC tag and information stored in the storage unit are collated and it is determined whether the lamp is usable and the emission wavelength of the lamp is a preset emission wavelength. If it is determined that the lamp is usable and the emission wavelength is appropriate, the sensitivity of the optical sensor is corrected with the correction value.
摘要翻译：光源装置适于由准分子灯共享。在每个灯处设置IC标签，并且IC标签存储识别灯的信息。光源装置的存储单元存储识别用于光源装置的可用灯（或可用灯）的信息，灯的发射波长和对应于发射波长的光学传感器的灵敏度校正值。当光源装置被驱动以使灯点亮时，存储在IC标签中的信息和存储在存储单元中的信息进行整理，并且确定灯是否可用，并且灯的发射波长是预设发射波长。如果确定灯可用并且发射波长适当，则用校正值校正光学传感器的灵敏度。

3. 发明授权

US12103246B2 Method of bonding substrates, microchip and method of manufacturing the same 有权
公开(公告)号：US12103246B2
公开(公告)日：2024-10-01
申请号：US15814267
申请日：2017-11-15
申请人： USHIO DENKI KABUSHIKI KAISHA
发明人： Motohiro Sakai , Shinji Suzuki , Fumitoshi Takemoto , Kenichi Hirose
IPC分类号： B29C65/74 , B29C35/08 , B29C59/14 , B29C59/16 , B29C65/00 , B29C65/02 , B29C65/14 , B29L11/00 , B29L31/00 , B81C3/00 , C09J5/02 , H01L21/18 , H01L21/20 , H01L21/67
CPC分类号： B29C65/7415 , B29C59/14 , B29C59/16 , B29C65/1406 , B29C65/1432 , B29C66/028 , B29C66/1122 , B29C66/53461 , B29C66/54 , B29C66/83221 , B81C3/001 , C09J5/02 , H01L21/187 , H01L21/2007 , H01L21/67005 , B29C2035/0827 , B29C65/02 , B29C66/232 , B29C66/30223 , B29C66/534 , B29C66/71 , B29C66/712 , B29C66/73366 , B29C66/7465 , B29C66/919 , B29C66/92445 , B29C66/929 , B29C66/949 , B29L2011/00 , B29L2011/0016 , B29L2031/756 , C09J2400/143 , C09J2400/146 , C09J2400/163 , C09J2400/166 , B29C66/71 , B29K2083/00 , B29C66/71 , B29K2023/38 , B29C66/71 , B29K2069/00 , B29C66/71 , B29K2025/06
摘要： Disclosed herein is a method of bonding substrates, a microchip, and a method of manufacturing the microchip capable of joining two substrates in a higher adhered state even when at least one of the substrate has a warpage or a roll. A method of bonding a first substrate and a second substrate each of which is made of glass or a resin comprises: a surface activating step for activating each of joining surfaces of the first substrate and the second substrate; and a pressurizing step for pressurizing the first substrate and the second substrate in a state that the first substrate and the second substrate are stacked such that respective joining surfaces contact each other. The joining surface of the first substrate and/or the joining surface of the second substrate are constituted with a plurality of joining regions segmented to be separate from one another by a segmenting recessed portion.

4. 发明授权

US10619074B2 Curing process of ultraviolet curable paint 有权
公开(公告)号：US10619074B2
公开(公告)日：2020-04-14
申请号：US15243478
申请日：2016-08-22
申请人： Ushio Denki Kabushiki Kaisha
发明人： Fumitoshi Takemoto , Makoto Wasamoto , Shinji Suzuki
IPC分类号： C09D201/00 , H01J61/76 , B05D3/06 , H01J61/44 , C09D5/22
CPC分类号： C09D201/00 , B05D3/067 , C09D5/22 , H01J61/44 , H01J61/76
摘要： A curing process of an ultraviolet curable paint by which a paint cured layer can be formed on an object to be processed without needing a long time, and intended color can be obtained of the object to be processed on which the paint cured layer is formed. The curing process of an ultraviolet curable paint is one for curing an ultraviolet curable paint through an ultraviolet irradiation step of irradiating a surface of an object to be processed to which the ultraviolet curable paint is applied with ultraviolet rays from an ultraviolet radiation unit. The ultraviolet curable paint is not sensitive to light of not less than 380 nm in wavelength but sensitive to light of less than 380 nm in wavelength. The ultraviolet radiation unit radiates ultraviolet rays having a peak wavelength within a range of not greater than 350 nm in wavelength.

5. 发明授权

US10286640B2 Process for laminating works together 有权
公开(公告)号：US10286640B2
公开(公告)日：2019-05-14
申请号：US15559372
申请日：2016-02-25
申请人： Ushio Denki Kabushiki Kaisha
发明人： Makoto Wasamoto , Fumitoshi Takemoto , Shinji Suzuki
IPC分类号： B29C65/00 , B32B37/10 , B32B27/08 , B32B37/06 , B32B38/00 , B29C59/14 , B29C59/16 , B29C65/14 , B29C65/72 , B29C65/02 , B29L31/00 , B29C35/08
摘要： An object of the present invention is to provide a process for laminating works together that are capable of giving laminates a high bonding strength ensured therein. The process for laminating works together laminates a work composed of a resin to a work composed of a resin or glass, the process including a surface activation step of treating a laminating surface of at least the work composed of a resin with vacuum ultraviolet ray or with atmospheric pressure plasma, and a bonding step of bonding together the two works stacked on each other such that a laminating surface of one of the works abuts a laminating surface of the other work, wherein in the surface activation step, the treatment of the laminating surfaces with vacuum ultraviolet ray or with atmospheric pressure plasma is terminated when an accumulated treatment quantity of the vacuum ultraviolet ray or the atmospheric pressure plasma applied to the laminating surfaces is within an initial drop range shown in a variation curve of a water contact angle on the laminating surfaces with respect to the accumulated treatment quantity.

6. 发明授权

US10487183B2 Method of bonding substrates and method of producing microchip 有权
公开(公告)号：US10487183B2
公开(公告)日：2019-11-26
申请号：US16317469
申请日：2017-06-27
申请人： Ushio Denki Kabushiki Kaisha
发明人： Fumitoshi Takemoto , Shinji Suzuki , Motohiro Sakai , Kenichi Hirose
IPC分类号： C08J5/12 , C08J7/12 , H05K3/30 , B29C65/02 , B29C65/00 , B32B37/06 , B32B17/06 , B32B38/00 , B29L31/34
CPC分类号： C08J5/121 , B29C65/02 , B29C66/028 , B29C66/7465 , B32B17/064 , B32B37/06 , B32B38/0008 , C08J7/123 , H05K3/305 , B29L2031/34 , B32B2457/00 , C08J2333/00 , C08J2345/00 , H05K2203/095
摘要： The present invention has as its object the provision of a method of bonding substrates, which can bond two substrates, at least one of which has warpage and undulation of a bonding surface, in a high adhesion state and a method of producing a microchip.
In the method of bonding substrates according to the present invention, the first substrate is formed of a material having a deformable temperature at which the substrate deforms and which is higher than a deformable temperature of the second substrate, the method includes: a surface activation step of activating each of bonding surfaces of the first substrate and the second substrate; a stacking step of stacking the first substrate and the second substrate so that the respective bonding surfaces thereof are in contact with each other; and a deforming step of deforming the bonding surface of the second substrate to conform to a shape of the bonding surface of the first substrate, and the deforming step is performed by heating the stacked body of the first substrate and the second substrate obtained in the stacking step at a temperature not lower than the deformable temperature of the second substrate and lower than the deformable temperature of the first substrate.

7. 发明授权

US09125283B2 Light source apparatus 有权
标题翻译：光源装置
公开(公告)号：US09125283B2
公开(公告)日：2015-09-01
申请号：US14207709
申请日：2014-03-13
申请人： USHIO DENKI KABUSHIKI KAISHA
发明人： Fumitoshi Takemoto
IPC分类号： H05B37/02 , H05B41/39
CPC分类号： H05B41/39
摘要： A light source apparatus is adapted to be shared by excimer lamps. An IC tag is disposed at each lamp, and the IC tag stores information identifying the lamp. A storage unit of the light source apparatus stores information identifying a usable lamp (or usable lamps) for the light source apparatus, an emission wavelength of the lamp, and a sensitivity correction value of an optical sensor that corresponds to the emission wavelength. When the light source apparatus is driven to cause the lamp to light, the information stored in the IC tag and information stored in the storage unit are collated and it is determined whether the lamp is usable and the emission wavelength of the lamp is a preset emission wavelength. If it is determined that the lamp is usable and the emission wavelength is appropriate, the sensitivity of the optical sensor is corrected with the correction value.
摘要翻译：光源装置适于由准分子灯共享。在每个灯处设置IC标签，并且IC标签存储识别灯的信息。光源装置的存储单元存储识别用于光源装置的可用灯（或可用灯）的信息，灯的发射波长和对应于发射波长的光学传感器的灵敏度校正值。当光源装置被驱动以使灯点亮时，存储在IC标签中的信息和存储在存储单元中的信息进行整理，并且确定灯是否可用，并且灯的发射波长是预设发射波长。如果确定灯可用并且发射波长适当，则用校正值校正光学传感器的灵敏度。

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