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1. 发明申请

US20090035492A1 Laser marking label 审中-公开
标题翻译：激光打标标签
公开(公告)号：US20090035492A1
公开(公告)日：2009-02-05
申请号：US12219052
申请日：2008-07-15
申请人： Tsuneyuki Amano , Takashi Imoto , Rie Nakahira
发明人： Tsuneyuki Amano , Takashi Imoto , Rie Nakahira
IPC分类号： B41M5/40
CPC分类号： B41M5/24
摘要： The present invention relates to a laser marking label for forming patterns by a process including the step of selectively destroying a recording layer with a laser beam and exposing lower layers, wherein the laser marking label contains at least a recording layer, a backing layer, a ground layer, a shielding layer, and an adhesive layer, in this order, wherein each of the layers is directly or indirectly laminated. According to the laser marking label of the present invention, patterns of a workpiece or an opening part can be covered for the designing property and prevention of erroneous operation of an optical sensor, and the label can also serve as a display, in other words, excellent shielding ability in both line image portions and non-line image portions can be provided. Also at the same time, a display of white line images on a black background, sufficient durability and sufficient resolution can be realized.
摘要翻译：本发明涉及一种用于通过包括以下步骤的方法形成图案的激光标记标签：包括用激光束选择性地破坏记录层并暴露下层的步骤，其中激光标记标签至少包含记录层，背衬层，接地层，屏蔽层和粘合剂层，其中每个层直接或间接层压。根据本发明的激光标记标签，为了设计性能可以覆盖工件或开口部的图案，并且防止光学传感器的错误操作，并且标签也可以用作显示器，换句话说，可以提供两条线图像部分和非线图像部分中优良的屏蔽能力。同时，可以实现黑色背景上的白线图像的显示，足够的耐久性和足够的分辨率。

2. 发明授权

US07682692B2 Pressure-sensitive adhesive product 失效
标题翻译：压敏胶产品
公开(公告)号：US07682692B2
公开(公告)日：2010-03-23
申请号：US11329046
申请日：2006-01-11
申请人： Tsuneyuki Amano , Takashi Imoto
发明人： Tsuneyuki Amano , Takashi Imoto
IPC分类号： B32B7/12
CPC分类号： C09J133/04 , Y10T428/2852 , Y10T428/2878 , Y10T428/2891 , Y10T428/31928
摘要： A pressure-sensitive adhesive product contains a substrate having formed on at least one surface thereof a pressure-sensitive adhesive layer, wherein the substrate is formed from a styrene-based resin composition and the pressure-sensitive adhesive layer is formed from an acrylic pressure-sensitive adhesive containing an acrylic polymer, a liquid paraffin, and a rosin-based tackifying resin. In the acrylic pressure-sensitive adhesive, the ratio of the liquid paraffin is preferably 6 to 50 parts by weight based on 100 parts by weight of the acrylic polymer and the ratio of the rosin-based tackifying resin is preferably 1 to 30 parts by weight based on 100 parts by weight of the acrylic polymer. The liquid paraffin may have a number-average molecular weight of 300 to 500 and may have a dynamic viscosity at 37.8° C. of 6 to 80 mm2/second.
摘要翻译：压敏粘合剂产品包含在其至少一个表面上形成有压敏粘合剂层的基材，其中基材由苯乙烯基树脂组合物形成，并且压敏粘合剂层由丙烯酸压敏粘合剂层形成，含有丙烯酸类聚合物，液体石蜡和松香类增粘树脂的粘合剂。在丙烯酸类压敏粘合剂中，基于100重量份丙烯酸类聚合物，液体石蜡的比例优选为6〜50重量份，松香系增粘树脂的比例优选为1〜30重量份基于100重量份的丙烯酸类聚合物。液体石蜡的数均分子量可以为300〜500，在37.8℃下的动态粘度为6〜80mm 2 /秒。

3. 发明申请

US20060154056A1 Pressure-sensitive adhesive product and substrate for pressure-sensitive adhesive product 审中-公开
标题翻译：压敏粘合剂产品和压敏粘合剂产品基材
公开(公告)号：US20060154056A1
公开(公告)日：2006-07-13
申请号：US11329055
申请日：2006-01-11
申请人： Takashi Imoto , Tsuneyuki Amano
发明人： Takashi Imoto , Tsuneyuki Amano
IPC分类号： B32B7/12
CPC分类号： C09J155/02 , C08F265/04 , C08L33/20 , C08L35/06 , C08L51/003 , C08L55/02 , C08L2666/02 , C08L2666/04 , C09J7/24 , C09J133/20 , C09J135/04 , C09J135/06 , C09J151/003 , C09J2201/606 , C09J2451/006 , Y10T428/2883 , Y10T428/2887 , Y10T428/2891
摘要： The pressure-sensitive adhesive product has a constitution wherein a pressure-sensitive adhesive layer is formed on at least one surface of a substrate, the substrate being formed from a resin composition containing an acrylonitrile-styrene copolymer and an acrylonitrile-styrene-acrylic rubber copolymer as main components and the weight ratio of the acrylonitrile-styrene copolymer to the acrylonitrile-styrene-acrylic rubber copolymer being 90/10 to 20/80. The above resin composition preferably has a form where the acrylonitrile-styrene-acrylic rubber copolymer is dispersed in the acrylonitrile-styrene copolymer.
摘要翻译：该压敏粘合剂产品具有其中在基材的至少一个表面上形成压敏粘合剂层的构造，该基材由含有丙烯腈 - 苯乙烯共聚物和丙烯腈 - 苯乙烯 - 丙烯酸橡胶共聚物的树脂组合物形成作为主成分，丙烯腈 - 苯乙烯共聚物与丙烯腈 - 苯乙烯 - 丙烯酸橡胶共聚物的重量比为90/10〜20/80。上述树脂组合物优选具有丙烯腈 - 苯乙烯 - 丙烯酸橡胶共聚物分散在丙烯腈 - 苯乙烯共聚物中的形式。

4. 发明申请

US20060154097A1 Pressure-sensitive adhesive product 失效
标题翻译：压敏胶产品
公开(公告)号：US20060154097A1
公开(公告)日：2006-07-13
申请号：US11329046
申请日：2006-01-11
申请人： Tsuneyuki Amano , Takashi Imoto
发明人： Tsuneyuki Amano , Takashi Imoto
IPC分类号： B32B27/08 , B32B7/12
CPC分类号： C09J133/04 , Y10T428/2852 , Y10T428/2878 , Y10T428/2891 , Y10T428/31928
摘要： A pressure-sensitive adhesive product contains a substrate having formed on at least one surface thereof a pressure-sensitive adhesive layer, wherein the substrate is formed from a styrene-based resin composition and the pressure-sensitive adhesive layer is formed from an acrylic pressure-sensitive adhesive containing an acrylic polymer, a liquid paraffin, and a rosin-based tackifying resin. In the acrylic pressure-sensitive adhesive, the ratio of the liquid paraffin is preferably 6 to 50 parts by weight based on 100 parts by weight of the acrylic polymer and the ratio of the rosin-based tackifying resin is preferably 1 to 30 parts by weight based on 100 parts by weight of the acrylic polymer. The liquid paraffin may have a number-average molecular weight of 300 to 500 and may have a dynamic viscosity at 37.8° C. of 6 to 80 mm2/second.
摘要翻译：压敏粘合剂产品包含在其至少一个表面上形成有压敏粘合剂层的基材，其中基材由苯乙烯基树脂组合物形成，并且压敏粘合剂层由丙烯酸压敏粘合剂层形成，含有丙烯酸类聚合物，液体石蜡和松香类增粘树脂的粘合剂。在丙烯酸类压敏粘合剂中，基于100重量份丙烯酸类聚合物，液体石蜡的比例优选为6〜50重量份，松香系增粘树脂的比例优选为1〜30重量份基于100重量份的丙烯酸类聚合物。液体石蜡的数均分子量可以为300〜500，在37.8℃下的动态粘度为6〜80mm 2 /秒。

5. 发明申请

US20120153471A1 SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE 审中-公开
标题翻译：半导体器件和半导体封装
公开(公告)号：US20120153471A1
公开(公告)日：2012-06-21
申请号：US13235408
申请日：2011-09-18
申请人： Takeshi WATANABE , Yuji Karakane , Takashi Imoto
发明人： Takeshi WATANABE , Yuji Karakane , Takashi Imoto
IPC分类号： H01L23/485
CPC分类号： H01L23/3128 , H01L21/566 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/97 , H01L25/0657 , H01L25/105 , H01L2224/32145 , H01L2224/32225 , H01L2224/45144 , H01L2224/48145 , H01L2224/48147 , H01L2224/48225 , H01L2224/48227 , H01L2224/73265 , H01L2224/97 , H01L2225/06506 , H01L2225/0651 , H01L2225/06548 , H01L2225/06562 , H01L2225/06572 , H01L2225/06586 , H01L2225/1023 , H01L2225/1058 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/15311 , H01L2924/15321 , H01L2924/15331 , H01L2924/181 , H01L2924/3511 , H01L2924/00012 , H01L2924/00 , H01L2224/05599
摘要： A semiconductor device according to the present embodiment includes a substrate including wirings. At least one first semiconductor chip is mounted on a first surface of the substrate and is electrically connected to any of the wirings. A first metal ball is provided on the first surface of the substrate and is electrically connected to the first semiconductor chip through any of the wirings. A first resin seals the wirings, the first semiconductor chip, and the first metal ball on the first surface of the substrate. A top of the first metal ball protrudes from a surface of the first resin and is exposed.
摘要翻译：根据本实施例的半导体器件包括包括布线的衬底。至少一个第一半导体芯片安装在基板的第一表面上并且电连接到任何布线。第一金属球设置在基板的第一表面上，并且通过任何布线与第一半导体芯片电连接。第一树脂在衬底的第一表面上密封布线，第一半导体芯片和第一金属球。第一金属球的顶部从第一树脂的表面突出并暴露。

6. 发明申请

US20110309502A1 SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND MANUFACTURING APPARATUS FOR SEMICONDUCTOR DEVICE 有权
标题翻译：半导体器件，制造半导体器件的方法和半导体器件的制造装置
公开(公告)号：US20110309502A1
公开(公告)日：2011-12-22
申请号：US13052368
申请日：2011-03-21
申请人： Yuichi SANO , Takashi Imoto , Naoto Takebe , Katsuhiro Ishida , Tomomi Honda , Yasushi Kumagai
发明人： Yuichi SANO , Takashi Imoto , Naoto Takebe , Katsuhiro Ishida , Tomomi Honda , Yasushi Kumagai
IPC分类号： H01L23/49 , H01L21/60 , H01L21/44
CPC分类号： H01L24/85 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/78 , H01L2224/32145 , H01L2224/32225 , H01L2224/45015 , H01L2224/45144 , H01L2224/48091 , H01L2224/48145 , H01L2224/48227 , H01L2224/48455 , H01L2224/48476 , H01L2224/4848 , H01L2224/48599 , H01L2224/48992 , H01L2224/48997 , H01L2224/4911 , H01L2224/49175 , H01L2224/49429 , H01L2224/73265 , H01L2224/78301 , H01L2224/85181 , H01L2224/92247 , H01L2225/06562 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01057 , H01L2924/01079 , H01L2924/01082 , H01L2924/181 , H01L2924/2075 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , Y10T29/41 , H01L2924/00 , H01L2924/00012 , H01L2224/48465 , H01L2224/85399 , H01L2224/05599
摘要： According to one embodiment, a semiconductor device includes a first semiconductor element, a first electrode, a ball part, a second electrode, and a wire. The first electrode is electrically connected to the first semiconductor element. The ball part is provided on the first electrode. The wire connects the ball part and the second electrode. A thickness of a turned-back portion at an end of the wire on a side opposite to the second electrode is smaller than a diameter of the wire.
摘要翻译：根据一个实施例，半导体器件包括第一半导体元件，第一电极，球形部分，第二电极和线。第一电极电连接到第一半导体元件。球部设置在第一电极上。导线连接球部和第二电极。在与第二电极相反的一侧的线的端部处的折回部分的厚度小于导线的直径。

7. 发明申请

US20080012892A1 PRINTING APPARATUS, INFORMATION PROCESSING APPARATUS, CONTROL METHOD THEREFOR, PRINTING SYSTEM, AND PROGRAM 审中-公开
标题翻译：打印设备，信息处理设备，其控制方法，打印系统和程序
公开(公告)号：US20080012892A1
公开(公告)日：2008-01-17
申请号：US11773957
申请日：2007-07-05
申请人： Takashi Imoto
发明人： Takashi Imoto
IPC分类号： B41J29/393 , G08B21/00
CPC分类号： G06K15/00 , G06K15/002
摘要： When the condition information of a printing apparatus contains a plurality of error/warning information, the printing apparatus determines the priority orders of the error/warning information and whether the plurality of error/warning information are to be notified, based on the print setting information of input print data. Based on the determination result, the printing apparatus generates status information which contains the plurality of error/warning information, their priority order and notification necessary/unnecessary information representing whether the plurality of error/warning information are to be notified. The printing apparatus displays display information corresponding to the error/warning information on the display unit, based on the plurality of error/warning information, their priority orders and the notification necessary/unnecessary information in the generated status information.
摘要翻译：当打印装置的条件信息包含多个错误/警告信息时，打印装置基于打印设置信息确定错误/警告信息的优先顺序以及是否要通知多个错误/警告信息的输入打印数据。基于该确定结果，打印装置生成包含多个错误/警告信息，其优先级顺序和表示是否要通知多个错误/警告信息的必要/不必要的信息的状态信息。打印装置基于生成的状态信息中的多个错误/警告信息，其优先级顺序和通知必要/不必要的信息，在显示单元上显示与错误/警告信息相对应的显示信息。

8. 发明申请

US20060055061A1 Semiconductor device and a method of assembling a semiconductor device 失效
标题翻译：半导体装置及组装半导体装置的方法
公开(公告)号：US20060055061A1
公开(公告)日：2006-03-16
申请号：US11216144
申请日：2005-09-01
申请人： Ryuji Hosokawa , Takashi Imoto
发明人： Ryuji Hosokawa , Takashi Imoto
IPC分类号： H01L23/48
CPC分类号： H01L24/06 , H01L21/565 , H01L23/13 , H01L23/3128 , H01L23/49816 , H01L23/50 , H01L24/48 , H01L24/49 , H01L2224/0401 , H01L2224/04042 , H01L2224/06136 , H01L2224/32225 , H01L2224/45144 , H01L2224/4824 , H01L2224/49175 , H01L2224/73215 , H01L2224/92147 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01029 , H01L2924/01033 , H01L2924/01067 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/15311 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor device includes a substrate having first and second surfaces, the substrate having an opening; a first adhesive layer provided on the first surface; a second adhesive layer provided under the second surface; a third adhesive layer provided around the opening; a semiconductor chip arranging a plurality of chip bonding pads in a central portion of the semiconductor chip and adhered on the third adhesive layer; substrate bonding pads adhered under the second adhesive layer; bonding wires connecting the chip bonding pads to the substrate bonding pads; and an encapsulating resin provided around the semiconductor chip.
摘要翻译：半导体器件包括具有第一和第二表面的衬底，衬底具有开口; 设置在第一表面上的第一粘合剂层; 设置在所述第二表面下方的第二粘合剂层; 围绕所述开口设置的第三粘合剂层; 半导体芯片，其在所述半导体芯片的中心部分布置多个芯片焊盘并粘附在所述第三粘合剂层上; 衬底粘合垫粘附在第二粘合剂层下面; 将芯片接合焊盘连接到衬底接合焊盘的接合线; 以及设置在半导体芯片周围的封装树脂。

9. 发明申请

US20050254084A1 Notifying method, information processing apparatus, and control program 审中-公开
标题翻译：通知方式，信息处理装置和控制程序
公开(公告)号：US20050254084A1
公开(公告)日：2005-11-17
申请号：US10522625
申请日：2003-08-25
申请人： Takashi Imoto
发明人： Takashi Imoto
IPC分类号： G06F3/12 , G06F9/46 , G06K1/00 , G06F15/00
CPC分类号： G06F3/1207 , G06F3/1218 , G06F3/1229 , G06F3/1259 , G06F3/1285
摘要： As an example of an embodiment, there is disclosed a notifying method of notifying the user of information regarding an apparatus in an information processing apparatus which can simultaneously provide an environment, as a user session, which can activate a user's desired program to each of a plurality of users. This method has: an obtaining step of obtaining the information regarding the apparatus; a specifying step of specifying the user session which uses a display unit of the information processing apparatus; and an activating step of activating a display program for displaying the information obtained in the obtaining step by the user session specified in the specifying step.
摘要翻译：作为实施例的示例，公开了一种通知用户有关信息处理设备中的装置的信息的通知方法，其可以同时提供作为用户会话的环境，其可以激活用户期望的节目多个用户。该方法具有获取与该装置有关的信息的获取步骤; 指定使用信息处理装置的显示单元的用户会话的指定步骤; 以及激活步骤，用于激活显示程序，用于显示在指定步骤中指定的用户会话在获取步骤中获得的信息。

10. 发明申请

US20050063651A1 Optical semiconductor module and its manufacturing method 有权
标题翻译：光半导体模块及其制造方法
公开(公告)号：US20050063651A1
公开(公告)日：2005-03-24
申请号：US10898337
申请日：2004-07-26
申请人： Hiroshi Hamasaki , Hideto Furuyama , Hideo Numata , Takashi Imoto
发明人： Hiroshi Hamasaki , Hideto Furuyama , Hideo Numata , Takashi Imoto
IPC分类号： G02B6/42 , H01L31/0232 , H01L33/08 , H01L33/56 , H01L33/62 , H01L29/10
CPC分类号： G02B6/4249 , G02B6/423
摘要： An optical semiconductor module comprises an optical transmission channel including a waveguide transmitting a light beam, a holding member whose holding member holds the channel with the end of the channel being exposed from the surface, electric wiring formed on the surface, an optical semiconductor element, mounted above the surface, including an active area to emit or receive a light beam and an electrode pad electrically connected to the electric wiring, the active area optically coupled to the waveguide at the end of the channel, and an electrical insulation film between the optical semiconductor element and the holding member, including openings each corresponding to an electrical connection between the electrode pad and the electric wiring, and an optically coupling portion between the active area and the waveguide, the electrical insulation film being in contact with a portion of the end of the channel.
摘要翻译：光学半导体模块包括：光传输通道，其包括透射光束的波导;保持部件，其保持部件保持沟道的端部从表面露出，形成在表面上的电布线，光学半导体元件，安装在所述表面上方，包括发射或接收光束的有源区域和电连接到所述电线路的电极焊盘，所述有源区域在所述通道的端部处光耦合到所述波导，以及在所述光学器件之间的电绝缘膜半导体元件和保持构件，包括各自对应于电极焊盘和电布线之间的电连接的开口以及有源区域和波导之间的光学耦合部分，电绝缘膜与端部的一部分接触的频道。

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