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1. 发明申请

US20110140211A1 Flow Sensor, Method for Manufacturing Flow Sensor and Flow Sensor Module 有权
标题翻译：流量传感器，流量传感器和流量传感器模块的制造方法
公开(公告)号：US20110140211A1
公开(公告)日：2011-06-16
申请号：US12964935
申请日：2010-12-10
申请人： Tsutomu KONO , Yuuki Okamoto , Takeshi Morino , Keiji Hanzawa
发明人： Tsutomu KONO , Yuuki Okamoto , Takeshi Morino , Keiji Hanzawa
IPC分类号： H01L29/84 , H01L21/50
CPC分类号： G01F15/16 , G01F1/684 , G01F1/6842 , G01F1/692 , H01L23/495 , H01L29/84 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/49171 , H01L2224/73265 , H01L2924/00014 , H01L2924/00
摘要： The invention provides a flow sensor structure for sealing the surface of an electric control circuit and a part of a semiconductor device via a manufacturing method capable of preventing occurrence of flash or chip crack when clamping the semiconductor device via a mold. The invention provides a flow sensor structure comprising a semiconductor device having an air flow sensing unit and a diaphragm formed thereto, and a board or a lead frame having an electric control circuit for controlling the semiconductor device disposed thereto, wherein a surface of the electric control circuit and a part of a surface of the semiconductor device is covered with resin while having the air flow sensing unit portion exposed. The invention further provides flow sensor structure in which surfaces of a resin mold, a board or a pre-mold component surrounding the semiconductor device are continuously not in contact with three walls of the semiconductor device orthogonal to a side on which the air flow sensing unit portion is disposed, or a manufacturing method for absorbing the dimensional variation of the semiconductor device by the deformation of springs or deformation of an elastic film in the thickness direction.
摘要翻译：本发明提供了一种流量传感器结构，用于经由模具夹紧半导体器件时能够防止发生闪光或芯片裂纹的制造方法来密封电气控制电路和半导体器件的一部分的表面。本发明提供了一种流量传感器结构，其包括具有气流检测单元和形成于其上的隔膜的半导体器件，以及具有用于控制设置在其上的半导体器件的电气控制电路的电路板或引线框架，其中，电路和半导体器件的表面的一部分被树脂覆盖，同时使空气流感测单元部分暴露。本发明还提供了一种流量传感器结构，其中围绕半导体器件的树脂模具，板或预模具部件的表面不连续地与半导体器件的三个壁接触，该壁与空气流量检测单元或者通过弹簧的变形或弹性膜在厚度方向的变形来吸收半导体器件的尺寸变化的制造方法。

2. 发明申请

US20100103977A1 METHOD OF ANALYZING THERMAL STRESS ACCORDING TO FILLING FACTOR OF FILLER IN RESIN 失效
标题翻译：根据树脂填料填充因子分析热应力的方法
公开(公告)号：US20100103977A1
公开(公告)日：2010-04-29
申请号：US12604009
申请日：2009-10-22
申请人： Tsutomu KONO , Masayuki MINO , Hidehiro TAKESHIMA , Youkou ITO , Tomoko GOI
发明人： Tsutomu KONO , Masayuki MINO , Hidehiro TAKESHIMA , Youkou ITO , Tomoko GOI
IPC分类号： G01N3/60
CPC分类号： G01N3/00 , B29C45/7693 , B29K2105/16 , G01N2203/0214
摘要： A method of analyzing thermal stress includes calculating a distribution of the number of fillers in a composite integrally molded product by using physical property values of resin material containing fillers, and determining a coefficient of linear expansion of the resin material in the composite integrally molded product, that is used as an input condition of a thermal stress analysis, based on the distribution of the number of the fillers.
摘要翻译：分析热应力的方法包括通过使用含有填料的树脂材料的物理性质值来计算复合一体成形品中的填料数量的分布，并确定复合一体成形品中的树脂材料的线膨胀系数，其用作热应力分析的输入条件，基于填料数量的分布。

3. 发明申请

US20110112812A1 METHOD FOR PREDICTING VOLUME CHANGE OF VOID GENERATED IN RESIN FILLED IN POROUS BODY, AND METHOD FOR ANALYZING FLOW OF RESIN MATERIAL IN POROUS BODY 有权
标题翻译：用于预测在多孔体内填充的树脂中产生的空穴的体积变化的方法以及多孔体内树脂材料的分析流程的方法
公开(公告)号：US20110112812A1
公开(公告)日：2011-05-12
申请号：US12942094
申请日：2010-11-09
申请人： Tsutomu KONO , Hiroki Nakatsuchi , Keiji Suzuki , Mitsuru Onoda , Kazuo Goto , Yasuaki Kageyama , Hiroaki Kojima , Kenji Ikeda , Hisashi Morooka
发明人： Tsutomu KONO , Hiroki Nakatsuchi , Keiji Suzuki , Mitsuru Onoda , Kazuo Goto , Yasuaki Kageyama , Hiroaki Kojima , Kenji Ikeda , Hisashi Morooka
IPC分类号： G06G7/57 , G06F17/10
CPC分类号： G06F17/5018 , G06F2217/16 , G06F2217/41
摘要： The present method aims at preventing breakdown by selecting conditions for preventing the occurrence of voids via analysis. According to the present method, a database related to the time variation of amount of generated gas or number of moles when a solid member is heated is experimentally formulated in advance, and the amount of generated gas from the member and the specific heat ratio of gases are entered for analysis in order to predict via analysis the generation of voids within the resin material when the solid member is heated, to thereby select conditions for preventing voids.
摘要翻译：本方法旨在通过分析选择防止空洞发生的条件来防止破坏。根据本方法，预先实验性地配制与实施部件被加热时的产生气体的时间变化量或摩尔数相关的数据库，并且从部件产生的气体量和气体的比热比进行分析，以便通过分析预测当固体构件被加热时树脂材料中的空隙的产生，从而选择用于防止空隙的条件。

4. 发明申请

US20100209041A1 PHOTOELECTRIC COMPOSITE WIRING MODULE AND METHOD FOR MANUFACTURING THE SAME 有权
标题翻译：光电复合接线模块及其制造方法
公开(公告)号：US20100209041A1
公开(公告)日：2010-08-19
申请号：US12623686
申请日：2009-11-23
申请人： Naoki MATSUSHIMA , Norio CHUJO , Yasunobu MATSUOKA , Toshiki SUGAWARA , Madoka MINAGAWA , Saori HAMAMURA , Satoshi KANEKO , Tsutomu KONO
发明人： Naoki MATSUSHIMA , Norio CHUJO , Yasunobu MATSUOKA , Toshiki SUGAWARA , Madoka MINAGAWA , Saori HAMAMURA , Satoshi KANEKO , Tsutomu KONO
IPC分类号： G02B6/12 , H01L21/00 , G02B6/36
CPC分类号： G02B6/4214 , H05K1/0274 , H05K1/185 , H05K3/4602 , H05K3/4644
摘要： A photoelectric composite wiring module includes a circuit substrate, an optical device, an LSI having a driver and an amplifier for the optical device, and a thin film wiring layer having an electrical wiring. The optical device is connected with the LSI by means of the electrical wiring. The optical device is formed on the circuit substrate and optically coupled to an optical waveguide formed in the circuit substrate. The thin film wiring layer is formed on the optical device to ensure that the optical device is electrically connected with the electrical wiring of the thin film wiring layer. The LSI is mounted on and electrically connected with the thin film wiring layer.
摘要翻译：光电复合布线模块包括电路基板，光学装置，具有驱动器的LSI和用于光学装置的放大器，以及具有电布线的薄膜布线层。光学器件通过电线与LSI连接。光学器件形成在电路基板上，并且光耦合到形成在电路基板中的光波导。在光学器件上形成薄膜布线层，以确保光学器件与薄膜布线层的电气布线电连接。 LSI与薄膜布线层安装在电连接上。

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