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1. 发明公开

EP3015219A1 AUTOMATIC COMPONENT LOADING SYSTEM 有权
标题翻译：自动化BAUTEILLADESYSTEM
公开(公告)号：EP3015219A1
公开(公告)日：2016-05-04
申请号：EP15192299.4
申请日：2015-10-30
申请人： Tyco Electronics (Shanghai) Co. Ltd. , Tyco Electronics (Shenzhen) Co. Ltd. , Shenzhen AMI Technology Co., Ltd
发明人： DENG, Yingcong , ZHANG, Dandan , LU, Roberto Francisco-Yi , WU, Yaodong , CHEN, Zhenliang , LI, Zhao , SU, Jin , LI, Zhi , ZENG, Qinglong
IPC分类号： B23Q7/14 , B23Q16/06 , H05K13/00
摘要： An automatic component loading system includes: a loading device configured to pick up respective components based on a preset program; a conveying device provided with a plurality of first trays for receiving the components and configured so that the plurality of first trays each is circularly moved between a loading position and an unloading position to allow the loading device to load the picked components on the first tray at the loading position; and a position correcting device configured to drive the conveying device or each first tray to move in a case where each first tray deviates from its loading position, so as to position the first trays at the respective loading positions thereof. In this way, it may ensure that the first tray on which components to be loaded is accurately and efficiently positioned at its loading position, and the components may be accurately loaded on respective locations of the first tray, facilitating a subsequent operation to automatically grip the components.
摘要翻译：自动部件加载系统包括：加载装置，被配置为基于预设程序拾取相应的部件; 传送装置，其设置有多个用于接收部件的第一托盘，并且构造成使得多个第一托盘各自在装载位置和卸载位置之间循环移动，以允许装载装置将拾取的部件装载在第一托盘上装载位置; 以及位置校正装置，其构造成在每个第一托盘偏离其装载位置的情况下驱动所述输送装置或每个第一托盘移动，以便将所述第一托盘定位在其相应的装载位置。以这种方式，它可以确保要在其上装载部件的第一托盘在其装载位置处被精确且有效地定位，并且部件可以被精确地装载在第一托盘的相应位置上，从而有助于随后的操作以自动地夹紧组件。

2. 发明申请

WO2018210884A2 WIRE AUTOMATIC SOLDERING SYSTEM 审中-公开
公开(公告)号：WO2018210884A2
公开(公告)日：2018-11-22
申请号：PCT/EP2018/062625
申请日：2018-05-15
申请人： TYCO ELECTRONICS (SHANGHAI) CO. LTD. , TE CONNECTIVITY CORPORATION , MEASUREMENT SPECIALTIES (CHENGDU) LTD. , SHENZHEN AMI TECHNOLOGY CO., LTD. , TYCO ELECTRONICS UK LTD
发明人： XIE, Fengchun , ZHANG, Dandan , LU, Roberto Francisco-Yi , HU, Lvhai , ZENG, Qinglong , GONG, Lan , YING, Qian , DENG, Yingcong , LIU, Yun
IPC分类号： B23K1/00 , B23K1/08
摘要： A wire automatic soldering system includes: a carrier adapted to load an electrical product to be soldered; a robot adapted to grip and move the carrier on which the electrical product is loaded; a solder paste container configured to contain a solder paste; and a heater configured to heat the solder paste contained in the solder paste container, so that the solder paste is melted into liquid. The robot is adapted to move wires of the electrical product into the solder paste container, so as to solder the wires together by the solder paste in the solder paste container. The wire automatic soldering system may automatically perform the task of soldering wires of the electrical product. Thereby, it may be suitable for automatic soldering of mass electrical products, and improve the soldering efficiency.

3. 发明申请

WO2018172470A9 HEAT SHRINKABLE TUBE ASSEMBLY SYSTEM 审中-公开
公开(公告)号：WO2018172470A9
公开(公告)日：2018-09-27
申请号：PCT/EP2018/057332
申请日：2018-03-22
申请人： TYCO ELECTRONICS (SHANGHAI) CO. LTD. , TE CONNECTIVITY CORPORATION , SHENZHEN AMI TECHNOLOGY CO., LTD. , MEASUREMENT SPECIALTIES (CHENGDU) LTD. , TYCO ELECTRONICS UK LTD
发明人： XIE, Fengchun , ZHANG, Dandan , LU, Roberto Francisco-Yi , HU, Lvhai , ZENG, Qinglong , GONG, Lan , YING, Qian
IPC分类号： H01R4/72 , B25J9/16 , H01R43/00 , H02G15/18
摘要： An assembly system, including: a feeding mechanism (100) adapted to feed a heat shrinkable tube (12); a cutting mechanism (200) adapted to cut off a section of heat shrinkable tube with a predetermined length from the heat shrinkable tube fed by the feeding mechanism; a clamping mechanism (300) adapted to clamp the heat shrinkable tube during cutting the heat shrinkable tube by the cutting mechanism; a robot (500) adapted to grip the section of heat shrinkable tube cut off from the heat shrinkable tube; and a vision system (410, 420) adapted to guide the robot to sleeve the section of heat shrinkable tube onto a wire (11) of an electrical device (10). The assembly system may realize the automatic assembly of the heat shrinkable tube, improving the assembly efficiency and ensuring the assembly accuracy.

4. 发明申请

WO2018210878A1 ASSEMBLY SYSTEM ADAPTED TO ASSEMBLE A HEAT SHRINKABLE TUBE ONTO AN ELECTRICAL WIRE 审中-公开
公开(公告)号：WO2018210878A1
公开(公告)日：2018-11-22
申请号：PCT/EP2018/062616
申请日：2018-05-15
申请人： TYCO ELECTRONICS (SHANGHAI) CO. LTD. , TE CONNECTIVITY CORPORATION , MEASUREMENT SPECIALTIES (CHENGDU) LTD. , SHENZHEN AMI TECHNOLOGY CO., LTD. , TYCO ELECTRONICS UK LTD
发明人： XIE, Fengchun , ZHANG, Dandan , LU, Roberto Francisco-Yi , HU, Lvhai , ZENG, Qinglong , GONG, Lan , YING, Qian , DENG, Yingcong , LIU, Yun
IPC分类号： H01R4/72 , B25J9/16 , H01R43/00 , H02G15/18
摘要： An assembly system includes: a feeding mechanism configured to feed a heat shrinkable tube; a cutting mechanism adapted to cut off a segment of heat shrinkable tube from the heat shrinkable tube fed by the feeding mechanism; a robot adapted to grip the segment of heat shrinkable tube cut off from the heat shrinkable tube; and a vision system adapted to visually guide the robot to assemble the segment of heat shrinkable tube onto a wire of an electrical product. The assembly system may realize the automatic assembly of the heat shrinkable tube, thereby improving the assembly efficiency and ensuring the assembly accuracy.

5. 发明申请

WO2018011718A1 CHIP SORTING AND PACKAGING PLATFORM 审中-公开
标题翻译：芯片分拣和包装平台
公开(公告)号：WO2018011718A1
公开(公告)日：2018-01-18
申请号：PCT/IB2017/054192
申请日：2017-07-12
申请人： TYCO ELECTRONICS (SHANGHAI) CO. LTD. , TE CONNECTIVITY CORPORATION , SHENZHEN AMI TECHNOLOGY CO., LTD. , TYCO ELECTRONICS UK LTD
发明人： ZHOU, Lei , ZHANG, Dandan , LU, Roberto Francisco-Yi , ZENG, Qinglong
IPC分类号： B07C5/344 , B07C5/36
摘要： The present disclosure discloses a chip sorting and packaging platform including: a feed module adapted to feed chips; a sorting module configured to pick up the chips fed by the supply module and detecting the picked chips to determine whether the picked chips are qualified; and a packaging module configured to package the qualified chips sorted by the sorting module. In the present disclosure, the sorting and packaging of the clips is automatically achieved by the chip sorting and packaging platform, which greatly improves efficiency of sorting and packaging of the clips. In addition, it is also possible to improve accuracy and reliability of sorting the clips.
摘要翻译：本公开公开了一种芯片分类和包装平台，包括：馈送模块，适于馈送芯片; 分拣模块，用于拾取由供给模块供给的芯片并检测拾取的芯片以确定拾取的芯片是否合格; 以及封装模块，其被配置为封装由分类模块分类的合格芯片。在本发明中，通过芯片分拣包装平台自动实现夹具的分拣和包装，大大提高了夹具分拣包装的效率。此外，还可以提高分类剪辑的准确性和可靠性。

6. 发明申请

WO2018210884A3 WIRE AUTOMATIC SOLDERING SYSTEM 审中-公开
公开(公告)号：WO2018210884A3
公开(公告)日：2018-11-22
申请号：PCT/EP2018/062625
申请日：2018-05-15
申请人： TYCO ELECTRONICS (SHANGHAI) CO. LTD. , TE CONNECTIVITY CORPORATION , MEASUREMENT SPECIALTIES (CHENGDU) LTD. , SHENZHEN AMI TECHNOLOGY CO., LTD. , TYCO ELECTRONICS UK LTD
发明人： XIE, Fengchun , ZHANG, Dandan , LU, Roberto Francisco-Yi , HU, Lvhai , ZENG, Qinglong , GONG, Lan , YING, Qian , DENG, Yingcong , LIU, Yun
IPC分类号： B23K1/00 , B23K1/08 , B23K101/38
摘要： A wire automatic soldering system includes: a carrier (120) adapted to load an electrical product (10) to be soldered; a robot (100) adapted to grip and move the carrier on which the electrical product is loaded; a solder paste container (200) configured to contain a solder paste; and a heater (220) configured to heat the solder paste contained in the solder paste container, so that the solder paste is melted into liquid. The robot is adapted to move wires (11) of the electrical product into the solder paste container, so as to solder the wires together by the solder paste in the solder paste container. The wire automatic soldering system may automatically perform the task of soldering wires of the electrical product. Thereby, it may be suitable for automatic soldering of mass electrical products, and improve the soldering efficiency.

7. 发明申请

WO2018172470A1 HEAT SHRINKABLE TUBE ASSSEMBLY SYSTEM 审中-公开
公开(公告)号：WO2018172470A1
公开(公告)日：2018-09-27
申请号：PCT/EP2018/057332
申请日：2018-03-22
申请人： TYCO ELECTRONICS (SHANGHAI) CO. LTD. , TE CONNECTIVITY CORPORATION , SHENZHEN AMI TECHNOLOGY CO., LTD. , MEASUREMENT SPECIALTIES (CHENGDU) LTD. , TYCO ELECTRONICS UK LTD
发明人： XIE, Fengchun , ZHANG, Dandan , LU, Roberto Francisco-Yi , HU, Lvhai , ZENG, Qinglong , GONG, Lan , YING, Qian
IPC分类号： H01R4/72 , B25J9/16 , H01R43/00 , H02G15/18
摘要： An assembly system, including: a feeding mechanism (100) adapted to feed a heat shrinkable tube (12); a cutting mechanism (200) adapted to cut off a section of heat shrinkable tube with a predetermined length from the heat shrinkable tube fed by the feeding mechanism; a clamping mechanism (300) adapted to clamp the heat shrinkable tube during cutting the heat shrinkable tube by the cutting mechanism; a robot (500) adapted to grip the section of heat shrinkable tube cut off from the heat shrinkable tube; and a vision system (410, 420) adapted to guide the robot to sleeve the section of heat shrinkable tube onto a wire (11) of an electrical device (10). The assembly system may realize the automatic assembly of the heat shrinkable tube, improving the assembly efficiency and ensuring the assembly accuracy.

8. 发明授权

EP3315904B1 THICKNESS DETECTION EXPERIMENT PLATFORM 有权转让
公开(公告)号：EP3315904B1
公开(公告)日：2019-08-07
申请号：EP17198960.1
申请日：2017-10-27
申请人： Tyco Electronics (Shanghai) Co. Ltd. , TE Connectivity Corporation , Shenzhen AMI Technology Co. Ltd
发明人： ZHOU, Lei , ZHANG, Dandan , LU, Roberto Francisco-Yi , ZENG, Qinglong
IPC分类号： G01B21/04 , G01B11/06

9. 发明公开

EP3477798A1 ASSEMBLY SYSTEM 有权转让
公开(公告)号：EP3477798A1
公开(公告)日：2019-05-01
申请号：EP18202092.5
申请日：2018-10-23
申请人： Tyco Electronics (Shanghai) Co. Ltd. , TE Connectivity Corporation , TE Connectivity Germany GmbH , MEAS France , Kunshan League Automechanism Co., Ltd. , Shenzhen AMI Technology Co., Ltd
发明人： DENG, Yingcong , ZHANG, Dandan , HU, Lvhai , GLASER, Karlheinz , SKURJATIN, Valentin , BOUMEDDANE, Hamza , WIECHERT, Sebastian , PECQUET, Nicolas Christophe R , BROCH, Eric , LIU, Yun , LU, Roberto Francisco-Yi , WU, Haidong , ZENG, Qinglong
IPC分类号： H01R43/20 , H01R43/02
摘要： An assembly system, includes: an assembly mechanism comprising a fixation device for fixing a housing and a first lead assembly mechanism and a second lead assembly mechanism provided at both sides of the fixation device, respectively, wherein the first lead assembly mechanism is adapted to insert a first lead into the housing, the second lead assembly mechanism is adapted to insert a second lead into the housing, and the first lead is inserted into the housing before the second lead. The assembly system further comprises a pressing mechanism adapted to hold the first lead inserted into the housing at a correct installation position, so as to prevent the first lead from being offset from its correct installation position and hindering operation of inserting the second lead during inserting the second lead. The assembly system may automatically complete the task of assembling the first lead and the second lead into the housing, improving the efficiency of inserting the leads into the housing, and increasing the quality of the assembly product.

10. 发明公开

EP3315904A1 THICKNESS DETECTION EXPERIMENT PLATFORM 有权转让
标题翻译：厚度检测实验平台
公开(公告)号：EP3315904A1
公开(公告)日：2018-05-02
申请号：EP17198960.1
申请日：2017-10-27
申请人： Tyco Electronics (Shanghai) Co. Ltd. , TE Connectivity Corporation , Shenzhen AMI Technology Co. Ltd
发明人： ZHOU, Lei , ZHANG, Dandan , LU, Roberto Francisco-Yi , ZENG, Qinglong
IPC分类号： G01B21/04 , G01B11/06
CPC分类号： G01B11/06 , G01B11/0691 , G01B21/042 , G01B2210/44 , G05B19/401
摘要： A thickness detection experiment platform, including: a motion simulation module adapted to drive a product to be detected to perform a predetermined simulation motion simulating various motions of the product on an actual production line; and a thickness detection module adapted to detect a thickness of the product driven by the motion simulation module. In the present disclosure, the motion simulation module may drive the product to be detected to simulate various motions of the product on the actual production line. Thereby, conditions of the product on the actual production line may be simulated and reproduced in the laboratory. As a result, the thickness detection experiment platform may be debugged offline in the laboratory without needing of debugging online. Thus, normal production of the actual production line is not affected, and debugging of the thickness detection experiment platform becomes easier.
摘要翻译： 1。一种厚度检测实验平台，其特征在于，包括：运动模拟模块，用于驱动待检测产品执行模拟所述产品在实际生产线上的各种运动的预定模拟运动; 以及厚度检测模块，适于检测由运动模拟模块驱动的产品的厚度。在本公开中，运动模拟模块可以驱动待检测产品以模拟实际生产线上的产品的各种运动。因此，实际生产线上的产品条件可以在实验室中模拟和复制。因此，厚度检测实验平台可以在实验室离线调试，无需在线调试。因此，实际生产线的正常生产不受影响，厚度检测实验平台的调试变得更容易。

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