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1. 发明授权

US08640538B2 Flow sensor and manufacturing method of the same and flow sensor module and manufacturing method of the same 有权
标题翻译：流量传感器及其制造方法和流量传感器模块及其制造方法相同
公开(公告)号：US08640538B2
公开(公告)日：2014-02-04
申请号：US13393155
申请日：2011-09-13
申请人： Tsutomu Kono , Keiji Hanzawa , Takeshi Morino , Yuki Okamoto , Noboru Tokuyasu , Shinobu Tashiro
发明人： Tsutomu Kono , Keiji Hanzawa , Takeshi Morino , Yuki Okamoto , Noboru Tokuyasu , Shinobu Tashiro
IPC分类号： G01F1/68
CPC分类号： G01F1/383 , G01F1/34 , G01F1/6845 , G01F1/692 , G01F1/698 , G01F5/00 , H01L2224/48227 , H01L2224/73265 , H01L2924/10157 , H01L2924/15151 , H01L2924/15153
摘要： Technique of suppressing performance variations for each flow sensor is provided. In a flow sensor FS1 of the present invention, a part of a semiconductor chip CHP1 is configured to be covered with resin (MR) in a state in which a flow sensing unit (FDU) formed on a semiconductor chip CHP1 is exposed. Since an upper surface SUR(MR) of the resin (MR) is higher than an upper surface SUR(CHP) of the semiconductor chip (CHP1) by sealing the resin (MR) on a part of the upper surface SUR(CHP) of the semiconductor chip CHP1 in a direction parallel to an air flow direction, the air flow around the flow sensing unit (FDU) can be stabilized. Further, interface peeling between the semiconductor chip (CHP1) and the resin (MR) can be prevented by an increase of contact area between the semiconductor chip (CHP1) and the resin (MR).
摘要翻译：提供了抑制每个流量传感器的性能变化的技术。在本发明的流量传感器FS1中，半导体芯片CHP1的一部分被配置为在形成在半导体芯片CHP1上的流量检测单元（FDU）暴露的状态下被树脂（MR）覆盖。由于树脂（MR）的上表面SUR（MR）高于半导体芯片（CHP1）的上表面SUR（CHP），所以通过在上表面SUR（CHP）的一部分上密封树脂半导体芯片CHP1在与空气流动方向平行的方向上，可以使流量检测单元（FDU）周围的空气流稳定。此外，通过增加半导体芯片（CHP1）和树脂（MR）之间的接触面积，可以防止半导体芯片（CHP1）和树脂（MR）之间的界面剥离。

2. 发明申请

US20130192388A1 Flow Sensor and Manufacturing Method of the Same and Flow Sensor Module and Manufacturing Method of the Same 有权
标题翻译：流量传感器及其制造方法及其流程传感器模块及其制造方法
公开(公告)号：US20130192388A1
公开(公告)日：2013-08-01
申请号：US13393155
申请日：2011-09-13
申请人： Tsutomu Kono , Keiji Hanzawa , Takeshi Morino , Yuki Okamoto , Noboru Tokuyasu , Shinobu Tashiro
发明人： Tsutomu Kono , Keiji Hanzawa , Takeshi Morino , Yuki Okamoto , Noboru Tokuyasu , Shinobu Tashiro
IPC分类号： G01F1/34
CPC分类号： G01F1/383 , G01F1/34 , G01F1/6845 , G01F1/692 , G01F1/698 , G01F5/00 , H01L2224/48227 , H01L2224/73265 , H01L2924/10157 , H01L2924/15151 , H01L2924/15153
摘要： Technique of suppressing performance variations for each flow sensor is provided. In a flow sensor FS1 of the present invention, a part of a semiconductor chip CHP1 is configured to be covered with resin (MR) in a state in which a flow sensing unit (FDU) formed on a semiconductor chip CHP1 is exposed. Since an upper surface SUR(MR) of the resin (MR) is higher than an upper surface SUR(CHP) of the semiconductor chip (CHP1) by sealing the resin (MR) on a part of the upper surface SUR(CHP) of the semiconductor chip CHP1 in a direction parallel to an air flow direction, the air flow around the flow sensing unit (FDU) can be stabilized. Further, interface peeling between the semiconductor chip (CHP1) and the resin (MR) can be prevented by an increase of contact area between the semiconductor chip (CHP1) and the resin (MR).
摘要翻译：提供了抑制每个流量传感器的性能变化的技术。在本发明的流量传感器FS1中，半导体芯片CHP1的一部分被配置为在形成在半导体芯片CHP1上的流量检测单元（FDU）暴露的状态下被树脂（MR）覆盖。由于树脂（MR）的上表面SUR（MR）高于半导体芯片（CHP1）的上表面SUR（CHP），所以通过在上表面SUR（CHP）的一部分上密封树脂半导体芯片CHP1在与空气流动方向平行的方向上，可以使流量检测单元（FDU）周围的空气流稳定。此外，通过增加半导体芯片（CHP1）和树脂（MR）之间的接触面积，可以防止半导体芯片（CHP1）和树脂（MR）之间的界面剥离。

3. 发明授权

US09784605B2 Thermal flow meter including a cover mounted on a housing and where a bypass passage is formed by the cover and a bypass passage trench 有权
公开(公告)号：US09784605B2
公开(公告)日：2017-10-10
申请号：US14407730
申请日：2012-06-15
申请人： Noboru Tokuyasu , Shinobu Tashiro , Keiji Hanzawa , Takeshi Morino , Ryosuke Doi , Akira Uenodan
发明人： Noboru Tokuyasu , Shinobu Tashiro , Keiji Hanzawa , Takeshi Morino , Ryosuke Doi , Akira Uenodan
IPC分类号： G01F1/68 , G01F1/684 , G01F1/696 , G01F15/14
CPC分类号： G01F1/684 , G01F1/6842 , G01F1/6845 , G01F1/6965 , G01F15/14
摘要： The present invention has been made to improve measurement accuracy of a thermal flow meter. In the thermal flowmeter according to the invention, a circuit package (400) that measures a flow rate is molded in a first resin molding process. In a second resin molding process, a housing (302) having an inlet trench (351), a bypass passage trench on frontside (332), an outlet trench (353), and the like are formed through resin molding, and an outer circumferential surface of the circuit package (400) produced in the first resin molding process is enveloped by a resin in the second resin molding process to fix the circuit package (400) to the housing (302).

4. 发明授权

US09587970B2 Airflow measuring apparatus including a ventilation hole between a connector part and a circuit chamber 有权
标题翻译：气流测量装置包括连接器部分和电路室之间的通气孔
公开(公告)号：US09587970B2
公开(公告)日：2017-03-07
申请号：US14363235
申请日：2011-12-07
申请人： Takeshi Morino , Shinobu Tashiro , Noboru Tokuyasu , Ryosuke Doi , Keiji Hanzawa
发明人： Takeshi Morino , Shinobu Tashiro , Noboru Tokuyasu , Ryosuke Doi , Keiji Hanzawa
IPC分类号： G01F1/68 , G01F1/684 , G01F1/692 , G01F5/00 , F02D41/18 , H01L35/34
CPC分类号： G01F1/6842 , F02D41/187 , G01F1/6845 , G01F1/692 , G01F5/00 , H01L35/34
摘要： An airflow measuring apparatus includes a sub-passage that takes in part of flow of fluid flowing through an intake pipe, a sensor element disposed in the sub-passage to measure the flow of fluid, a circuit part converting the flow of fluid detected by the sensor element into an electric signal, a connector part connected to the circuit part to output a signal externally, and a casing supporting the sensor element and the circuit part. The sensor element is disposed in the intake pipe, and includes a cavity disposed at a semiconductor substrate and a diaphragm including a thin film part that covers the cavity. The sensor element on a lead frame has surfaces that are mold-packaged with resin so that the diaphragm and part of the lead frame are exposed. One hole is disposed at the lead frame for communication between the cavity and exterior.
摘要翻译：一种气流测量装置，包括：副通路，其采取流过进气管的流体的一部分流动;设置在该通路中的传感器元件，以测量流体的流动;电路部分，传感器元件变成电信号，连接到电路部分的连接器部分，以在外部输出信号，以及支撑传感器元件和电路部分的壳体。传感器元件设置在进气管中，并且包括设置在半导体基板处的空腔和包括覆盖空腔的薄膜部分的隔膜。引线框架上的传感器元件具有用树脂模制包装的表面，使得隔膜和引线框架的一部分被暴露。一个孔设置在引线框架处，用于在空腔和外部之间连通。

5. 发明申请

US20150122012A1 Thermal Flow Meter 有权
标题翻译：热流量计
公开(公告)号：US20150122012A1
公开(公告)日：2015-05-07
申请号：US14407730
申请日：2012-06-15
申请人： Noboru Tokuyasu , Shinobu Tashiro , Keiji Hanzawa , Takeshi Morino , Ryosuke Doi , Akira Uenodan
发明人： Noboru Tokuyasu , Shinobu Tashiro , Keiji Hanzawa , Takeshi Morino , Ryosuke Doi , Akira Uenodan
IPC分类号： G01F1/684
CPC分类号： G01F1/684 , G01F1/6842 , G01F1/6845 , G01F1/6965 , G01F15/14
摘要： The present invention has been made to improve measurement accuracy of a thermal flow meter. In the thermal flowmeter according to the invention, a circuit package (400) that measures a flow rate is molded in a first resin molding process. In a second resin molding process, a housing (302) having an inlet trench (351), a bypass passage trench on frontside (332), an outlet trench (353), and the like are formed through resin molding, and an outer circumferential surface of the circuit package (400) produced in the first resin molding process is enveloped by a resin in the second resin molding process to fix the circuit package (400) to the housing (302).
摘要翻译：本发明是为了提高热式流量计的测量精度。在根据本发明的热流量计中，在第一树脂模塑工艺中模制测量流速的电路封装（400）。在第二树脂模制工艺中，通过树脂模制形成具有入口沟槽（351），前侧旁路通道沟槽（332），出口沟槽（353）等的外壳（302），外周在第二树脂成型工序中，在第一树脂成形工序中制作的电路封装（400）的表面被树脂包围，将电路封装（400）固定在壳体（302）上。

6. 发明申请

US20140352424A1 AIRFLOW MEASURING APPARATUS 有权
标题翻译：气流测量装置
公开(公告)号：US20140352424A1
公开(公告)日：2014-12-04
申请号：US14363235
申请日：2011-12-07
申请人： Takeshi Morino , Shinobu Tashiro , Noboru Tokuyasu , Ryosuke Doi , Keiji Hanzawa
发明人： Takeshi Morino , Shinobu Tashiro , Noboru Tokuyasu , Ryosuke Doi , Keiji Hanzawa
IPC分类号： G01F1/684 , H01L35/34 , G01F1/692
CPC分类号： G01F1/6842 , F02D41/187 , G01F1/6845 , G01F1/692 , G01F5/00 , H01L35/34
摘要： Airflow measuring apparatus compring: sub-passage that takes in part of flow of fluid flowing through an intake pipe; sensor element that is disposed in the sub-passage to measure the flow of fluid; a circuit part that converts the flow of fluid detected by the sensor element into an electric signal; connector part connected to the circuit part to output a signal externally; and casing that supports the sensor element and the circuit part, the sensor element being disposed in the intake pipe. The sensor element includes a cavity disposed at a semiconductor substrate, a diaphragm including a thin film part that covers the cavity. The sensor element on a lead frame have surfaces that are mold-packaged with resin so that a diaphragm of the sensor element and part of the lead frame are exposed. One hole is disposed at the lead frame for communication between the cavity and exterior.
摘要翻译：气流测量装置包括：部分流过进气管的流体流动的副通道; 传感器元件，设置在子通道中以测量流体的流动; 电路部，其将由所述传感器元件检测出的流体流转换为电信号; 连接器部分连接到电路部分以从外部输出信号; 以及支撑传感器元件和电路部分的壳体，传感器元件设置在进气管中。传感器元件包括设置在半导体衬底处的腔体，隔膜包括覆盖空腔的薄膜部分。引线框架上的传感器元件具有用树脂模制包装的表面，使得传感器元件的膜片和引线框架的一部分被暴露。一个孔设置在引线框架处，用于在空腔和外部之间连通。

7. 发明授权

US08969977B2 Flow sensor, method for manufacturing flow sensor and flow sensor module 有权
标题翻译：流量传感器，流量传感器和流量传感器模块的制造方法
公开(公告)号：US08969977B2
公开(公告)日：2015-03-03
申请号：US12964935
申请日：2010-12-10
申请人： Tsutomu Kono , Yuuki Okamoto , Takeshi Morino , Keiji Hanzawa
发明人： Tsutomu Kono , Yuuki Okamoto , Takeshi Morino , Keiji Hanzawa
IPC分类号： H01L29/84 , G01F1/684 , G01F1/692
CPC分类号： G01F15/16 , G01F1/684 , G01F1/6842 , G01F1/692 , H01L23/495 , H01L29/84 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/49171 , H01L2224/73265 , H01L2924/00014 , H01L2924/00
摘要： The invention provides a flow sensor structure for sealing the surface of an electric control circuit and a part of a semiconductor device via a manufacturing method capable of preventing occurrence of flash or chip crack when clamping the semiconductor device via a mold. The invention provides a flow sensor structure comprising a semiconductor device having an air flow sensing unit and a diaphragm formed thereto, and a board or a lead frame having an electric control circuit for controlling the semiconductor device disposed thereto, wherein a surface of the electric control circuit and a part of a surface of the semiconductor device is covered with resin while having the air flow sensing unit portion exposed. The invention further provides flow sensor structure in which surfaces of a resin mold, a board or a pre-mold component surrounding the semiconductor device are continuously not in contact with three walls of the semiconductor device orthogonal to a side on which the air flow sensing unit portion is disposed, or a manufacturing method for absorbing the dimensional variation of the semiconductor device by the deformation of springs or deformation of an elastic film in the thickness direction.
摘要翻译：本发明提供了一种流量传感器结构，用于经由模具夹紧半导体器件时能够防止发生闪光或芯片裂纹的制造方法来密封电气控制电路和半导体器件的一部分的表面。本发明提供了一种流量传感器结构，其包括具有气流检测单元和形成于其上的隔膜的半导体器件，以及具有用于控制设置在其上的半导体器件的电气控制电路的电路板或引线框架，其中，电路和半导体器件的表面的一部分被树脂覆盖，同时使空气流感测单元部分暴露。本发明还提供了一种流量传感器结构，其中围绕半导体器件的树脂模具，板或预模具部件的表面不连续地与半导体器件的三个壁接触，该壁与空气流量检测单元或者通过弹簧的变形或弹性膜在厚度方向的变形来吸收半导体器件的尺寸变化的制造方法。

8. 外观设计

USD660192S1 Airflow sensor 有权
标题翻译：气流传感器
公开(公告)号：USD660192S1
公开(公告)日：2012-05-22
申请号：US29385385
申请日：2011-02-14
申请人： Keiji Hanzawa , Takeshi Morino , Yuki Okamoto , Ryo Sato , Yasuo Onose
设计人： Keiji Hanzawa , Takeshi Morino , Yuki Okamoto , Ryo Sato , Yasuo Onose

9. 发明授权

US07942053B2 Air flow measuring instrument having dust particle diverting structure 有权
标题翻译：气流测量仪具有粉尘颗粒转向结构
公开(公告)号：US07942053B2
公开(公告)日：2011-05-17
申请号：US12261700
申请日：2008-10-30
申请人： Naoki Saito , Takeshi Morino , Yuki Okamoto , Keiji Hanzawa , Hiromu Kikawa , Akio Yasukawa
发明人： Naoki Saito , Takeshi Morino , Yuki Okamoto , Keiji Hanzawa , Hiromu Kikawa , Akio Yasukawa
IPC分类号： G01F1/68
CPC分类号： G01F1/6845 , G01F5/00 , G01F15/12
摘要： An air flow measuring instrument, comprising: an auxiliary passage 8 arranged inside a main passage through which fluid flows, a tabular member 5 on which a pattern of a heating resistor for measuring an air flow is provided on one face 5a, the tabular member being disposed inside the auxiliary passage so that the one face 5a on which the heating resistor pattern of the tabular member is provided is disposed along a flow of fluid inside the auxiliary passage 8, a heating resistor pattern-side fluid passage 8a portion formed so that the fluid flows between the face 5a and a passage-forming surface 8d of the auxiliary passage, and a back-surface 8b side fluid passage portion formed so that fluid flows between a face 5b on a side opposite to the face of the tabular member and the passage-forming surface of the auxiliary passage. Guidance portion 13 guiding dust that collides against the end portion to back-surface side fluid passage portion 8b side is provided on upstream-side end of tabular member.
摘要翻译：一种气流测量仪器，包括：辅助通道8，布置在流体流过的主通道内部;平板状构件5，在一个面5a上设置有用于测量气流的加热电阻器的图案，平板状构件为设置在辅助通道内部，使得设置有平板状构件的加热电阻体图形的一个面5a沿着辅助通道8内的流体流布置，形成的加热电阻器图案侧流体通道8a部分，流体在表面5a和辅助通道的通道形成表面8d之间流动，并且后表面8b侧流体通道部分形成为使得流体在与板状构件的表面相对的一侧的表面5b和辅助通道的通道形成表面。引导部分13引导与端部至后表面侧流体通道部分8b侧碰撞的灰尘，该引导部分13设置在平板状部件的上游侧端部。

10. 发明申请

US20110140211A1 Flow Sensor, Method for Manufacturing Flow Sensor and Flow Sensor Module 有权
标题翻译：流量传感器，流量传感器和流量传感器模块的制造方法
公开(公告)号：US20110140211A1
公开(公告)日：2011-06-16
申请号：US12964935
申请日：2010-12-10
申请人： Tsutomu KONO , Yuuki Okamoto , Takeshi Morino , Keiji Hanzawa
发明人： Tsutomu KONO , Yuuki Okamoto , Takeshi Morino , Keiji Hanzawa
IPC分类号： H01L29/84 , H01L21/50
CPC分类号： G01F15/16 , G01F1/684 , G01F1/6842 , G01F1/692 , H01L23/495 , H01L29/84 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/49171 , H01L2224/73265 , H01L2924/00014 , H01L2924/00
摘要： The invention provides a flow sensor structure for sealing the surface of an electric control circuit and a part of a semiconductor device via a manufacturing method capable of preventing occurrence of flash or chip crack when clamping the semiconductor device via a mold. The invention provides a flow sensor structure comprising a semiconductor device having an air flow sensing unit and a diaphragm formed thereto, and a board or a lead frame having an electric control circuit for controlling the semiconductor device disposed thereto, wherein a surface of the electric control circuit and a part of a surface of the semiconductor device is covered with resin while having the air flow sensing unit portion exposed. The invention further provides flow sensor structure in which surfaces of a resin mold, a board or a pre-mold component surrounding the semiconductor device are continuously not in contact with three walls of the semiconductor device orthogonal to a side on which the air flow sensing unit portion is disposed, or a manufacturing method for absorbing the dimensional variation of the semiconductor device by the deformation of springs or deformation of an elastic film in the thickness direction.
摘要翻译：本发明提供了一种流量传感器结构，用于经由模具夹紧半导体器件时能够防止发生闪光或芯片裂纹的制造方法来密封电气控制电路和半导体器件的一部分的表面。本发明提供了一种流量传感器结构，其包括具有气流检测单元和形成于其上的隔膜的半导体器件，以及具有用于控制设置在其上的半导体器件的电气控制电路的电路板或引线框架，其中，电路和半导体器件的表面的一部分被树脂覆盖，同时使空气流感测单元部分暴露。本发明还提供了一种流量传感器结构，其中围绕半导体器件的树脂模具，板或预模具部件的表面不连续地与半导体器件的三个壁接触，该壁与空气流量检测单元或者通过弹簧的变形或弹性膜在厚度方向的变形来吸收半导体器件的尺寸变化的制造方法。

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