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1. 发明申请

US20090162536A1 METHOD FOR FORMING FILM PATTERN, METHOD FOR FORMING CONTACT HOLE, METHOD FOR FORMING BUMP, AND METHOD FOR MANUFACTURING LIGHT EMITTING DEVICE 审中-公开
标题翻译：形成薄膜图案的方法，形成接触孔的方法，成型方法，以及制造发光装置的方法
公开(公告)号：US20090162536A1
公开(公告)日：2009-06-25
申请号：US12338194
申请日：2008-12-18
申请人： Toshimitsu HIRAI , Jun YAMADA , Tsuyoshi SHINTATE
发明人： Toshimitsu HIRAI , Jun YAMADA , Tsuyoshi SHINTATE
IPC分类号： B05D5/12
CPC分类号： H01J9/025 , H01J63/02 , H01J63/06 , H01L24/11 , H01L2224/05001 , H01L2224/05026 , H01L2224/05548 , H01L2224/11005 , H01L2224/1131 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/01072 , H01L2924/01074 , H01L2924/15788 , H01L2224/13099 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599 , H01L2924/00
摘要： A method for forming a film pattern disposed adjacent to a pattern non-forming region by coating a pattern forming region with a functional liquid, includes (a) forming a liquid repellent film by coating the pattern non-forming region with a droplet containing a liquid repellent material having repellency to the functional liquid, and (b) forming the film pattern by coating the pattern forming region adjacent to the liquid repellent film with the functional liquid. The step (a) of forming of the liquid repellent film and the step (b) of forming of the film pattern are alternately repeated at least two times, respectively.
摘要翻译：通过用功能性液体涂布图案形成区域来形成与图案非成形区域相邻设置的膜图案的方法包括：（a）通过用包含液体的液滴涂布图案非形成区域来形成疏液膜对功能性液体具有排斥性的驱避剂材料，（b）通过用功能性液体涂布与防液膜相邻的图案形成区域来形成膜图案。形成防液膜的步骤（a）和形成膜图案的步骤（b）分别交替重复至少两次。

2. 发明申请

US20090071706A1 METHOD FOR PRODUCING MULTILAYERED WIRING SUBSTRATE, MULTILAYERED WIRING SUBSTRATE, AND ELECTRONIC APPARATUS 审中-公开
标题翻译：生产多层配线基板，多层布线基板和电子设备的方法
公开(公告)号：US20090071706A1
公开(公告)日：2009-03-19
申请号：US12191358
申请日：2008-08-14
申请人： Tsuyoshi SHINTATE , Toshimitsu HIRAI , Jun YAMADA
发明人： Tsuyoshi SHINTATE , Toshimitsu HIRAI , Jun YAMADA
IPC分类号： H05K1/11 , B32B37/14
CPC分类号： H05K3/4664 , H05K1/185 , H05K3/125 , H05K2201/015 , H05K2203/013 , H05K2203/0759 , H05K2203/1173
摘要： A method for producing a multilayered wiring substrate includes forming a lyophobic area on a first conductive layer, forming an insulating layer with an opening portion on the first conductive layer by applying a functional liquid containing an insulating layer forming material on a periphery of the lyophobic area, laminating the first conductive layer and a second conductive layer via the insulating layer, and electrically connecting the first and the second conductive layers to each other via the opening portion formed in the insulating layer. In the method, when forming the insulating layer, the functional liquid is applied such that an angle of a portion of the functional liquid in contact with the lyophobic area becomes larger than a forward contact angle of the functional liquid, thereby allowing a position of the portion of the functional liquid in contact with the lyophobic area to move inside the lyophobic area to form the opening portion having an opening size smaller than a size of the lyophobic area.
摘要翻译：一种多层布线基板的制造方法，其特征在于，在第一导电层上形成疏液区域，在所述疏液性区域的周围涂布含有绝缘层形成材料的功能性液体，在所述第一导电层上形成具有开口部的绝缘层经由所述绝缘层层压所述第一导电层和第二导电层，并且经由形成在所述绝缘层中的所述开口部将所述第一导电层与所述第二导电层电连接。在该方法中，当形成绝缘层时，施加功能液体，使得与疏液区域接触的功能液体的一部分的角度大于功能液体的向前接触角，从而允许功能液体与疏液区域接触的部分在疏液区域内移动以形成具有小于疏液区域的开口尺寸的开口部分。

3. 发明申请

US20090035453A1 Pattern forming system, pattern forming method, and electronic apparatus 有权
标题翻译：图案形成系统，图案形成方法和电子设备
公开(公告)号：US20090035453A1
公开(公告)日：2009-02-05
申请号：US12232715
申请日：2008-09-23
申请人： Kazuaki Sakurada , Noboru Uehara , Tsuyoshi Shintate
发明人： Kazuaki Sakurada , Noboru Uehara , Tsuyoshi Shintate
IPC分类号： H05K1/00 , C23C26/00
CPC分类号： H05K3/125 , B41J11/0085 , B41J11/44 , B41J15/005 , H05K1/0393 , H05K2203/013 , H05K2203/0165 , H05K2203/082 , H05K2203/1545
摘要： A pattern forming system including a feeding reel for feeding a tape form substrate that is wound up, a winding reel for winding up the tape form substrate that is fed up, and a droplet discharge apparatus for discharging a droplet onto the tape form substrate, between the feeding reel and the winding reel, to form a pattern, wherein the droplet discharge apparatus includes a table that can move while sucking the tape form substrate, with a slack mechanism for the tape form substrate being placed on the both ends of the table in the longitudinal direction of the tape form substrate.
摘要翻译：一种图案形成系统，包括用于馈送被卷绕的带状基底的馈送卷轴，用于卷绕被馈送的带状基底的卷绕卷轴和用于将液滴排放到带状基底上的液滴喷射装置，馈送卷轴和卷绕卷轴，以形成图案，其中液滴喷射装置包括能够在吸入带状基材时移动的工作台，其中带状基材的松弛机构放置在工作台的两端带状基材的纵向方向。

4. 发明申请

US20080119067A1 MANUFACTURING METHOD OF ELECTRONIC BOARD AND MULTILAYER WIRING BOARD 失效
标题翻译：电子板和多层布线板的制造方法
公开(公告)号：US20080119067A1
公开(公告)日：2008-05-22
申请号：US11939644
申请日：2007-11-14
申请人： Tsuyoshi SHINTATE
发明人： Tsuyoshi SHINTATE
IPC分类号： H05K1/00
CPC分类号： H05K1/185 , H01L23/5389 , H01L24/19 , H01L24/76 , H01L24/82 , H01L2224/04105 , H01L2224/76155 , H01L2224/82102 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01033 , H01L2924/01047 , H01L2924/01075 , H01L2924/01078 , H01L2924/12044 , H01L2924/14 , H01L2924/19041 , H05K3/125 , H05K3/4664 , H05K2201/10674 , H05K2203/013 , Y10T29/49117 , Y10T29/49124 , Y10T29/49155 , Y10T29/49158 , H01L2924/00
摘要： A manufacturing method of an electronic board includes: placing an electronic component including conductive parts on a first insulation layer with the conductive parts facing up as well as providing projections having conductivities on the conductive parts; applying an insulation material by means of a droplet discharging method providing a second insulation layer on an upper surface of the electronic component while dodging the projections, the second insulation layer having a height the projections project out from the layer; providing conductive wirings to be connected to the projections on the second layer; and applying the insulation material around the electronic component by means of the droplet discharging method to provide a third insulation layer having a height generally equal to the second insulation layer.
摘要翻译：电子板的制造方法包括：将导电部件的电子部件放置在导电部件朝上的第一绝缘层上，并且在导电部件上设置具有导电性的突起部; 通过液滴喷射方法施加绝缘材料，该方法在躲避突起的同时在电子部件的上表面上提供第二绝缘层，第二绝缘层具有从该层突出的高度; 提供要连接到第二层上的突起的导电布线; 以及通过所述液滴喷射方法将所述绝缘材料施加在所述电子部件周围，以提供具有大致等于所述第二绝缘层的高度的第三绝缘层。

5. 发明申请

US20060292769A1 MULTILAYERED STRUCTURE FORMING METHOD 审中-公开
标题翻译：多层结构形成方法
公开(公告)号：US20060292769A1
公开(公告)日：2006-12-28
申请号：US11425762
申请日：2006-06-22
申请人： Kenji Wada , Tsuyoshi Shintate
发明人： Kenji Wada , Tsuyoshi Shintate
IPC分类号： H01L21/338
CPC分类号： H05K3/4664 , B41M3/006 , B41M3/008 , H05K3/125 , H05K3/4647 , H05K2201/09781 , H05K2201/09881 , H05K2203/013 , H05K2203/1476
摘要： A multilayered structure forming method includes disposing a dummy post on a first insulating pattern as a first inkjet process, disposing a second insulating pattern on the first insulating pattern as a second inkjet process so as to allow the second insulating pattern to surround a side surface of the dummy post, and disposing a first conductive pattern on the second insulating pattern a third inkjet process so as to connect the first conductive pattern to the dummy post. In this method, the first inkjet process includes a process for ejecting a functional liquid containing a first conductive material having high adhesiveness to the first conductive pattern onto the first insulating pattern.
摘要翻译：多层结构形成方法包括将第一绝缘图案上的虚拟柱设置为第一喷墨处理，将第二绝缘图案设置在第一绝缘图案上作为第二喷墨处理，以使第二绝缘图案包围第二绝缘图案的侧表面所述虚拟柱，并且在所述第二绝缘图案上设置第一导电图案以进行第三喷墨处理，以将所述第一导电图案连接到所述虚拟柱。在该方法中，第一喷墨处理包括将含有第一导电图案的具有高粘附性的第一导电材料的功能液喷射到第一绝缘图案上的处理。

6. 发明授权

US07416759B2 Wiring pattern formation method, wiring pattern, and electronic device 失效
标题翻译：布线图案形成方法，布线图案和电子装置
公开(公告)号：US07416759B2
公开(公告)日：2008-08-26
申请号：US11223921
申请日：2005-09-13
申请人： Tsuyoshi Shintate , Kazuaki Sakurada , Noboru Uehara
发明人： Tsuyoshi Shintate , Kazuaki Sakurada , Noboru Uehara
IPC分类号： H05K3/00
CPC分类号： H05K3/125 , H01L2224/16145 , H01L2224/16225 , H01L2924/00013 , H01L2924/15311 , H01L2924/181 , H05K1/0393 , H05K3/4069 , H05K3/4647 , H05K2203/013 , Y10T29/49155 , H01L2224/29099 , H01L2924/00012
摘要： In a method of forming a wiring pattern, a plurality of electrical wirings deposited to be multilayered are conductively connected to one another through a conducting post. The method has forming the electrical wiring by discharging a first droplet including a material for forming the electrical wiring, and forming the conducting post by discharging a second droplet including a material for forming the conducting post, wherein a volume of the second droplet is greater than a volume of the first droplet.
摘要翻译：在形成布线图案的方法中，通过导电柱将沉积多层的多个电布线彼此导电连接。该方法通过排出包括用于形成电布线的材料的第一液滴形成电气布线，并且通过排出包括用于形成导电柱的材料的第二液滴形成导电柱，其中第二液滴的体积大于第一液滴的体积。

7. 发明授权

US07316974B2 Wiring pattern formation method, manufacturing method for multi layer wiring substrate, and electronic device 有权
标题翻译：布线图案形成方法，多层布线基板的制造方法以及电子装置
公开(公告)号：US07316974B2
公开(公告)日：2008-01-08
申请号：US11235634
申请日：2005-09-26
申请人： Noboru Uehara , Tsuyoshi Shintate , Kazuaki Sakurada
发明人： Noboru Uehara , Tsuyoshi Shintate , Kazuaki Sakurada
IPC分类号： H01L21/44
CPC分类号： H01L21/288 , C23C26/00 , G02F1/13452 , H01L21/4867 , H01L21/76801 , H01L21/76825 , H01L21/76879 , H01L27/3297 , H05K3/125 , H05K3/1258 , H05K3/4664 , H05K2201/09909 , H05K2203/013 , H05K2203/0568
摘要： A wiring pattern formation method in which a wiring pattern is formed by arranging, in a region which is demarcated by a partition wall, liquid material which includes an electrically conductive material, including: arranging a resin material around the periphery of a region upon which the wiring pattern is to be formed; imparting liquid affinity to a demarcated region which has been demarcated by the resin material; narrowing down the demarcated region by flowing out the resin material towards and into the demarcated region; and forming the partition wall by curing the resin material.
摘要翻译：一种布线图形形成方法，其中通过在由隔壁划分的区域中布置包括导电材料的液体材料形成布线图案，该布线图案形成方法包括：将树脂材料布置在其周围的周边周围，要形成布线图; 赋予已被树脂材料划定的划定区域的液体亲和性; 通过将树脂材料流入划分的区域来缩小划定的区域; 并通过固化树脂材料形成分隔壁。

8. 发明授权

US07250377B2 Multi-layered structure forming method, method of manufacturing wiring substrate, and method of manufacturing electronic apparatus 有权
标题翻译：多层结构形成方法，布线基板的制造方法以及电子设备的制造方法
公开(公告)号：US07250377B2
公开(公告)日：2007-07-31
申请号：US11201100
申请日：2005-08-11
申请人： Tsuyoshi Shintate , Toshiaki Mikoshiba , Kenji Wada , Kazuaki Sakurada , Jun Yamada
发明人： Tsuyoshi Shintate , Toshiaki Mikoshiba , Kenji Wada , Kazuaki Sakurada , Jun Yamada
IPC分类号： H01L21/31
CPC分类号： H05K3/4664 , H05K3/125 , H05K2203/013 , Y10S257/921
摘要： There is provided a multi-layered structure forming method comprising: (A) forming a first insulating material layer containing a first photo-curing material on a substrate; (B) semi-hardening the first insulating material layer by radiating light having a first wavelength to the first insulating material layer; (C) forming a conductive material layer on the semi-hardened first insulating material layer by ejecting droplets of a conductive material to the semi-hardened first insulating material layer from a nozzle of a liquid droplet ejecting apparatus; (D) forming a second insulating material layer containing a second photo-curing material so as to cover the semi-hardened first insulating material layer and the conductive material layer; and (E) forming a first insulating layer, a conductive layer positioned on the first insulating material, and a second insulating layer covering the first insulating layer and the conductive layer by simultaneously heating the first insulating material layer, the conductive material layer, and the second insulating material layer.
摘要翻译：提供一种多层结构形成方法，包括：（A）在基板上形成含有第一光固化材料的第一绝缘材料层; （B）通过向第一绝缘材料层照射具有第一波长的光而使第一绝缘材料层半硬化; （C）通过从液滴喷射装置的喷嘴向半硬化的第一绝缘材料层喷射导电材料的液滴，在半硬化的第一绝缘材料层上形成导电材料层; （D）形成包含第二光固化材料的第二绝缘材料层以覆盖半硬化的第一绝缘材料层和导电材料层; 和（E）形成第一绝缘层，位于第一绝缘材料上的导电层和通过同时加热第一绝缘材料层，导电材料层和覆盖第一绝缘层和导电层的第二绝缘层第二绝缘材料层。

9. 发明申请

US20060087545A1 Pattern forming system, pattern forming method, and electronic apparatus 有权
公开(公告)号：US20060087545A1
公开(公告)日：2006-04-27
申请号：US11218545
申请日：2005-09-06
申请人： Kazuaki Sakurada , Noboru Uehara , Tsuyoshi Shintate
发明人： Kazuaki Sakurada , Noboru Uehara , Tsuyoshi Shintate
IPC分类号： B41J2/01
CPC分类号： H05K3/125 , B41J11/0085 , B41J11/44 , B41J15/005 , H05K1/0393 , H05K2203/013 , H05K2203/0165 , H05K2203/082 , H05K2203/1545
摘要： A pattern forming system including a feeding reel for feeding a tape form substrate that is wound up, a winding reel for winding up the tape form substrate that is fed up, and a droplet discharge apparatus for discharging a droplet onto the tape form substrate, between the feeding reel and the winding reel, to form a pattern, wherein the droplet discharge apparatus includes a table that can move while sucking the tape form substrate, with a slack mechanism for the tape form substrate being placed on the both ends of the table in the longitudinal direction of the tape form substrate.

10. 发明申请

US20060068573A1 Multilayer structure forming method, method of manufacturing wiring board, and method manufacturing of electronic apparatus 有权
标题翻译：多层结构形成方法，制造布线板的方法和电子设备的方法制造
公开(公告)号：US20060068573A1
公开(公告)日：2006-03-30
申请号：US11222851
申请日：2005-09-12
申请人： Tsuyoshi Shintate , Kazuaki Sakurada , Jun Yamada
发明人： Tsuyoshi Shintate , Kazuaki Sakurada , Jun Yamada
IPC分类号： H01L21/20
CPC分类号： H05K3/4664 , H01L51/0004 , H05K3/125 , H05K2201/09581 , H05K2201/09909 , H05K2203/013 , H05K2203/1173 , H05K2203/1476
摘要： A droplet discharge apparatus is used in a multilayer structure forming method of the invention. The multilayer structure forming method includes: discharging droplets of a first conductive material to form a first conductive material pattern on a surface of an object; baking the first conductive material pattern to form a wiring pattern; discharging droplets of a first insulating material including a first photo-curable material to form a first insulating material pattern bordering via holes on the wiring pattern; curing the first insulating material pattern to form a first insulating pattern bordering the via holes; making the surface of the object lyophilic; discharging droplets of a second insulating material including a second photo-curable material to form a second insulating material pattern that covers the wiring pattern and the surface of the object which has been made lyophilic, and surrounds the first insulating pattern; and curing the second insulating material pattern to form a second insulating pattern that surrounds the first insulating pattern. In addition, preferably, the first conductive material includes silver (Ag) nanoparticles.
摘要翻译：液滴喷射装置用于本发明的多层结构形成方法中。多层结构形成方法包括：排出第一导电材料的液滴以在物体的表面上形成第一导电材料图案; 烘烤第一导电材料图案以形成布线图案; 排出包括第一可光固化材料的第一绝缘材料的液滴，以形成与布线图案上的通孔邻接的第一绝缘材料图案; 固化第一绝缘材料图案以形成与通孔相邻的第一绝缘图案; 使物体的表面亲液; 排出包含第二可光固化材料的第二绝缘材料的液滴，以形成覆盖所述布线图形和所述物体表面的第二绝缘材料图案，所述第二绝缘材料图案已经被制成亲液性，并围绕所述第一绝缘图案; 以及固化所述第二绝缘材料图案以形成围绕所述第一绝缘图案的第二绝缘图案。此外，优选地，第一导电材料包括银（Ag）纳米颗粒。

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