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1. 发明专利

JPH04351541A LOW DIELECTRIC CONSTANT RESIN SHEET AND COPPER-CLAD LAMINATED SHEET USING IT 失效
公开(公告)号：JPH04351541A
公开(公告)日：1992-12-07
申请号：JP22375091
申请日：1991-05-28
申请人： UNITIKA LTD
发明人： IWAYA YOSHIAKI , IKEDA TOSHIRO
IPC分类号： B32B7/10 , B32B15/08 , C08J5/24 , C08J9/42 , C08L79/00 , H01B3/30 , H01B3/42 , H01B3/48 , H01B5/02 , H05K1/03
摘要： PURPOSE:To provide a low dielectric constant resin sheet being suitable for a high speed computer, a satellite communication, mobile radio system, etc., by preparing a printed board material being flame-retardant and with excellent low dielectric characteristics without lowering heat resistance and low moisture absorption which are characteristics of a cyanate ester resin. CONSTITUTION:A low dielectric constant resin sheet prepd. by impregnating a porous fluorinated resin sheet with a flame-retardant resin compsn. consisting of a compd. having at least two or more cyanate groups (A) and vinyl brominated phenol, a homopolymer, a copolymer or an interpolymer of vinyl brominated phenol or all the combination thereof (B) and a copper-clad laminated sheet using the sheet.

2. 发明专利

JPH04308743A RESIN COMPOSITION FOR LAMINATED SHEET AND PREPREG AND COPPER CLAD LAMINATED SHEET USING THE SAME 失效
公开(公告)号：JPH04308743A
公开(公告)日：1992-10-30
申请号：JP15417491
申请日：1991-04-05
申请人： UNITIKA LTD
发明人： IWAYA YOSHIAKI , IKEDA TOSHIRO
IPC分类号： B32B7/10 , B32B15/08 , C08G73/06 , C08L79/04 , C08L101/00 , H05K1/03 , H05K3/46
摘要： PURPOSE:To improve drill processability, dimensional stability and heat resistance by obtaining the title resin composition by compounding a straight chain polymer having a specific MW with a cyanate ester resin represented by a specific general formula. CONSTITUTION:In a resin composition for a laminated sheet adapted to a double-sided or multilayer printed wiring board material used in a computer, a communications satellite or measuring machinery, resin varnish prepared by adding a straight chain polymer with an MW of 2,000-100,000 to a cyanate ester resin represented by general formula (wherein A is an aromatic ring or an aromatic ring-containing group, B is a 7-20C poly-alicyclic group, D is respectively independently a substituent containing no active hydrogen group and p, q and r are respectively independently an integer of 0-3) is used. This resin composition for the laminated sheet is added to a fabric or nonwoven fabric composed of an inorg. or org. fiber in an amount 30-70wt.% to obtain a prepreg and the prepregs are laminated and a copper foil is laminated to the surface of the formed laminate to obtain a copper clad laminated sheet.

3. 发明专利

JPH04192489A PREPREG AND COPPER-CLAD LAMINATED BOARD 失效
公开(公告)号：JPH04192489A
公开(公告)日：1992-07-10
申请号：JP32503390
申请日：1990-11-26
申请人： UNITIKA LTD
发明人： IWAYA YOSHIAKI , IKEDA TOSHIRO , SHIOZAWA SHOZO , YAMADA MICHIHIRO , IKEDA MORITAKA
IPC分类号： C08J5/24 , B32B15/08 , C08L75/04 , H05K1/03
摘要： PURPOSE:To obtain a prepreg and a copper-clad laminated board whose permittivity is low and which are excellent in a heat-resistant property by a method wherein a cloth obtained by treating the surface of a woven cloth of silicate fibers with a silane coupling agent is impregnated with a specific resin varnish. CONSTITUTION:A cloth obtained by treating, with a silane coupling agent, the surface of a woven cloth formed by weaving silicate fibers whose content of SiO2 is at 98wt.% or higher, whose specific gravity is at 1.8 to 2.0, whose tensile strength is at 20 to 82kg/mm and whose modulus of elasticity is at 1000 to 8200kg/mm is impregnated with a resin varnish obtained by polymerizing a cyanate ester resin expressed by Formula I. In Formula I, A represents an aromatic ring or a group including an aromatic ring, B represents a polycyclic alicyclic group of C7 to C20, D represents a substitution group which does not contain an active hydrogen group individually and independently (p) to (r) represent an integer of 0 to 3 individually and independently, the total of (p) to (r) is at 2 or higher, (s) represents an integer of 0 to 4 individually and independently and (x) represents an integer of 0 to 5. Thereby, it is possible to obtain a prepreg and a copper-clad laminated board whose permittivity is low and which are excellent in a solder heat-resistant property.

4. 发明专利

JPH06220172A BIODEGRADABLE POLYMER 失效
公开(公告)号：JPH06220172A
公开(公告)日：1994-08-09
申请号：JP3435593
申请日：1993-01-28
申请人： UNITIKA LTD
发明人： IWAYA YOSHIAKI , IKEDA TOSHIRO
IPC分类号： C08G63/16 , C08G63/682 , C08G63/91 , C08L101/16
摘要： PURPOSE:To obtain the subject polymer consisting of a specific recurring unit, having specific intrinsic viscosity, excellent in strength and durability, readily decomposed by microorganisms, etc., in soil after using and capable of molding into a film, fiber, etc. CONSTITUTION:The objective polymer consists of a recurring unit of the formula [x is 2 or 4; y is 0 or 2; n is integer of 5-500, preferably 10-100] and has at least 0.3 intrinsic viscosity and >=100 deg.C melting point. The polymer is obtained by polycondensing, e.g. an aliphatic dicarboxylic acid or its diester with a glycol under nitrogen and reduced pressure to synthesize an aliphatic polyester having OH groups at both ends and then reacting the resultant aliphatic polyester with butanetetracarboxylic acid dianhydride or butanetetracarboxylic acid under melting.

5. 发明专利

JPH06145283A BIODEGRADABLE POLYMER 失效
公开(公告)号：JPH06145283A
公开(公告)日：1994-05-24
申请号：JP32492692
申请日：1992-11-09
申请人： UNITIKA LTD
发明人： IWAYA YOSHIAKI , IKEDA TOSHIRO
IPC分类号： C08G18/42 , C08G63/16 , C08G63/685 , C08L101/16
摘要： PURPOSE:To provide the subject polymer having a specific structure obtained by extending the chain of an aliphatic polyester with urethane bond, having high melting point, formable to fiber and film and exhibiting sufficiently high strength and durability and, accordingly, usable as a general-purpose plastic. CONSTITUTION:The objective polymer is composed of the recurring unit of formula I ((x) is 2 or 4; (y) is 0 or 2; (z) is 2-10; (n) is 5-500) and has a number- average molecular weight of 5,000-100,000 (in terms of polystyrene) determined by gel-filtration chromatography. The polymer is preferably produced by carrying out the polycondensation of an aliphatic diol such as oxalic acid with a glycol such as ethylene glycol in nitrogen atmosphere under reduced pressure to obtain an aliphatic polyester having terminal OH group and reacting the polyester with an aliphatic diisocyanate of formula II under melting. The compound of formula II is preferably hexamethylene diisocyanate.

6. 发明专利

JPH0586214A PREPREG FOR LAMINATE AND COPPER-CLAD LAMINATE USING THE SAME 失效
公开(公告)号：JPH0586214A
公开(公告)日：1993-04-06
申请号：JP27347891
申请日：1991-09-26
申请人： UNITIKA LTD
发明人： IWAYA YOSHIAKI , IKEDA TOSHIRO
IPC分类号： B32B15/08 , C08J5/08 , C08J5/24 , H05K1/03
摘要： PURPOSE:To provide the subject prepreg enhanced in the wettability and the impregnating property, excellent in the heat resistance. moisture resistance and alkali resistance and suitable for multi-layered printed wiring plate materials, etc., by impregnating a specific glass fiber substrate with a cyanate ester resin and subsequently drying the impregnated substrate. CONSTITUTION:A glass fiber material substrate surface-treated with a silane coupling agent having one or more of amino groups and a benzene ring in the molecule, such as N-beta-(Nvinylaminoethyl)-gamma-aminopropyltrimethoxysilane (the amount of the adhered agent is preferably 0.08-0.3wt.%) is impregnated with a cyanate ester resin preferably in an amount of 30-70wt.% (as the solid content) and subsequently dried to provide the objective prepreg. The prepreg is laminated, and a copper foil is adhered to the surface of the laminated prepreg to obtain a copper-clad laminate.

7. 发明专利

JPH04300952A THERMOSETTING RESIN COMPOSITION AND PREPREG AND COPPER-CLAD LAMINATED BOARD PRODUCED BY USING THE SAME 失效
公开(公告)号：JPH04300952A
公开(公告)日：1992-10-23
申请号：JP13366091
申请日：1991-03-28
申请人： UNITIKA LTD
发明人： IWAYA YOSHIAKI , IKEDA TOSHIRO
IPC分类号： C08G73/06 , C08L65/00 , C08L79/04 , H05K1/03 , H05K3/46
摘要： PURPOSE:To provide a composition giving a material for a printed circuit board having low dielectric constant and excellent moisture-absorption, heat-resistance, alkali-resistance, dimensional stability and through-hole plating reliability while keeping low-dielectric constant and low hygroscopicity of a cyanate ester resin and suitable for high-speed computer, satellite communication, etc. CONSTITUTION:The objective composition is produced by compounding (A) a cyanate ester resin expressed by formula I (A is aromatic ring, etc.; B is 7-20C polycyclic alicyclic group; D is substituent free from active hydroxyl group; p, q and r are 0-3; p+q+r is >=2; s is 0-4; o is

8. 发明专利

JPH04244810A GLASS CLOTH FOR REINFORCING FLUOROPLASTIC AND COMPOSITE BODY REINFORCED BY SAID GLASS CLOTH 失效
公开(公告)号：JPH04244810A
公开(公告)日：1992-09-01
申请号：JP2942291
申请日：1991-01-29
申请人： UNITIKA LTD
发明人： IKEDA MORITAKA , IKEDA TOSHIRO
IPC分类号： B29B11/16 , B29B15/12 , B29C70/06 , B29K27/12 , B29K105/08
摘要： PURPOSE:To provide glass cloth for reinforcing fluoroplastics having adhesive properties to fluoroplastics and a composite body composed of the glass cloth and fluoroplastics. CONSTITUTION:Heat cleaning glass cloth is dipped in a treating liquid containing a silane coupling agent having at last one amino group in structure such as N-beta-(N-vinylbenzylaminoethyl)-gamma-aminopropyl trimethoxysilane, and dried and thermally treated, thus obtaining surface-treated glass cloth. Said surface-treated glass cloth is held between fluoroplastic films such as tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer films to acquire a laminate, and the laminate is heated, pressed and molded, thus obtaining a composite body.

9. 发明专利

JPH06145313A ALIPHATIC POLYESTER AND ITS PRODUCTION 失效
公开(公告)号：JPH06145313A
公开(公告)日：1994-05-24
申请号：JP32492792
申请日：1992-11-09
申请人： UNITIKA LTD
发明人： IWAYA YOSHIAKI , IKEDA TOSHIRO
IPC分类号： C08G63/16 , C08L101/16
摘要： PURPOSE:To provide an aliphatic polyester which is biodegradable and usable in the form of a molding and to provide a process for its production. CONSTITUTION:An aliphatic polyester comprising repeating units of the formula wherein x is an integer of 2-20, y is an integer of 0-16, and n is an integer of 5-500 and having a number-average molecular weight of 5000-100000 (in terms of polystyrene) as determined by gel permeation chromatography(GPC).

10. 发明专利

JPH04198218A THERMOSETTING RESIN COMPOSITION AND PREPREG AND COPPER-CLAD LAMINATE PREPARED BY USING SAME 失效
公开(公告)号：JPH04198218A
公开(公告)日：1992-07-17
申请号：JP32130690
申请日：1990-11-27
申请人： UNITIKA LTD
发明人： IWAYA YOSHIAKI , IKEDA TOSHIRO
IPC分类号： C08J5/24 , C08G73/06 , C08L79/04 , H05K1/03 , H05K3/46
摘要： PURPOSE:To obtain the title composition which can give a laminate having low permittivity, low dielectric loss tangent and good heat resistance and improved in flexibility and dimensional stability by mixing a specified cyanate ester resin with a bismaleimide compound. CONSTITUTION:A thermosetting resin composition is obtained by mixing a cyanate ester resin of formula I (wherein A is an aromatic group or an aromatic ring-containing group; B is a 7-20C polycyclic alicyclic group; D is an active hydrogen-free substituent; p, q and r are each 0-3; their sum is 2 or greater, and s is 0-5) [e.g. XU-71787 of formula II (a product of Dow Chemical)] with bismaleimide of formula III (wherein R is an aromatic, aliphatic or alicyclic group) (e.g. N,N'-4,4'-diphenylmethane bismaleimide). Because the obtained composition contains the compound of formula III, it can give a laminate having low permittivity and low dielectric loss tangent characteristic of the resin of formula I and improved in flexibility and dimensional stability. This laminate can be desirably used as of a multilayer printed wiring board for e.g. a high- speed the material computer.

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