会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 3. 发明授权
    • Coating apparatus and coating method
    • 涂布设备和涂布方法
    • US06635113B2
    • 2003-10-21
    • US09313860
    • 1999-05-18
    • Hideyuki TakamoriNoriyuki AnaiMasafumi NomuraKiyohisa TateyamaTsutae Omori
    • Hideyuki TakamoriNoriyuki AnaiMasafumi NomuraKiyohisa TateyamaTsutae Omori
    • B05C1110
    • H01L21/6715
    • A substrate is held on a spin chuck, and resist solution is supplied to the surface of the substrate at a plurality of positions spaced at predetermined intervals from a plurality of resist nozzles provided the bottom surface of a resist pipe provided over a first direction across the surface of the substrate. Thereafter, the substrate is oscillated or rotated, thereby making the resist solution on the substrate a thin coating film with a uniform thickness. In the coating apparatus and method, which are excellent in responsiveness to a degree of viscosity of coating solution, various kinds of treatment agents with a wide range of viscosity can be used, and mechanical accuracy such as the space between the nozzles and the substrate, accuracy of the nozzle size, and the like can be loosened.
    • 将基板保持在旋转卡盘上,并且将抗蚀剂溶液以多个位置间隔开的多个位置从多个抗蚀剂喷嘴供应到基板的表面,所述多个抗蚀剂喷嘴设置在沿着第一方向设置的抗蚀剂管的底表面 基板的表面。 此后,基板振荡或旋转,从而使抗蚀剂溶液在基板上具有均匀厚度的薄涂层膜。 在对涂布液的粘度的响应性优异的涂布装置和方法中,可以使用具有宽范围粘度的各种处理剂,并且可以使用诸如喷嘴和基板之间的空间的机械精度, 可以使喷嘴尺寸的精度等松动。
    • 4. 发明授权
    • Substrate processing method
    • 基板加工方法
    • US06306455B1
    • 2001-10-23
    • US09141721
    • 1998-08-27
    • Hideyuki TakamoriMasafumi NomuraTsutae Omori
    • Hideyuki TakamoriMasafumi NomuraTsutae Omori
    • B05D312
    • H01L21/67248B05C11/08B05D1/005H01L21/6838
    • A method of processing a substrate for forming a coating film on a substrate comprising the steps of (a) mounting a substrate on a temperature controlling means which is capable of having a heat influence on the substrate, and controlling temperature of the substrate by the temperature controlling means, (b) controlling temperature of a coating solution to be supplied to the substrate, (c) controlling temperature of a contact member in contact with the substrate when the substrate is transported and held, (d) detecting temperature of an atmosphere of a process space for applying the coating solution to the substrate, (e) setting a desired temperature on the basis of temperature/film-thickness data previously obtained by forming the coating film on the substrate, (f) controlling a temperature controlling operation of at least step (c) on the basis of the desired temperature set in the step (e) and the temperature detected in the step (d), and (g) applying the coating solution to the substrate.
    • 一种处理在基板上形成涂膜的基板的方法,包括以下步骤:(a)将基板安装在能够对基板产生热影响的温度控制装置上,并将基板的温度控制在温度 控制装置,(b)控制供给到基板的涂布液的温度,(c)控制基板被输送和保持时与基板接触的接触部件的温度,(d)检测温度, 用于将涂布溶液涂布到基板上的处理空间,(e)基于通过在基板上形成涂膜而获得的温度/膜厚度数据设定所需温度,(f)控制在基板上的温度控制操作 基于步骤(e)中设定的所需温度和步骤(d)中检测到的温度,最小步骤(c),和(g)将涂布溶液施加到副 策划
    • 6. 发明授权
    • Developing method and apparatus
    • 开发方法和装置
    • US06969572B2
    • 2005-11-29
    • US10706091
    • 2003-11-13
    • Kiyohisa TateyamaMasafumi NomuraTaketora Shinogi
    • Kiyohisa TateyamaMasafumi NomuraTaketora Shinogi
    • G03F7/26G03D3/06G03F7/30H01L21/00H01L21/027G03D5/04G03D5/06G03F7/32
    • G03D3/065G03D3/06G03F7/30G03F7/3071H01L21/6715H01L21/67253
    • In this developing method and apparatus, a concentration measuring unit 222 picks part of developing fluid in a blending tank 186 to measure the resist concentration by an absorption photometry and feeds the detected resist concentration to a control unit 240. The control unit 240 controls respective valves 210, 212, 216 of a TMAH concentrate solution 200, a solvent pipe 204 and a drain pipe 208 in a manner that the developing fluid in the blending tank 186 has a TMAH concentration corresponding to a measured resist-concentration value to accomplish a constant developing rate, performing component control of the developing fluid. The developing fluid transferred from the blending tank 186 to a supply tank 188 is fed to a developer nozzle DN in a developing section 126 through a developer pipe 224 owing to the drive of a pump 228. Accordingly, even if the developing fluid is reused in the developing process in multiple times, it is possible to make sure of the uniformity in development.
    • 在该显影方法和装置中,浓度测量单元222拾取混合罐186中的显影液的一部分,通过吸收测光法测量抗蚀剂浓度,并将检测到的抗蚀剂浓度供给到控制单元240。 控制单元240以这样的方式控制TMAH浓缩液200,溶剂管204和排水管208的各个阀210,212,216,使得混合罐186中的显影流体具有对应于测量的抗蚀剂层的TMAH浓度, 浓度值以实现恒定的显影速率,进行显影液的成分控制。 通过泵228的驱动,从混合罐186向供给罐188输送的显影液通过显影剂管道224被供给到显影部分126中的显影剂喷嘴DN。 因此,即使显影液在显影过程中重复使用多次,也可以确保显影的均匀性。