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1. 发明申请

US20090162536A1 METHOD FOR FORMING FILM PATTERN, METHOD FOR FORMING CONTACT HOLE, METHOD FOR FORMING BUMP, AND METHOD FOR MANUFACTURING LIGHT EMITTING DEVICE 审中-公开
标题翻译：形成薄膜图案的方法，形成接触孔的方法，成型方法，以及制造发光装置的方法
公开(公告)号：US20090162536A1
公开(公告)日：2009-06-25
申请号：US12338194
申请日：2008-12-18
申请人： Toshimitsu HIRAI , Jun YAMADA , Tsuyoshi SHINTATE
发明人： Toshimitsu HIRAI , Jun YAMADA , Tsuyoshi SHINTATE
IPC分类号： B05D5/12
CPC分类号： H01J9/025 , H01J63/02 , H01J63/06 , H01L24/11 , H01L2224/05001 , H01L2224/05026 , H01L2224/05548 , H01L2224/11005 , H01L2224/1131 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/01072 , H01L2924/01074 , H01L2924/15788 , H01L2224/13099 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599 , H01L2924/00
摘要： A method for forming a film pattern disposed adjacent to a pattern non-forming region by coating a pattern forming region with a functional liquid, includes (a) forming a liquid repellent film by coating the pattern non-forming region with a droplet containing a liquid repellent material having repellency to the functional liquid, and (b) forming the film pattern by coating the pattern forming region adjacent to the liquid repellent film with the functional liquid. The step (a) of forming of the liquid repellent film and the step (b) of forming of the film pattern are alternately repeated at least two times, respectively.
摘要翻译：通过用功能性液体涂布图案形成区域来形成与图案非成形区域相邻设置的膜图案的方法包括：（a）通过用包含液体的液滴涂布图案非形成区域来形成疏液膜对功能性液体具有排斥性的驱避剂材料，（b）通过用功能性液体涂布与防液膜相邻的图案形成区域来形成膜图案。形成防液膜的步骤（a）和形成膜图案的步骤（b）分别交替重复至少两次。

2. 发明申请

US20090071706A1 METHOD FOR PRODUCING MULTILAYERED WIRING SUBSTRATE, MULTILAYERED WIRING SUBSTRATE, AND ELECTRONIC APPARATUS 审中-公开
标题翻译：生产多层配线基板，多层布线基板和电子设备的方法
公开(公告)号：US20090071706A1
公开(公告)日：2009-03-19
申请号：US12191358
申请日：2008-08-14
申请人： Tsuyoshi SHINTATE , Toshimitsu HIRAI , Jun YAMADA
发明人： Tsuyoshi SHINTATE , Toshimitsu HIRAI , Jun YAMADA
IPC分类号： H05K1/11 , B32B37/14
CPC分类号： H05K3/4664 , H05K1/185 , H05K3/125 , H05K2201/015 , H05K2203/013 , H05K2203/0759 , H05K2203/1173
摘要： A method for producing a multilayered wiring substrate includes forming a lyophobic area on a first conductive layer, forming an insulating layer with an opening portion on the first conductive layer by applying a functional liquid containing an insulating layer forming material on a periphery of the lyophobic area, laminating the first conductive layer and a second conductive layer via the insulating layer, and electrically connecting the first and the second conductive layers to each other via the opening portion formed in the insulating layer. In the method, when forming the insulating layer, the functional liquid is applied such that an angle of a portion of the functional liquid in contact with the lyophobic area becomes larger than a forward contact angle of the functional liquid, thereby allowing a position of the portion of the functional liquid in contact with the lyophobic area to move inside the lyophobic area to form the opening portion having an opening size smaller than a size of the lyophobic area.
摘要翻译：一种多层布线基板的制造方法，其特征在于，在第一导电层上形成疏液区域，在所述疏液性区域的周围涂布含有绝缘层形成材料的功能性液体，在所述第一导电层上形成具有开口部的绝缘层经由所述绝缘层层压所述第一导电层和第二导电层，并且经由形成在所述绝缘层中的所述开口部将所述第一导电层与所述第二导电层电连接。在该方法中，当形成绝缘层时，施加功能液体，使得与疏液区域接触的功能液体的一部分的角度大于功能液体的向前接触角，从而允许功能液体与疏液区域接触的部分在疏液区域内移动以形成具有小于疏液区域的开口尺寸的开口部分。

3. 发明申请

US20080119067A1 MANUFACTURING METHOD OF ELECTRONIC BOARD AND MULTILAYER WIRING BOARD 失效
标题翻译：电子板和多层布线板的制造方法
公开(公告)号：US20080119067A1
公开(公告)日：2008-05-22
申请号：US11939644
申请日：2007-11-14
申请人： Tsuyoshi SHINTATE
发明人： Tsuyoshi SHINTATE
IPC分类号： H05K1/00
CPC分类号： H05K1/185 , H01L23/5389 , H01L24/19 , H01L24/76 , H01L24/82 , H01L2224/04105 , H01L2224/76155 , H01L2224/82102 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01033 , H01L2924/01047 , H01L2924/01075 , H01L2924/01078 , H01L2924/12044 , H01L2924/14 , H01L2924/19041 , H05K3/125 , H05K3/4664 , H05K2201/10674 , H05K2203/013 , Y10T29/49117 , Y10T29/49124 , Y10T29/49155 , Y10T29/49158 , H01L2924/00
摘要： A manufacturing method of an electronic board includes: placing an electronic component including conductive parts on a first insulation layer with the conductive parts facing up as well as providing projections having conductivities on the conductive parts; applying an insulation material by means of a droplet discharging method providing a second insulation layer on an upper surface of the electronic component while dodging the projections, the second insulation layer having a height the projections project out from the layer; providing conductive wirings to be connected to the projections on the second layer; and applying the insulation material around the electronic component by means of the droplet discharging method to provide a third insulation layer having a height generally equal to the second insulation layer.
摘要翻译：电子板的制造方法包括：将导电部件的电子部件放置在导电部件朝上的第一绝缘层上，并且在导电部件上设置具有导电性的突起部; 通过液滴喷射方法施加绝缘材料，该方法在躲避突起的同时在电子部件的上表面上提供第二绝缘层，第二绝缘层具有从该层突出的高度; 提供要连接到第二层上的突起的导电布线; 以及通过所述液滴喷射方法将所述绝缘材料施加在所述电子部件周围，以提供具有大致等于所述第二绝缘层的高度的第三绝缘层。

4. 发明申请

US20080172868A1 METHOD FOR MANUFACTURING WIRING BOARD AND METHOD FOR MANUFACTURING MULTILAYER WIRING BOARD 审中-公开
标题翻译：制造接线板的方法及制造多层接线板的方法
公开(公告)号：US20080172868A1
公开(公告)日：2008-07-24
申请号：US11937332
申请日：2007-11-08
申请人： Tsuyoshi SHINTATE
发明人： Tsuyoshi SHINTATE
IPC分类号： H05K3/36 , B23P17/00
CPC分类号： H05K1/185 , H01L21/4867 , H01L23/50 , H01L23/5389 , H01L24/19 , H01L2223/6677 , H01L2224/04105 , H01L2224/20 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/14 , H01L2924/19041 , H05K3/125 , H05K3/4664 , H05K2201/10636 , H05K2201/10674 , H05K2203/013 , Y02P70/611 , Y10T29/49126 , Y10T29/49169 , Y10T29/49798
摘要： A method for manufacturing a wiring board having an electronic component disposed on a substrate and an insulating film formed around the electronic component through application of an insulating material, is disclosed. The method includes: cutting off an electronic component forming substrate on which a plurality of the electronic components are formed, after the electronic component forming substrate has been fixed on a supporting member, to individually separate the plurality of the electronic components; performing lyophilic processing on surface of the plurality of the electronic components while the electronic component forming substrate is fixed on the supporting member; and forming an insulating film around an individually separated electronic component, the electronic component being disposed on the substrate in such a manner that the individually separated electronic component is distanced from the supporting member.
摘要翻译：公开了一种制造具有设置在基板上的电子部件和通过施加绝缘材料形成在电子部件周围的绝缘膜的布线基板的方法。该方法包括：在将电子部件形成基板固定在支撑部件上之后，切断形成有多个电子部件的电子部件形成基板，分别分离多个电子部件; 在电子部件形成基板固定在支撑部件上的同时，对多个电子部件的表面进行亲液处理; 并且在单独分离的电子部件周围形成绝缘膜，所述电子部件以这样的方式设置在所述基板上，使得所述单独分离的电子部件远离所述支撑部件。

5. 发明申请

US20080104832A1 METHOD FOR MANUFACTURING ELECTRONIC SUBSTRATE 有权
标题翻译：制造电子基板的方法
公开(公告)号：US20080104832A1
公开(公告)日：2008-05-08
申请号：US11935908
申请日：2007-11-06
申请人： Tsuyoshi SHINTATE
发明人： Tsuyoshi SHINTATE
IPC分类号： H05K3/30 , H05K1/16 , H05K3/10 , B32B37/00
CPC分类号： B32B37/1292 , B32B2309/02 , B32B2309/04 , B32B2310/0831 , B32B2457/00 , H01L24/24 , H01L24/29 , H01L24/743 , H01L24/82 , H01L24/83 , H01L2224/24011 , H01L2224/24226 , H01L2224/2919 , H01L2224/743 , H01L2224/76155 , H01L2224/82102 , H01L2224/83192 , H01L2224/83855 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01082 , H01L2924/0665 , H01L2924/07802 , H01L2924/12044 , H01L2924/14 , H01L2924/19041 , H01L2924/19043 , H05K1/185 , H05K3/125 , H05K3/305 , H05K3/4664 , H05K2201/10636 , H05K2201/10674 , H05K2203/013 , Y02P70/611 , Y02P70/613 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49144 , Y10T29/49155 , H01L2924/00 , H01L2924/3512
摘要： A method for manufacturing an electronic substrate including an electronic component bonded with adhesive to a base part, comprises (a) applying a droplet containing the adhesive to an area on the base part, the area facing to the electronic component, within a range substantially equal to a size of the electronic component by using a droplet ejection head moving in relatively to the base part, and (b) mounting the electronic component on the adhesive applied to the base part.
摘要翻译：一种用于制造电子基板的方法，所述电子基板包括用粘合剂粘合到基部的电子部件，所述方法包括：（a）将包含所述粘合剂的液滴施加到基本部分的面积上的区域，所述区域基本相等通过使用相对于基部移动的液滴喷射头，将电子部件安装到电子部件的尺寸上，以及（b）将电子部件安装在施加到基部的粘合剂上。

6. 发明申请

US20070046718A1 METHOD FOR FORMING A LAYER, METHOD FOR MANUFACTURING AN ACTIVE MATRIX SUBSTRATE, AND METHOD FOR MANUFACTURING A MULTILAYERED WIRING SUBSTRATE 有权
标题翻译：形成层的方法，制造活性基质基板的方法以及制造多层布线基板的方法
公开(公告)号：US20070046718A1
公开(公告)日：2007-03-01
申请号：US11467295
申请日：2006-08-25
申请人： Tsuyoshi SHINTATE , Koichi MIZUGAKI , Kazuaki SAKURADA , Kenji WADA
发明人： Tsuyoshi SHINTATE , Koichi MIZUGAKI , Kazuaki SAKURADA , Kenji WADA
IPC分类号： B41J2/015
CPC分类号： H05K3/125 , G02F1/133711 , G02F2001/136295 , H01L21/288 , H01L21/76838 , H01L27/1214 , H01L27/1292 , H05K2203/013 , H05K2203/095 , H05K2203/1173 , H05K2203/1476
摘要： A method for forming a layer comprises (a) disposing a first droplet to two parts on an underlayer surface so as to form two dot patterns isolated each other on the underlayer surface, (b) fixing the two dot patterns to the underlayer surface, (c) giving lyophilicity with respect to a second droplet to at least the underlayer surface between the two dot patterns, and (d) disposing the second droplet to the underlayer surface between the two dot patterns so as to join the two dot patterns after the step (c).
摘要翻译：一种形成层的方法包括：（a）将第一液滴设置在下层表面上的两个部分上，以在底层表面上形成彼此隔离的两个点图案，（b）将两个点图案固定到底层表面上（ c）将相对于第二液滴的亲液性提供给至少两个点图案之间的底层表面，和（d）将第二液滴设置在两个点图案之间的底层表面上，以便在步骤之后连接两个点图案（C）。

7. 发明申请

US20110097515A1 PATTERN FORMING SYSTEM, PATTERN FORMING METHOD, AND ELECTRONIC APPARATUS 审中-公开
标题翻译：图案形成系统，图案形成方法和电子装置
公开(公告)号：US20110097515A1
公开(公告)日：2011-04-28
申请号：US12963013
申请日：2010-12-08
申请人： Kazuaki SAKURADA , Noboru UEHARA , Tsuyoshi SHINTATE
发明人： Kazuaki SAKURADA , Noboru UEHARA , Tsuyoshi SHINTATE
IPC分类号： B05D3/06 , B05D3/12
CPC分类号： H05K3/125 , B41J11/0085 , B41J11/44 , B41J15/005 , H05K1/0393 , H05K2203/013 , H05K2203/0165 , H05K2203/082 , H05K2203/1545
摘要： A pattern forming system including a feeding reel for feeding a tape form substrate that is wound up, a winding reel for winding up the tape form substrate that is fed up, and a droplet discharge apparatus for discharging a droplet onto the tape form substrate, between the feeding reel and the winding reel, to form a pattern, wherein the droplet discharge apparatus includes a table that can move while sucking the tape form substrate, with a slack mechanism for the tape form substrate being placed on the both ends of the table in the longitudinal direction of the tape form substrate.
摘要翻译：一种图案形成系统，包括用于馈送被卷绕的带状基底的馈送卷轴，用于卷绕被馈送的带状基底的卷绕卷轴和用于将液滴排放到带状基底上的液滴喷射装置，馈送卷轴和卷绕卷轴，以形成图案，其中液滴喷射装置包括在吸着带状基材时可以移动的台，用于将带状基材的松弛机构放置在台的两端带状基材的纵向方向。

8. 发明申请

US20090077798A1 METHOD FOR FORMING CONDUCTIVE POST, METHOD FOR MANUFACTURING MULTILAYERED WIRING SUBSTRATE, AND METHOD FOR MANUFACTURING ELECTRONIC APPARATUS 失效
标题翻译：形成导电柱的方法，制造多层布线基板的方法以及制造电子装置的方法
公开(公告)号：US20090077798A1
公开(公告)日：2009-03-26
申请号：US12206800
申请日：2008-09-09
申请人： Toshimitsu HIRAI , Tsuyoshi SHINTATE , Jun YAMADA
发明人： Toshimitsu HIRAI , Tsuyoshi SHINTATE , Jun YAMADA
IPC分类号： H05K3/00 , H01R43/16
CPC分类号： H05K3/4069 , H05K1/092 , H05K3/125 , H05K3/4664 , H05K3/4679 , H05K2201/09909 , H05K2203/013 , H05K2203/1131 , H05K2203/1173 , Y10T29/49149 , Y10T29/49155 , Y10T29/49206
摘要： A method for forming a conductive post include: a) forming a liquid repellent portion having a thickness of 100 nm or less by disposing a liquid repellent material in a conductive post forming region on a conductive layer; b) forming an insulation layer having an opening in a region overlapping with the conductive post forming region by disposing a liquid including an insulation layer forming material on the conductive layer having the liquid repellent portion formed thereon and polymerizing the insulation layer forming material; c) disposing metal particulates in the opening; and d) heating the metal particulates at a fusing temperature of the metal particulates or higher so as to fusion bond the metal particulates to each other in order to form the conductive post, and to fusion bond the metal particulates and the conductive layer in order to couple the conductive post with the conductive layer.
摘要翻译：形成导电柱的方法包括：a）通过在导电层上的导电柱形成区域中设置疏液材料，形成厚度为100nm以下的疏液部分; b）通过在其上形成有疏液部分的导电层上设置包括绝缘层形成材料的液体来形成在与导电柱形成区域重叠的区域中具有开口的绝缘层，并使绝缘层形成材料聚合; c）在开口处设置金属微粒; 以及d）在所述金属微粒的熔融温度以上加热所述金属微粒以将所述金属微粒彼此熔合以形成所述导电柱，并将所述金属微粒和所述导电层熔合，以便将导电柱与导电层耦合。

9. 发明申请

US20070057992A1 METHOD FOR FORMING LAYER 失效
标题翻译：形成层的方法
公开(公告)号：US20070057992A1
公开(公告)日：2007-03-15
申请号：US11530583
申请日：2006-09-11
申请人： Tsuyoshi SHINTATE , Koichi MIZUGAKI , Jun YAMADA
发明人： Tsuyoshi SHINTATE , Koichi MIZUGAKI , Jun YAMADA
IPC分类号： B41J23/00
CPC分类号： B41J2/14233
摘要： In a method for forming a layer using a droplet discharging device that discharges droplets from a plurality of nozzles while relatively moving a surface in a first direction with respect to a head including the plurality of nozzles, the method for forming a layer comprises: a) respectively arranging a first droplet on each of two reference regions on the surface and providing two separate patterns corresponding to the two reference regions; b) fixing the two patterns; c) making the surface lyophilic after fixing the two patterns; and d) arranging a second droplet between the two reference regions and connecting the two patterns after making the surface lyophilic.
摘要翻译：在使用液滴排出装置形成层的方法中，用于相对于包括多个喷嘴的头沿第一方向相对移动表面而从多个喷嘴排出液滴的方法，所述形成层的方法包括：a）分别在表面上的两个参考区域中的每一个上布置第一液滴并提供对应于两个参考区域的两个分离的图案; b）固定两种图案; c）在固定两种图案之后使表面亲液; 以及d）在两个参考区域之间布置第二液滴并在使表面亲液化之后连接两个图案。

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