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    • 3. 发明专利
    • PREPREG AND COPPER-CLAD LAMINATED BOARD
    • JPH04192489A
    • 1992-07-10
    • JP32503390
    • 1990-11-26
    • UNITIKA LTD
    • IWAYA YOSHIAKIIKEDA TOSHIROSHIOZAWA SHOZOYAMADA MICHIHIROIKEDA MORITAKA
    • C08J5/24B32B15/08C08L75/04H05K1/03
    • PURPOSE:To obtain a prepreg and a copper-clad laminated board whose permittivity is low and which are excellent in a heat-resistant property by a method wherein a cloth obtained by treating the surface of a woven cloth of silicate fibers with a silane coupling agent is impregnated with a specific resin varnish. CONSTITUTION:A cloth obtained by treating, with a silane coupling agent, the surface of a woven cloth formed by weaving silicate fibers whose content of SiO2 is at 98wt.% or higher, whose specific gravity is at 1.8 to 2.0, whose tensile strength is at 20 to 82kg/mm and whose modulus of elasticity is at 1000 to 8200kg/mm is impregnated with a resin varnish obtained by polymerizing a cyanate ester resin expressed by Formula I. In Formula I, A represents an aromatic ring or a group including an aromatic ring, B represents a polycyclic alicyclic group of C7 to C20, D represents a substitution group which does not contain an active hydrogen group individually and independently (p) to (r) represent an integer of 0 to 3 individually and independently, the total of (p) to (r) is at 2 or higher, (s) represents an integer of 0 to 4 individually and independently and (x) represents an integer of 0 to 5. Thereby, it is possible to obtain a prepreg and a copper-clad laminated board whose permittivity is low and which are excellent in a solder heat-resistant property.