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1. 发明授权

US6084144A Method of recovering boron trifluoride complex and process for producing olefin oligomer using the same 失效
标题翻译：回收三氟化硼配合物的方法及使用其制备烯烃低聚物的方法
公开(公告)号：US6084144A
公开(公告)日：2000-07-04
申请号：US171343
申请日：1998-10-15
申请人： Tsutomu Takashima , Yoshisuke Kakuyama , Shigeru Nishikida , Yuichi Tokumoto , Kouji Fujimura
发明人： Tsutomu Takashima , Yoshisuke Kakuyama , Shigeru Nishikida , Yuichi Tokumoto , Kouji Fujimura
IPC分类号： B01J27/32 , B01J37/34 , B01J38/68 , C07C2/20 , C08F4/14 , C08F6/02 , C08F10/00 , C08F10/10 , C08F110/10 , C07C2/08 , C07C2/22
CPC分类号： C08F10/00 , B01J27/32 , B01J37/348 , B01J38/68 , C07C2/20 , C08F10/10 , C08F4/14 , C08F6/02 , C07C2527/1213 , C08F110/10 , Y02P20/584
摘要： A boron trifluoride complex can be recovered without changing its molar coordination ratio, by applying a direct and/or alternating voltage to an electrically-nonconductive fluid in which at least a part of boron trifluoride complex is dispersed and/or dissolved, and separating the boron trifluoride complex by settling from the electrically-nonconductive fluid. By utilizing this method for the preparation of olefin oligomer using a boron trifluoride complex catalyst, it is possible to reuse the recovered catalyst as it stands for the reaction.
摘要翻译： PCT No.PCT / JP98 / 00783 Sec。 371日期：1998年10月15日 102（e）1998年10月15日日期PCT提交1998年2月26日PCT公布。第WO98 / 38225号公报日期1998年3月9日可以通过向其中至少一部分三氟化硼配合物分散和/或溶解的非导电流体施加直接和/或交流电压而不改变其摩尔配位比来回收三氟化硼配合物，并且通过从非导电流体沉降来分离三氟化硼配合物。通过利用这种使用三氟化硼配合物催化剂制备烯烃低聚物的方法，可以如反应那样重新使用回收的催化剂。

2. 发明申请

US20050070664A1 Thermosetting resin composition, process for producing the same, and suspension-form mixture 审中-公开
标题翻译：热固性树脂组合物，其制备方法和悬浮液混合物
公开(公告)号：US20050070664A1
公开(公告)日：2005-03-31
申请号：US10312412
申请日：2002-05-27
申请人： Tsutomu Takashima , Kouji Fujimura , Hideki Nomura
发明人： Tsutomu Takashima , Kouji Fujimura , Hideki Nomura
IPC分类号： C08L87/00 , C08G59/34 , C08L23/00 , C08L23/26 , C08L23/30 , C08L61/04 , C08L63/00 , C08L63/08 , C08L101/00 , H01L23/29
CPC分类号： C08G59/027 , C08L23/30 , C08L63/00 , C08L63/08 , C08L101/00 , H01L23/293 , H01L2924/0002 , C08L2666/04 , H01L2924/00
摘要： This invention relates a thermosetting resin composition which is produced by curing a composition containing a thermosetting resin and a reactive mono-olefin polymer, and its phase structure is sea-island structure which comprises a continuous phase mainly composed of a cured composition containing a thermosetting resin and, if necessary, further curing agent and dispersed phases mainly composed of a reactive mono-olefin polymer and said dispersed phases contain a plurality of finer dispersed phases and/or at least one layer of interfacial phases surrounding said dispersed phases, thereby providing a thermosetting resin composition that is suitable for use in sealing or encapsulating semiconductor devices, which composition has improved impact strength, resistance to thermal cracking, resistance to deterioration by oxidation, without losing thermal stability.
摘要翻译：本发明涉及通过固化含有热固性树脂和反应性单烯烃聚合物的组合物而制备的热固性树脂组合物，其相结构是海岛结构，其包括主要由含有热固性树脂的固化组合物组成的连续相并且如果需要，另外的固化剂和主要由反应性单烯烃聚合物组成的分散相和所述分散相包含多个更细的分散相和/或包围所述分散相的至少一层界面相，从而提供热固性适合用于密封或封装半导体器件的树脂组合物，该组合物具有改善的冲击强度，耐热裂纹性，耐氧化劣化性，而不损失热稳定性。

3. 发明授权

US08940365B2 Coating method, coating device, and storage medium 有权
标题翻译：涂布方法，涂布装置和存储介质
公开(公告)号：US08940365B2
公开(公告)日：2015-01-27
申请号：US13336373
申请日：2011-12-23
申请人： Akira Miyata , Yoshitaka Hara , Kouji Fujimura
发明人： Akira Miyata , Yoshitaka Hara , Kouji Fujimura
IPC分类号： B05D3/12 , G06F19/00 , H01L21/67
CPC分类号： H01L21/6715
摘要： A device to form a coating film which can quickly coat a substrate of a follow-up lot after coating a preceding lot. The device is configured such that nozzles for a preceding lot and a following lot are integrated into a common movement mechanism and moved between an upper side of a liquid processing unit and a standby area. A coating method includes sucking air into the nozzle for the preceding lot to form an upper gas layer, sucking a solvent for the preceding lot in the standby area to form a thinner layer, and sucking air into the nozzle for the preceding lot to form a lower gas layer within the nozzle, and thus forming a state that a solvent layer is interposed between the upper gas layer and the lower gas layer.
摘要翻译：一种形成涂膜的装置，其可以在涂覆前面的批次之后快速地涂覆后续批次的基材。该装置被构造成使得用于先前批次和后续批次的喷嘴被集成到公共运动机构中并且在液体处理单元的上侧和待机区域之间移动。涂布方法包括将空气吸入前述批次的喷嘴中以形成上部气体层，在备用区域吸取前一批料的溶剂以形成更薄的层，并将空气吸入前一批料的喷嘴中以形成从而形成在上部气体层和下部气体层之间插入溶剂层的状态。

4. 发明申请

US20130118533A1 LIQUID PROCESSING APPARATUS AND LIQUID PROCESSING METHOD 有权
标题翻译：液体加工设备和液体加工方法
公开(公告)号：US20130118533A1
公开(公告)日：2013-05-16
申请号：US13811522
申请日：2011-07-12
申请人： Yasushi Takiguchi , Taro Yamamoto , Tsutomu Yamahata , Akihiro Fujimoto , Kouji Fujimura
发明人： Yasushi Takiguchi , Taro Yamamoto , Tsutomu Yamahata , Akihiro Fujimoto , Kouji Fujimura
IPC分类号： B08B3/04
CPC分类号： B08B3/04 , G03F7/3021 , H01L21/6715 , H01L21/6719
摘要： To provide a liquid processing apparatus capable of processing substrates with a high throughput with the lesser number of nozzles for chemical-liquid, when the substrates that are horizontally held in cup bodies are liquid-processed by supplying a chemical liquid to the substrates. Taking a developing process as an example of a liquid process, two-types of developing nozzles are prepared for two types of developing methods. The developing nozzle, which is used in the method in which the nozzle is engaged with the process for a longer period of time, is individually disposed on each of a first processing module 1 and a second processing module 2. On the other hand, the developing nozzle, which is used in the method in which the nozzle is engaged with the process for a shorter period of time, is used in common in the first liquid processing module 1 and the second liquid processing module 2. The common developing nozzle is configured to wait on an intermediate position between the modules 1 and 2.
摘要翻译：为了提供一种液体处理装置，当水平保持在杯体中的基板通过向基板供应化学液体进行液体处理时，能够以较少数量的用于液体的喷嘴来处理具有高产量的基板的液体处理装置。以液体工艺为例的显影过程，为两种显影方法准备了两种类型的显影喷嘴。在喷嘴与该处理接合较长时间的方法中使用的显影喷嘴被单独地设置在第一处理模块1和第二处理模块2的每一个上。另一方面，在第一液体处理模块1和第二液体处理模块2中共同使用在喷嘴与该工艺相比较短时间接合的方法中使用的显影喷嘴。公知的显影喷嘴被配置等待模块1和2之间的中间位置。

5. 发明申请

US20110217473A1 WET PROCESSING APPARATUS, WET PROCESSING METHOD AND STORAGE MEDIUM 有权
标题翻译：湿处理设备，湿处理方法和储存介质
公开(公告)号：US20110217473A1
公开(公告)日：2011-09-08
申请号：US13037624
申请日：2011-03-01
申请人： Naofumi KISHITA , Kouji Fujimura , Yoshitaka Hara
发明人： Naofumi KISHITA , Kouji Fujimura , Yoshitaka Hara
IPC分类号： B05D1/30 , B05C11/00 , B05D1/00
CPC分类号： B05D1/02 , B05C11/00 , B05D1/00 , B05D1/30
摘要： A wet processing apparatus for wet-processing substrates can suppress the reduction of throughput when some component part thereof becomes unserviceable. The wet processing apparatus includes a first nozzle unit and a second nozzle unit. When the wet processing apparatus operates in a normal mode, a substrate carrying mechanism is controlled so as to deliver substrates alternately to processing units of a first group and those of a second group so that the substrates are processed sequentially in order. When the processing units of the first group (the second group) are unserviceable due to the inoperativeness of the substrate holders, a processing liquid supply system or a nozzle support mechanism, the nozzle unit for the processing units of the second group (the first group) is moved to process substrates by the serviceable ones of the first group (the second group).
摘要翻译：用于湿处理基板的湿式处理装置可以抑制当其一部分成为不可用时的吞吐量的降低。湿式处理装置包括第一喷嘴单元和第二喷嘴单元。当湿法处理装置以正常模式操作时，控制基板承载机构以将基板交替地传送到第一组和第二组的处理单元，使得依次顺序地处理基板。当第一组（第二组）的处理单元由于基板保持器的不能操作而不能使用时，处理液体供应系统或喷嘴支撑机构，用于第二组（第一组）的处理单元的喷嘴单元）被移动到由第一组（第二组）中可用的基板处理衬底。

6. 发明申请

US20110093832A1 PRINTED CIRCUIT BOARD DESIGN SUPPORT APPARATUS, METHOD, AND PROGRAM MEDIUM THEREFOR 有权
标题翻译：印刷电路板设计支持设备，方法和程序介质
公开(公告)号：US20110093832A1
公开(公告)日：2011-04-21
申请号：US12978767
申请日：2010-12-27
申请人： Kouji Fujimura
发明人： Kouji Fujimura
IPC分类号： G06F17/50
CPC分类号： G06F17/5068
摘要： In designing a printed circuit board, first and second copies of views of first and second major surfaces of the board respectively, are created. The first and second copies are positioned to contact each other. First and second segments on a side of the printed circuit board and normal to a first element in the first copy and a second element in the second copy respectively are obtained. A third segment joining ends of the first and second segments is obtained, and a point dividing the third segment according to a ratio of a distance from the first element to the side and a distance from the second element to the side is calculated. Distances from the first element to the point and from the point to the second element are calculated, and a creepage distance, a sum of the two distances and a thickness of the board, is obtained.
摘要翻译：在设计印刷电路板时，分别形成第一和第二主表面的第一和第二副视图。第一和第二副本被定位成彼此接触。分别获得印刷电路板一侧的第一和第二部分，并分别垂直于第一个拷贝中的第一个元件和第二个复制件中的第二个元件。获得接合第一和第二段的端部的第三段，并且计算根据与第一元件到侧面的距离与从第二元件到侧面的距离的比率将第三段分割的点。计算从第一元素到点和从点到第二元素的距离，并且获得爬电距离，两个距离之和和板的厚度。

7. 发明授权

US4789520A Fuel assembly and nuclear reactor 失效
标题翻译：燃料装配和核反应堆
公开(公告)号：US4789520A
公开(公告)日：1988-12-06
申请号：US77513
申请日：1987-07-24
申请人： Yuichi Morimoto , Hiromi Maruyama , Motoo Aoyama , Atsushi Zukeran , Yasunori Bessho , Tomoyuki Matsumoto , Yoshihiko Ishii , Kouji Fujimura , Sadao Uchikawa
发明人： Yuichi Morimoto , Hiromi Maruyama , Motoo Aoyama , Atsushi Zukeran , Yasunori Bessho , Tomoyuki Matsumoto , Yoshihiko Ishii , Kouji Fujimura , Sadao Uchikawa
IPC分类号： G21C3/326 , G21C1/08 , G21C3/30 , G21C3/328 , G21C3/00
CPC分类号： G21C3/328 , G21Y2002/20 , G21Y2004/10 , G21Y2004/30 , Y02E30/38
摘要： A fuel assembly is composed of first fuel rods containing nuclear fuel material and burnable poison material and second fuel rods containing nuclear fuel material but no burnable poison material. The fuel assembly is charged in a high conversion area of a boiling water type nuclear reactor having a reactor core having the high conversion area and a burner area surrounding the high conversion area. A ratio V.sub.C /V.sub.F is not greater than 1.5 in the fuel assembly where V.sub.C is the volume occupied by coolant flow paths and V.sub.F is the volume occupied by the nuclear fuel material per unit length in an axial direction of the fuel assembly. In addition, the burnable poison material is composed of neutron absorption nuclides having at least one resonant energy in a neutron energy region of one electron volt or less.

8. 发明授权

US08636915B2 Liquid processing apparatus and liquid processing method 有权
标题翻译：液体处理装置和液体处理方法
公开(公告)号：US08636915B2
公开(公告)日：2014-01-28
申请号：US13811522
申请日：2011-07-12
申请人： Yasushi Takiguchi , Taro Yamamoto , Tsutomu Yamahata , Akihiro Fujimoto , Kouji Fujimura
发明人： Yasushi Takiguchi , Taro Yamamoto , Tsutomu Yamahata , Akihiro Fujimoto , Kouji Fujimura
IPC分类号： B44C1/22 , C03C15/00 , C03C25/68 , C23F1/00
CPC分类号： B08B3/04 , G03F7/3021 , H01L21/6715 , H01L21/6719
摘要： To provide a liquid processing apparatus capable of processing substrates with a high throughput with the lesser number of nozzles for chemical-liquid, when the substrates that are horizontally held in cup bodies are liquid-processed by supplying a chemical liquid to the substrates. Taking a developing process as an example of a liquid process, two-types of developing nozzles are prepared for two types of developing methods. The developing nozzle, which is used in the method in which the nozzle is engaged with the process for a longer period of time, is individually disposed on each of a first processing module 1 and a second processing module 2. On the other hand, the developing nozzle, which is used in the method in which the nozzle is engaged with the process for a shorter period of time, is used in common in the first liquid processing module 1 and the second liquid processing module 2. The common developing nozzle is configured to wait on an intermediate position between the modules 1 and 2.
摘要翻译：为了提供一种液体处理装置，当水平保持在杯体中的基板通过向基板供应化学液体进行液体处理时，能够以较少数量的用于液体的喷嘴来处理具有高产量的基板的液体处理装置。以液体工艺为例的显影过程，为两种显影方法准备了两种类型的显影喷嘴。在喷嘴与该处理接合较长时间的方法中使用的显影喷嘴被单独地设置在第一处理模块1和第二处理模块2的每一个上。另一方面，在第一液体处理模块1和第二液体处理模块2中共同使用在喷嘴与该工艺相比较短时间接合的方法中使用的显影喷嘴。公知的显影喷嘴被配置等待模块1和2之间的中间位置。

9. 发明授权

US08522714B2 Wet processing apparatus, wet processing method and storage medium 有权
标题翻译：湿处理设备，湿法处理方法和存储介质
公开(公告)号：US08522714B2
公开(公告)日：2013-09-03
申请号：US13037624
申请日：2011-03-01
申请人： Naofumi Kishita , Kouji Fujimura , Yoshitaka Hara
发明人： Naofumi Kishita , Kouji Fujimura , Yoshitaka Hara
IPC分类号： B05C11/00 , B05C11/02 , B05B7/06
CPC分类号： B05D1/02 , B05C11/00 , B05D1/00 , B05D1/30
摘要： A wet processing apparatus for wet-processing substrates can suppress the reduction of throughput when some component part thereof becomes unserviceable. The wet processing apparatus includes a first nozzle unit and a second nozzle unit. When the wet processing apparatus operates in a normal mode, a substrate carrying mechanism is controlled so as to deliver substrates alternately to processing units of a first group and those of a second group so that the substrates are processed sequentially in order. When the processing units of the first group (the second group) are unserviceable due to the inoperativeness of the substrate holders, a processing liquid supply system or a nozzle support mechanism, the nozzle unit for the processing units of the second group (the first group) is moved to process substrates by the serviceable ones of the first group (the second group).
摘要翻译：用于湿处理基板的湿式处理装置可以抑制当其一部分成为不可用时的吞吐量的降低。湿式处理装置包括第一喷嘴单元和第二喷嘴单元。当湿法处理装置以正常模式操作时，控制基板承载机构以将基板交替地传送到第一组和第二组的处理单元，使得依次顺序地处理基板。当第一组（第二组）的处理单元由于衬底保持器的不操作而不能使用时，处理液体供应系统或喷嘴支撑机构，用于第二组（第一组）的处理单元的喷嘴单元）被移动到由第一组（第二组）中可用的基板处理衬底。

10. 发明授权

US07984414B2 Printed circuit board design support apparatus, method, and recording medium storing program therefor 有权
标题翻译：印刷电路板设计支持设备，方法和记录介质存储程序
公开(公告)号：US07984414B2
公开(公告)日：2011-07-19
申请号：US12978767
申请日：2010-12-27
申请人： Kouji Fujimura
发明人： Kouji Fujimura
IPC分类号： G06F17/50
CPC分类号： G06F17/5068
摘要： In designing a printed circuit board, first and second copies of views of first and second major surfaces of the board respectively, are created. The first and second copies are positioned to contact each other. First and second segments on a side of the printed circuit board and normal to a first element in the first copy and a second element in the second copy respectively are obtained. A third segment joining ends of the first and second segments is obtained, and a point dividing the third segment according to a ratio of a distance from the first element to the side and a distance from the second element to the side is calculated. Distances from the first element to the point and from the point to the second element are calculated, and a creepage distance, a sum of the two distances and a thickness of the board, is obtained.
摘要翻译：在设计印刷电路板时，分别形成第一和第二主表面的第一和第二副视图。第一和第二副本被定位成彼此接触。分别获得印刷电路板一侧的第一和第二部分，并分别垂直于第一个拷贝中的第一个元件和第二个复制件中的第二个元件。获得接合第一和第二段的端部的第三段，并且计算根据与第一元件到侧面的距离与从第二元件到侧面的距离的比率将第三段分割的点。计算从第一元素到点和从点到第二元素的距离，并且获得爬电距离，两个距离之和和板的厚度。

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