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1. 发明申请

US20090120587A1 SHEET STICKING TABLE 审中-公开
标题翻译：表贴纸
公开(公告)号：US20090120587A1
公开(公告)日：2009-05-14
申请号：US11994950
申请日：2006-06-26
申请人： Tsuyoshi Kurita , Koichi Yamaguchi , Kenji Kobayashi
发明人： Tsuyoshi Kurita , Koichi Yamaguchi , Kenji Kobayashi
IPC分类号： B32B38/04 , B29C65/56
CPC分类号： H01L21/67132 , Y10T156/1348
摘要： A sheet sticking table 13 used for sticking an adhesive sheet S onto the upper surface of a semiconductor wafer W is provided. The sheet sticking table 13 comprises an outer table 51 and an inner table 52. The outer table 51 and inner table 52 are provided movably in the vertical direction via uniaxial robots 54, 56 respectively, and the inner table 52 is provided movably together with the outer table 51 in the vertical direction when the outer table 51 is moved in the vertical direction.
摘要翻译：提供了用于将粘合片S粘贴到半导体晶片W的上表面上的片材粘贴台13。片材台13包括外台51和内台52.外台51和内台52分别通过单轴机器人54,56在垂直方向上可移动地设置，内台52与可移动地一起设置外台面51在垂直方向上移动时，外台面51沿垂直方向移动。

2. 发明授权

US6149758A Sheet removing apparatus and method 失效
标题翻译：纸张去除装置和方法
公开(公告)号：US6149758A
公开(公告)日：2000-11-21
申请号：US90762
申请日：1998-06-04
申请人： Masaki Tsujimoto , Hiroshi Saito , Koji Okamoto , Kenji Kobayashi , Tsuyoshi Kurita
发明人： Masaki Tsujimoto , Hiroshi Saito , Koji Okamoto , Kenji Kobayashi , Tsuyoshi Kurita
IPC分类号： H01L21/00 , B32B35/00
CPC分类号： H01L21/67132 , Y10S156/942 , Y10T156/11 , Y10T156/1179 , Y10T156/1978
摘要： In an apparatus and method of using an adhesive tape to remove a protecting sheet applied to a semiconductor wafer, a heat-sensitive adhesive tape is thermocompressively bonded by a heat tool to an edge portion of the protecting sheet, after which a cutting blade cuts the adhesive sheet to a prescribed length, and then a tape peeling head grasps the cut adhesive tape and moves in a direction to pull the adhesive tape so as to remove the protecting sheet of the semiconductor wafer, with the removed sheet then being disposed of together with the adhesive tape into a disposal box.
摘要翻译：在使用粘合带除去施加到半导体晶片的保护片的装置和方法中，将热敏粘合带通过热工具热压粘合到保护片的边缘部分，之后切割刀切割粘合片到规定长度，然后带剥离头抓住切割的胶带并沿着拉动粘合带的方向移动，以移除半导体晶片的保护片，然后将去除的片与胶带进入处理箱。

3. 发明授权

US07858954B2 Apparatus and method for irradiating energy beam 失效
标题翻译：用于照射能量束的装置和方法
公开(公告)号：US07858954B2
公开(公告)日：2010-12-28
申请号：US11914713
申请日：2006-05-10
申请人： Tsuyoshi Kurita
发明人： Tsuyoshi Kurita
IPC分类号： A61N5/00
CPC分类号： H01L21/67115 , C09J5/00 , C09J2205/302 , C09J2205/31 , H01L21/6838
摘要： An energy beam irradiating apparatus and/or method which, when peeling off an adhesive sheet having an energy radiation curable adhesive and stuck to a wafer, has an ultraviolet ray irradiated to the adhesive sheet, and on an occasion of reducing its adhesive strength. The wafer with the adhesive sheet is suction-held with a supporting member, and the ultraviolet ray is irradiated from an UV lamp in this state. On this occasion, a nitrogen gas N is ejected from a gas discharge area adjacent to a wafer suction-holding area of the supporting member.
摘要翻译：一种能量束照射装置和/或方法，当剥离具有能量辐射固化型粘合剂并粘附在晶片上的粘合片时，具有照射到粘合片的紫外线，并且在降低其粘合强度的情况下。具有粘合片的晶片用支撑构件抽吸保持，并且在该状态下从紫外线灯照射紫外线。在这种情况下，氮气N从与支撑构件的晶片吸引保持区域相邻的气体放电区域喷出。

4. 发明授权

US06258198B1 Method and apparatus for applying a protecting film to a semiconductor wafer 失效
标题翻译：将保护膜施加到半导体晶片的方法和装置
公开(公告)号：US06258198B1
公开(公告)日：2001-07-10
申请号：US09481998
申请日：2000-01-11
申请人： Hiroshi Saito , Tsuyoshi Kurita , Koji Okamoto
发明人： Hiroshi Saito , Tsuyoshi Kurita , Koji Okamoto
IPC分类号： B32B3100
CPC分类号： H01L21/67132 , H01L21/67092 , Y10T156/1057 , Y10T156/108 , Y10T156/1343 , Y10T156/1734
摘要： In an apparatus and method of applying a protecting film to a semiconductor wafer, a semiconductor wafer is placed on top of a table, a protecting film is pressed onto the wafer by a press roller biased toward the table, the table is moved to apply the protecting film to the wafer, a tension roller arranged upstream from the press roller applies a tensile force to the protecting film in a direction opposite the feeding direction of the film, the tensile force of the tension roller is first set at a relatively high value at the beginning of the application of the protecting film to place the protecting film in a stretched state and then at a relatively small value during the application of the protecting film to prevent the portion of the protecting film which has not yet been applied from coming into contact with the wafer, and then, after the protecting film has been applied to the wafer, a cutting blade is used to cut the protecting film to match the shape of the semiconductor wafer by first moving the cutting blade in the Y direction to cut from an angular portion C1 of the orientation flat portion to an angular portion C2, then rotating the table while moving the cutter and the table to align the cutting direction of the cutting blade with the tangential direction of the circumferential portion of the semiconductor wafer, and then rotating the table to cut the protecting film along the circumferential portion of the semiconductor wafer.
摘要翻译：在将保护膜施加到半导体晶片的装置和方法中，将半导体晶片放置在工作台的顶部，通过偏压于工作台的压辊将保护膜压在晶片上，使工作台移动将保护膜保护到晶片上，布置在压辊上游的张力辊在与膜的进给方向相反的方向上对保护膜施加张力，拉伸辊的张力首先设定在相对较高的值开始使用保护膜以将保护膜置于拉伸状态，然后在施加保护膜期间以相对较小的值，以防止尚未施加的保护膜的部分接触然后在将保护膜施加到晶片之后，使用切割刀来切割保护膜以匹配半导体晶片的形状通过首先沿Y方向移动切割刀片以从定向平坦部分的角度部分C1切割成角度部分C2，然后在移动切割器和台面的同时旋转工作台以使切割刀片的切割方向与半导体晶片的周向部分的切线方向，然后旋转工作台以沿着半导体晶片的圆周部分切割保护膜。

5. 发明申请

US20090026676A1 Non-Contact Type Suction Holding Apparatus 审中-公开
标题翻译：非接触式抽吸保持装置
公开(公告)号：US20090026676A1
公开(公告)日：2009-01-29
申请号：US11577146
申请日：2005-06-29
申请人： Tsuyoshi Kurita , Kan Nakada
发明人： Tsuyoshi Kurita , Kan Nakada
IPC分类号： H01L21/68 , B25B11/00
CPC分类号： H01L21/67132 , H01L21/6838
摘要： [Problem] A non-contact type suction holding apparatus capable of reliably holding a plate-shaped member without damaging its surface by suction-holding the plate-shaped member with a portion except for its peripheral portion (main portion) in a non-contact state in which it is floated off the suction table is provided. [Means for Solving Problems] In a non-contact type suction holding apparatus 1 according to the present invention, Bernoulli suction means 10 generating negative pressure by blowout of air (gas) is disposed in a suction table 2, the wafer W is held by the Bernoulli suction means 10 in a state in which a portion except for a peripheral portion of the wafer (plate-shaped member) W of which under-surface peripheral edge portion is supported on the suction table 2 is floated off the suction table 2, and the wafer is suction-held without contact with the suction table 2. Besides, pressing means for pressing upward a under-surface center portion of the wafer W which is suction-held by the suction table 2 to hold the wafer W substantially flat is provided.
摘要翻译： [问题]一种非接触式吸入保持装置，其能够通过以非接触的外围部分（主要部分）以外的部分吸住来保持板状部件而不损坏其表面而可靠地保持板状部件提供了其从吸盘浮起的状态。解决问题的手段在根据本发明的非接触式吸入保持装置1中，通过空气吹出产生负压的伯努利吸入装置10（气体）被设置在吸盘2中，将晶片W保持在在其中将表面下周缘部分支撑在吸盘2上的晶片（板状构件）W的周边部分以外的部分的部分漂浮在吸盘2的状态下的伯努利吸入装置10，并且晶片W被吸附保持而不与吸盘2接触。此外，用于向上按压由吸盘2吸住的晶片W的下表面中心部分以将晶片W保持基本平坦的按压装置是提供。

6. 发明授权

US6080263A Method and apparatus for applying a protecting film to a semiconductor wafer 失效
标题翻译：将保护膜施加到半导体晶片的方法和装置
公开(公告)号：US6080263A
公开(公告)日：2000-06-27
申请号：US73156
申请日：1998-05-05
申请人： Hiroshi Saito , Tsuyoshi Kurita , Koji Okamoto
发明人： Hiroshi Saito , Tsuyoshi Kurita , Koji Okamoto
IPC分类号： B65H35/07 , H01L21/00 , H01L21/304 , H01L21/78 , B32B31/00
CPC分类号： H01L21/67132 , H01L21/67092 , Y10T156/1057 , Y10T156/108 , Y10T156/1343 , Y10T156/1734
摘要： In an apparatus and method of applying a protecting film to a semiconductor wafer, a semiconductor wafer is placed on top of a table, a protecting film is pressed onto the wafer by a press roller biased toward the table, the table is moved to apply the protecting film to the wafer, a tension roller arranged upstream from the press roller applies a tensile force to the protecting film in a direction opposite the feeding direction of the film, the tensile force of the tension roller is first set at a relatively high value at the beginning of the application of the protecting film to place the protecting film in a stretched state and then at a relatively small value during the application of the protecting film to prevent the portion of the protecting film which has not yet been applied from coming into contact with the wafer, and then, after the protecting film has been applied to the wafer, a cutting blade is used to cut the protecting film to match the shape of the semiconductor wafer by first moving the cutting blade in the Y direction to cut from an angular portion C.sub.1 of the orientation flat portion to an angular portion C.sub.2, then rotating the table while moving the cutter and the table to align the cutting direction of the cutting blade with the tangential direction of the circumferential portion of the semiconductor wafer, and then rotating the table to cut the protecting film along the circumferential portion of the semiconductor wafer.
摘要翻译：在将保护膜施加到半导体晶片的装置和方法中，将半导体晶片放置在工作台的顶部，通过偏压于工作台的压辊将保护膜压在晶片上，使工作台移动将保护膜保护到晶片上，布置在压辊上游的张力辊在与膜的进给方向相反的方向上对保护膜施加张力，拉伸辊的张力首先设定在相对较高的值开始使用保护膜以将保护膜置于拉伸状态，然后在施加保护膜期间以相对较小的值，以防止尚未施加的保护膜的部分接触然后在将保护膜施加到晶片之后，使用切割刀来切割保护膜以匹配半导体晶片的形状通过首先沿Y方向移动切割刀片以从定向平坦部分的角度部分C1切割成角度部分C2，然后在移动切割器和工作台的同时旋转工作台以使切割刀片的切割方向与半导体晶片的周向部分的切线方向，然后旋转工作台以沿着半导体晶片的圆周部分切割保护膜。

7. 发明申请

US20090302238A1 Apparatus and Method for Irradiating Energy Beam 失效
标题翻译：辐射能量束的装置和方法
公开(公告)号：US20090302238A1
公开(公告)日：2009-12-10
申请号：US11914713
申请日：2006-05-10
申请人： Tsuyoshi Kurita
发明人： Tsuyoshi Kurita
IPC分类号： B01J19/12 , B32B43/00
CPC分类号： H01L21/67115 , C09J5/00 , C09J2205/302 , C09J2205/31 , H01L21/6838
摘要： [Problem] To provide an energy beam irradiating apparatus and energy beam irradiating method that are preferable to enhance the processing performance of the equipment, reduce a gas consumption amount and reduce an equipment installation space are provided.[Means for solving] On peeling a protection sheet T which is stuck to the wafer W and has an ultraviolet radiation curable adhesive A, an ultraviolet ray is irradiated to the adhesive A of the protection sheet T, and on an occasion of reducing its adhesive strength, the wafer W with the protection sheet T is suction-held with a supporting member 3, and the ultraviolet ray is irradiated from an UV lamp 2 in this state. On this occasion, a nitrogen gas N is ejected from a gas discharge area GA adjacent to a wafer suction-holding area SA of the supporting member 3.
摘要翻译：本发明提供优选提高设备的处理性能的能量束照射装置和能量束照射方法，能够减少气体消耗量，减少设备安装空间。 [解决方法]在剥离粘贴在晶片W上并具有紫外线固化性粘合剂A的保护片T时，对保护片T的粘合剂A照射紫外线，并且在降低其粘合剂的情况下在保护片T的保护片T与支撑部件3进行吸引保持的同时，在该状态下从紫外线灯2照射紫外线。此时，氮气N从与支撑部件3的晶片吸引保持区域SA相邻的气体排出区域GA排出。

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