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1. 发明申请

WO2018172470A9 HEAT SHRINKABLE TUBE ASSEMBLY SYSTEM 审中-公开
公开(公告)号：WO2018172470A9
公开(公告)日：2018-09-27
申请号：PCT/EP2018/057332
申请日：2018-03-22
申请人： TYCO ELECTRONICS (SHANGHAI) CO. LTD. , TE CONNECTIVITY CORPORATION , SHENZHEN AMI TECHNOLOGY CO., LTD. , MEASUREMENT SPECIALTIES (CHENGDU) LTD. , TYCO ELECTRONICS UK LTD
发明人： XIE, Fengchun , ZHANG, Dandan , LU, Roberto Francisco-Yi , HU, Lvhai , ZENG, Qinglong , GONG, Lan , YING, Qian
IPC分类号： H01R4/72 , B25J9/16 , H01R43/00 , H02G15/18
摘要： An assembly system, including: a feeding mechanism (100) adapted to feed a heat shrinkable tube (12); a cutting mechanism (200) adapted to cut off a section of heat shrinkable tube with a predetermined length from the heat shrinkable tube fed by the feeding mechanism; a clamping mechanism (300) adapted to clamp the heat shrinkable tube during cutting the heat shrinkable tube by the cutting mechanism; a robot (500) adapted to grip the section of heat shrinkable tube cut off from the heat shrinkable tube; and a vision system (410, 420) adapted to guide the robot to sleeve the section of heat shrinkable tube onto a wire (11) of an electrical device (10). The assembly system may realize the automatic assembly of the heat shrinkable tube, improving the assembly efficiency and ensuring the assembly accuracy.

2. 发明申请

WO2018210884A2 WIRE AUTOMATIC SOLDERING SYSTEM 审中-公开
公开(公告)号：WO2018210884A2
公开(公告)日：2018-11-22
申请号：PCT/EP2018/062625
申请日：2018-05-15
申请人： TYCO ELECTRONICS (SHANGHAI) CO. LTD. , TE CONNECTIVITY CORPORATION , MEASUREMENT SPECIALTIES (CHENGDU) LTD. , SHENZHEN AMI TECHNOLOGY CO., LTD. , TYCO ELECTRONICS UK LTD
发明人： XIE, Fengchun , ZHANG, Dandan , LU, Roberto Francisco-Yi , HU, Lvhai , ZENG, Qinglong , GONG, Lan , YING, Qian , DENG, Yingcong , LIU, Yun
IPC分类号： B23K1/00 , B23K1/08
摘要： A wire automatic soldering system includes: a carrier adapted to load an electrical product to be soldered; a robot adapted to grip and move the carrier on which the electrical product is loaded; a solder paste container configured to contain a solder paste; and a heater configured to heat the solder paste contained in the solder paste container, so that the solder paste is melted into liquid. The robot is adapted to move wires of the electrical product into the solder paste container, so as to solder the wires together by the solder paste in the solder paste container. The wire automatic soldering system may automatically perform the task of soldering wires of the electrical product. Thereby, it may be suitable for automatic soldering of mass electrical products, and improve the soldering efficiency.

3. 发明申请

WO2018210878A1 ASSEMBLY SYSTEM ADAPTED TO ASSEMBLE A HEAT SHRINKABLE TUBE ONTO AN ELECTRICAL WIRE 审中-公开
公开(公告)号：WO2018210878A1
公开(公告)日：2018-11-22
申请号：PCT/EP2018/062616
申请日：2018-05-15
申请人： TYCO ELECTRONICS (SHANGHAI) CO. LTD. , TE CONNECTIVITY CORPORATION , MEASUREMENT SPECIALTIES (CHENGDU) LTD. , SHENZHEN AMI TECHNOLOGY CO., LTD. , TYCO ELECTRONICS UK LTD
发明人： XIE, Fengchun , ZHANG, Dandan , LU, Roberto Francisco-Yi , HU, Lvhai , ZENG, Qinglong , GONG, Lan , YING, Qian , DENG, Yingcong , LIU, Yun
IPC分类号： H01R4/72 , B25J9/16 , H01R43/00 , H02G15/18
摘要： An assembly system includes: a feeding mechanism configured to feed a heat shrinkable tube; a cutting mechanism adapted to cut off a segment of heat shrinkable tube from the heat shrinkable tube fed by the feeding mechanism; a robot adapted to grip the segment of heat shrinkable tube cut off from the heat shrinkable tube; and a vision system adapted to visually guide the robot to assemble the segment of heat shrinkable tube onto a wire of an electrical product. The assembly system may realize the automatic assembly of the heat shrinkable tube, thereby improving the assembly efficiency and ensuring the assembly accuracy.

4. 发明申请

WO2018210884A3 WIRE AUTOMATIC SOLDERING SYSTEM 审中-公开
公开(公告)号：WO2018210884A3
公开(公告)日：2018-11-22
申请号：PCT/EP2018/062625
申请日：2018-05-15
申请人： TYCO ELECTRONICS (SHANGHAI) CO. LTD. , TE CONNECTIVITY CORPORATION , MEASUREMENT SPECIALTIES (CHENGDU) LTD. , SHENZHEN AMI TECHNOLOGY CO., LTD. , TYCO ELECTRONICS UK LTD
发明人： XIE, Fengchun , ZHANG, Dandan , LU, Roberto Francisco-Yi , HU, Lvhai , ZENG, Qinglong , GONG, Lan , YING, Qian , DENG, Yingcong , LIU, Yun
IPC分类号： B23K1/00 , B23K1/08 , B23K101/38
摘要： A wire automatic soldering system includes: a carrier (120) adapted to load an electrical product (10) to be soldered; a robot (100) adapted to grip and move the carrier on which the electrical product is loaded; a solder paste container (200) configured to contain a solder paste; and a heater (220) configured to heat the solder paste contained in the solder paste container, so that the solder paste is melted into liquid. The robot is adapted to move wires (11) of the electrical product into the solder paste container, so as to solder the wires together by the solder paste in the solder paste container. The wire automatic soldering system may automatically perform the task of soldering wires of the electrical product. Thereby, it may be suitable for automatic soldering of mass electrical products, and improve the soldering efficiency.

5. 发明申请

WO2018172470A1 HEAT SHRINKABLE TUBE ASSSEMBLY SYSTEM 审中-公开
公开(公告)号：WO2018172470A1
公开(公告)日：2018-09-27
申请号：PCT/EP2018/057332
申请日：2018-03-22
申请人： TYCO ELECTRONICS (SHANGHAI) CO. LTD. , TE CONNECTIVITY CORPORATION , SHENZHEN AMI TECHNOLOGY CO., LTD. , MEASUREMENT SPECIALTIES (CHENGDU) LTD. , TYCO ELECTRONICS UK LTD
发明人： XIE, Fengchun , ZHANG, Dandan , LU, Roberto Francisco-Yi , HU, Lvhai , ZENG, Qinglong , GONG, Lan , YING, Qian
IPC分类号： H01R4/72 , B25J9/16 , H01R43/00 , H02G15/18
摘要： An assembly system, including: a feeding mechanism (100) adapted to feed a heat shrinkable tube (12); a cutting mechanism (200) adapted to cut off a section of heat shrinkable tube with a predetermined length from the heat shrinkable tube fed by the feeding mechanism; a clamping mechanism (300) adapted to clamp the heat shrinkable tube during cutting the heat shrinkable tube by the cutting mechanism; a robot (500) adapted to grip the section of heat shrinkable tube cut off from the heat shrinkable tube; and a vision system (410, 420) adapted to guide the robot to sleeve the section of heat shrinkable tube onto a wire (11) of an electrical device (10). The assembly system may realize the automatic assembly of the heat shrinkable tube, improving the assembly efficiency and ensuring the assembly accuracy.

6. 发明申请

WO2018167207A1 CARRIER 审中-公开
公开(公告)号：WO2018167207A1
公开(公告)日：2018-09-20
申请号：PCT/EP2018/056521
申请日：2018-03-15
申请人： TYCO ELECTRONICS (SHANGHAI) CO. LTD. , TE CONNECTIVITY CORPORATION , MEASUREMENT SPECIALTIES (CHENGDU) LTD. , TYCO ELECTRONICS UK LTD.
发明人： XIE, Fengchun , ZHANG, Dandan , LU, Roberto Francisco-Yi , HU, Lvhai , ZENG, Qinglong , GONG, Lan , YING, Qian , DENG, Yingcong , LIU, Yun
IPC分类号： H05K3/30 , G01R1/04 , G01R31/01
摘要： Disclosed is a carrier including: a base (100) on which a circuit board (121) is mounted; a loading device (111) mounted on the base (100) and configured to load an electronic device (1) thereon; a first pressing device mounted on the base (100) and configured to press a first lead end (1a) protruding from the electronic device (1) on the circuit board (121) to electrically contact the circuit board (121); and a second pressing device mounted on the base (100) and configured to press a second lead end (1b) of the electronic device (1) on the base (100). The carrier is provided with the first pressing device and the second pressing device adapted to fix the first lead end and the second lead end of the electronic device. Thereby, the carrier is adapted to load an electronic device with flexible lead ends.

7. 发明申请

WO2018167216A1 AUTOMATIC SOLDER PASTE FEEDING SYSTEM 审中-公开
公开(公告)号：WO2018167216A1
公开(公告)日：2018-09-20
申请号：PCT/EP2018/056546
申请日：2018-03-15
申请人： TYCO ELECTRONICS (SHANGHAI) CO. LTD. , TE CONNECTIVITY CORPORATION , MEASUREMENT SPECIALTIES (CHENGDU) LTD. , TYCO ELECTRONICS UK LTD
发明人： XIE, Fengchun , ZHANG, Dandan , LU, Roberto Francisco-Yi , HU, Lvhai , ZENG, Qinglong , GONG, Lan , YING, Qian , DENG, Yingcong , LIU, Yun
IPC分类号： B23K1/00 , B23K3/06 , H05K3/34
摘要： An automatic solder paste feeding system includes: a base (10); a container (200) mounted on the base and configured to contain solder paste therein; a syringe (100) mounted on the base and configured to inject the solder paste into the container; and a heater (240) mounted on the base and configured to heat the solder paste contained in the container, so that the solder paste is melted into liquid state. The solder paste may be automatically fed by the automatic solder paste feeding system, it improves the feeding efficiency of the solder paste.

8. 发明公开

EP3257618A1 WELDING SYSTEM & WELDING METHOD 有权转让
标题翻译：焊接系统和焊接方法
公开(公告)号：EP3257618A1
公开(公告)日：2017-12-20
申请号：EP17173364.5
申请日：2017-05-30
申请人： Tyco Electronics (Shanghai) Co., Ltd. , Measurement Specialties (Chengdu) Ltd , TE Connectivity Corporation , Shenzhen AMI Technology Co. Ltd
发明人： DENG, Yingcong , GONG, Lan , YING, Qian , ZHANG, Dandan , HU, Lvhai , LIU, Yun , ZENG, Qinglong , YAN, Yong , LU, Roberto Francisco-Yi
IPC分类号： B23K37/053 , B23K26/21 , B23K26/08 , B23K26/042 , B23K26/03 , B23K101/32
CPC分类号： B23K26/22 , B23K26/032 , B23K26/042 , B23K26/0853 , B23K26/123 , B23K26/1435 , B23K26/21 , B23K37/0452 , B23K37/053 , B23K2201/32
摘要： A welding system configured to weld a first elongated element (10) and a second elongated element (20) together, and comprising: a first moving mechanism (510); a first fixture (410) adapted to fix the first elongated element (10); a second moving mechanism (520); a second fixture (420) adapted to fix the second elongated element (20); and a laser welding head (100) adapted to emit a laser beam (110), wherein the first fixture (410) is mounted on the first moving mechanism (510), and the first moving mechanism (510) is configured to move the first fixture (410), so that the first elongated element (10) fixed on the first fixture (410) is aligned with the second elongated element (20) fixed on the second fixture (420), and wherein the first moving mechanism (510) and the second fixture (420) are mounted on the second moving mechanism (520), and the second moving mechanism (520) is configured to move the first moving mechanism (510) and the second fixture (420), so that an ideal welding center point (C') of the aligned first and second elongated elements (10, 20) is accurately located at a focal point (C) of the laser beam (110) from the laser welding head (100). The ideal welding center point of the aligned first and second elongated elements may be quickly and accurately moved to the focal point of the laser beam emitted from the laser welding head by the second moving mechanism.
摘要翻译：一种焊接系统，其被配置成将第一细长元件（10）和第二细长元件（20）焊接在一起，并且包括：第一移动机构（510）;以及第二移动机构适于固定所述第一细长元件（10）的第一固定件（410）; 第二移动机构（520）; 适于固定第二细长元件（20）的第二固定件（420）; 和适于发射激光束（110）的激光焊接头（100），其中所述第一固定装置（410）安装在所述第一移动机构（510）上，并且所述第一移动机构（510）构造成移动所述第一固定装置使得固定在第一固定件410上的第一细长元件10与固定在第二固定件420上的第二细长元件20对齐，和第二固定件（420）安装在第二移动机构（520）上，并且第二移动机构（520）构造成移动第一移动机构（510）和第二固定件（420），从而理想的焊接对准的第一和第二细长元件（10,20）的中心点（C'）精确地位于来自激光焊接头（100）的激光束（110）的焦点（C）处。对齐的第一和第二细长元件的理想焊接中心点可以通过第二移动机构快速且准确地移动到从激光焊接头发射的激光束的焦点。

9. 发明公开

EP3349550A1 FIXING APPARATUS 有权转让
公开(公告)号：EP3349550A1
公开(公告)日：2018-07-18
申请号：EP18151590.9
申请日：2018-01-15
申请人： Tyco Electronics (Shanghai) Co. Ltd. , Measurement Specialties (Chengdu) Ltd , TE Connectivity Corporation
发明人： DENG, Yingcong , GONG, Lan , YING, Qian , ZHANG, Dandan , HU, Lvhai , LIU, Yun , YE, Lin , YAN, Yong , LU, Roberto Francisco - Yi , ZENG, Qinglong
IPC分类号： H05K1/11 , H05K3/30 , H05K3/34 , H01R43/02
CPC分类号： H05K3/325 , H01R12/515 , H01R43/0256 , H01R43/0263 , H05K1/111 , H05K1/117 , H05K3/301 , H05K3/303 , H05K3/3405 , H05K3/3421 , H05K2201/10227 , H05K2201/10287 , H05K2203/0165 , H05K2203/0278 , H05K2203/167
摘要： The disclosure discloses a fixing apparatus including: a first fixing device (100) adapted to position and fix a circuit board (1) having at least one pad (la); and a second fixing device (200) adapted to position and fix at least one wire (2). The first fixing device (100) is formed with a first positioning groove (111) adapted to position the circuit board (1), and the second fixing device (200) is formed with at least one second positioning groove (211) adapted to position the at least one wire (2). Each second positioning groove (211) is aligned with a corresponding pad (la) on the circuit board (1) so that the wire (2) fixed in the second positioning groove (211) is aligned with the corresponding pad (la) on the circuit board (1). Thus, the circuit board (1) and the wire (2) may be accurately positioned and reliably held in the first and second positioning grooves (111,211), thereby improving the positioning accuracy and reliability of the wire (2) and the circuit board (1).

10. 发明公开

EP3349312A1 FIXING APPARATUS 有权转让
公开(公告)号：EP3349312A1
公开(公告)日：2018-07-18
申请号：EP18150919.1
申请日：2018-01-10
申请人： Tyco Electronics (Shanghai) Co. Ltd. , Measurement Specialties (Chengdu) Ltd , TE Connectivity Corporation
发明人： DENG, Yingcong , GONG, Lan , YING, Qian , ZHANG, Dandan , HU, Lvhai , LIU, Yun , YE, Lin , YAN, Yong , LU, Roberto Francisco-Yi , ZENG, Qinglong
IPC分类号： H01R43/02 , H01R4/02
CPC分类号： B23K3/08 , H01R4/023 , H01R4/027 , H01R43/0263
摘要： The disclosure discloses a fixing apparatus comprising a first fixing device (100) adapted to position and fix at least one first elongated element (1); and a second fixing device (200) adapted to position and fix at least one second elongated element (2). The first fixing device (100) is formed with at least one first positioning groove (111) adapted to position the first elongated element (1), and the second fixing device (200) is formed with at least one second positioning groove (211) adapted to position the second elongated element (2). The first positioning groove (111) is aligned with a corresponded second positioning groove (211), so that the first elongated element (1) fixed in the first positioning groove (111) is axially aligned with the second elongated element (2) positioned in the corresponding second positioning groove (211). Thus, it is possible to accurately position the first and second elongated elements (1, 2) in the first and second positioning grooves (111, 211), respectively, thereby improving the alignment accuracy between the first and second elongated elements (1, 2).

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