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1. 发明申请

US20120153471A1 SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE 审中-公开
标题翻译：半导体器件和半导体封装
公开(公告)号：US20120153471A1
公开(公告)日：2012-06-21
申请号：US13235408
申请日：2011-09-18
申请人： Takeshi WATANABE , Yuji Karakane , Takashi Imoto
发明人： Takeshi WATANABE , Yuji Karakane , Takashi Imoto
IPC分类号： H01L23/485
CPC分类号： H01L23/3128 , H01L21/566 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/97 , H01L25/0657 , H01L25/105 , H01L2224/32145 , H01L2224/32225 , H01L2224/45144 , H01L2224/48145 , H01L2224/48147 , H01L2224/48225 , H01L2224/48227 , H01L2224/73265 , H01L2224/97 , H01L2225/06506 , H01L2225/0651 , H01L2225/06548 , H01L2225/06562 , H01L2225/06572 , H01L2225/06586 , H01L2225/1023 , H01L2225/1058 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/15311 , H01L2924/15321 , H01L2924/15331 , H01L2924/181 , H01L2924/3511 , H01L2924/00012 , H01L2924/00 , H01L2224/05599
摘要： A semiconductor device according to the present embodiment includes a substrate including wirings. At least one first semiconductor chip is mounted on a first surface of the substrate and is electrically connected to any of the wirings. A first metal ball is provided on the first surface of the substrate and is electrically connected to the first semiconductor chip through any of the wirings. A first resin seals the wirings, the first semiconductor chip, and the first metal ball on the first surface of the substrate. A top of the first metal ball protrudes from a surface of the first resin and is exposed.
摘要翻译：根据本实施例的半导体器件包括包括布线的衬底。至少一个第一半导体芯片安装在基板的第一表面上并且电连接到任何布线。第一金属球设置在基板的第一表面上，并且通过任何布线与第一半导体芯片电连接。第一树脂在衬底的第一表面上密封布线，第一半导体芯片和第一金属球。第一金属球的顶部从第一树脂的表面突出并暴露。

2. 发明申请

US20110309502A1 SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND MANUFACTURING APPARATUS FOR SEMICONDUCTOR DEVICE 有权
标题翻译：半导体器件，制造半导体器件的方法和半导体器件的制造装置
公开(公告)号：US20110309502A1
公开(公告)日：2011-12-22
申请号：US13052368
申请日：2011-03-21
申请人： Yuichi SANO , Takashi Imoto , Naoto Takebe , Katsuhiro Ishida , Tomomi Honda , Yasushi Kumagai
发明人： Yuichi SANO , Takashi Imoto , Naoto Takebe , Katsuhiro Ishida , Tomomi Honda , Yasushi Kumagai
IPC分类号： H01L23/49 , H01L21/60 , H01L21/44
CPC分类号： H01L24/85 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/78 , H01L2224/32145 , H01L2224/32225 , H01L2224/45015 , H01L2224/45144 , H01L2224/48091 , H01L2224/48145 , H01L2224/48227 , H01L2224/48455 , H01L2224/48476 , H01L2224/4848 , H01L2224/48599 , H01L2224/48992 , H01L2224/48997 , H01L2224/4911 , H01L2224/49175 , H01L2224/49429 , H01L2224/73265 , H01L2224/78301 , H01L2224/85181 , H01L2224/92247 , H01L2225/06562 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01057 , H01L2924/01079 , H01L2924/01082 , H01L2924/181 , H01L2924/2075 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , Y10T29/41 , H01L2924/00 , H01L2924/00012 , H01L2224/48465 , H01L2224/85399 , H01L2224/05599
摘要： According to one embodiment, a semiconductor device includes a first semiconductor element, a first electrode, a ball part, a second electrode, and a wire. The first electrode is electrically connected to the first semiconductor element. The ball part is provided on the first electrode. The wire connects the ball part and the second electrode. A thickness of a turned-back portion at an end of the wire on a side opposite to the second electrode is smaller than a diameter of the wire.
摘要翻译：根据一个实施例，半导体器件包括第一半导体元件，第一电极，球形部分，第二电极和线。第一电极电连接到第一半导体元件。球部设置在第一电极上。导线连接球部和第二电极。在与第二电极相反的一侧的线的端部处的折回部分的厚度小于导线的直径。

3. 发明申请

US20080012892A1 PRINTING APPARATUS, INFORMATION PROCESSING APPARATUS, CONTROL METHOD THEREFOR, PRINTING SYSTEM, AND PROGRAM 审中-公开
标题翻译：打印设备，信息处理设备，其控制方法，打印系统和程序
公开(公告)号：US20080012892A1
公开(公告)日：2008-01-17
申请号：US11773957
申请日：2007-07-05
申请人： Takashi Imoto
发明人： Takashi Imoto
IPC分类号： B41J29/393 , G08B21/00
CPC分类号： G06K15/00 , G06K15/002
摘要： When the condition information of a printing apparatus contains a plurality of error/warning information, the printing apparatus determines the priority orders of the error/warning information and whether the plurality of error/warning information are to be notified, based on the print setting information of input print data. Based on the determination result, the printing apparatus generates status information which contains the plurality of error/warning information, their priority order and notification necessary/unnecessary information representing whether the plurality of error/warning information are to be notified. The printing apparatus displays display information corresponding to the error/warning information on the display unit, based on the plurality of error/warning information, their priority orders and the notification necessary/unnecessary information in the generated status information.
摘要翻译：当打印装置的条件信息包含多个错误/警告信息时，打印装置基于打印设置信息确定错误/警告信息的优先顺序以及是否要通知多个错误/警告信息的输入打印数据。基于该确定结果，打印装置生成包含多个错误/警告信息，其优先级顺序和表示是否要通知多个错误/警告信息的必要/不必要的信息的状态信息。打印装置基于生成的状态信息中的多个错误/警告信息，其优先级顺序和通知必要/不必要的信息，在显示单元上显示与错误/警告信息相对应的显示信息。

4. 发明申请

US20060055061A1 Semiconductor device and a method of assembling a semiconductor device 失效
标题翻译：半导体装置及组装半导体装置的方法
公开(公告)号：US20060055061A1
公开(公告)日：2006-03-16
申请号：US11216144
申请日：2005-09-01
申请人： Ryuji Hosokawa , Takashi Imoto
发明人： Ryuji Hosokawa , Takashi Imoto
IPC分类号： H01L23/48
CPC分类号： H01L24/06 , H01L21/565 , H01L23/13 , H01L23/3128 , H01L23/49816 , H01L23/50 , H01L24/48 , H01L24/49 , H01L2224/0401 , H01L2224/04042 , H01L2224/06136 , H01L2224/32225 , H01L2224/45144 , H01L2224/4824 , H01L2224/49175 , H01L2224/73215 , H01L2224/92147 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01029 , H01L2924/01033 , H01L2924/01067 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/15311 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor device includes a substrate having first and second surfaces, the substrate having an opening; a first adhesive layer provided on the first surface; a second adhesive layer provided under the second surface; a third adhesive layer provided around the opening; a semiconductor chip arranging a plurality of chip bonding pads in a central portion of the semiconductor chip and adhered on the third adhesive layer; substrate bonding pads adhered under the second adhesive layer; bonding wires connecting the chip bonding pads to the substrate bonding pads; and an encapsulating resin provided around the semiconductor chip.
摘要翻译：半导体器件包括具有第一和第二表面的衬底，衬底具有开口; 设置在第一表面上的第一粘合剂层; 设置在所述第二表面下方的第二粘合剂层; 围绕所述开口设置的第三粘合剂层; 半导体芯片，其在所述半导体芯片的中心部分布置多个芯片焊盘并粘附在所述第三粘合剂层上; 衬底粘合垫粘附在第二粘合剂层下面; 将芯片接合焊盘连接到衬底接合焊盘的接合线; 以及设置在半导体芯片周围的封装树脂。

5. 发明申请

US20050254084A1 Notifying method, information processing apparatus, and control program 审中-公开
标题翻译：通知方式，信息处理装置和控制程序
公开(公告)号：US20050254084A1
公开(公告)日：2005-11-17
申请号：US10522625
申请日：2003-08-25
申请人： Takashi Imoto
发明人： Takashi Imoto
IPC分类号： G06F3/12 , G06F9/46 , G06K1/00 , G06F15/00
CPC分类号： G06F3/1207 , G06F3/1218 , G06F3/1229 , G06F3/1259 , G06F3/1285
摘要： As an example of an embodiment, there is disclosed a notifying method of notifying the user of information regarding an apparatus in an information processing apparatus which can simultaneously provide an environment, as a user session, which can activate a user's desired program to each of a plurality of users. This method has: an obtaining step of obtaining the information regarding the apparatus; a specifying step of specifying the user session which uses a display unit of the information processing apparatus; and an activating step of activating a display program for displaying the information obtained in the obtaining step by the user session specified in the specifying step.
摘要翻译：作为实施例的示例，公开了一种通知用户有关信息处理设备中的装置的信息的通知方法，其可以同时提供作为用户会话的环境，其可以激活用户期望的节目多个用户。该方法具有获取与该装置有关的信息的获取步骤; 指定使用信息处理装置的显示单元的用户会话的指定步骤; 以及激活步骤，用于激活显示程序，用于显示在指定步骤中指定的用户会话在获取步骤中获得的信息。

6. 发明申请

US20050063651A1 Optical semiconductor module and its manufacturing method 有权
标题翻译：光半导体模块及其制造方法
公开(公告)号：US20050063651A1
公开(公告)日：2005-03-24
申请号：US10898337
申请日：2004-07-26
申请人： Hiroshi Hamasaki , Hideto Furuyama , Hideo Numata , Takashi Imoto
发明人： Hiroshi Hamasaki , Hideto Furuyama , Hideo Numata , Takashi Imoto
IPC分类号： G02B6/42 , H01L31/0232 , H01L33/08 , H01L33/56 , H01L33/62 , H01L29/10
CPC分类号： G02B6/4249 , G02B6/423
摘要： An optical semiconductor module comprises an optical transmission channel including a waveguide transmitting a light beam, a holding member whose holding member holds the channel with the end of the channel being exposed from the surface, electric wiring formed on the surface, an optical semiconductor element, mounted above the surface, including an active area to emit or receive a light beam and an electrode pad electrically connected to the electric wiring, the active area optically coupled to the waveguide at the end of the channel, and an electrical insulation film between the optical semiconductor element and the holding member, including openings each corresponding to an electrical connection between the electrode pad and the electric wiring, and an optically coupling portion between the active area and the waveguide, the electrical insulation film being in contact with a portion of the end of the channel.
摘要翻译：光学半导体模块包括：光传输通道，其包括透射光束的波导;保持部件，其保持部件保持沟道的端部从表面露出，形成在表面上的电布线，光学半导体元件，安装在所述表面上方，包括发射或接收光束的有源区域和电连接到所述电线路的电极焊盘，所述有源区域在所述通道的端部处光耦合到所述波导，以及在所述光学器件之间的电绝缘膜半导体元件和保持构件，包括各自对应于电极焊盘和电布线之间的电连接的开口以及有源区域和波导之间的光学耦合部分，电绝缘膜与端部的一部分接触的频道。

7. 发明授权

US06617678B2 Semiconductor device 失效
公开(公告)号：US06617678B2
公开(公告)日：2003-09-09
申请号：US10145722
申请日：2002-05-16
申请人： Takashi Yamazaki , Mitsuyoshi Endo , Chiaki Takubo , Katsuhiko Oyama , Takashi Imoto , Mikio Matsui
发明人： Takashi Yamazaki , Mitsuyoshi Endo , Chiaki Takubo , Katsuhiko Oyama , Takashi Imoto , Mikio Matsui
IPC分类号： H01L2302
CPC分类号： H01L25/0657 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2225/0652 , H01L2225/06524 , H01L2225/06527 , H01L2225/06541 , H01L2225/06555 , H01L2225/06562 , H01L2225/06572 , H01L2225/06586 , H01L2924/01039 , H01L2924/01078 , H01L2924/01079 , H01L2924/15153 , H01L2924/1517 , H01L2924/15311 , H01L2924/1532 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： There is disclosed a semiconductor device which comprises a first chip-mounting substrate on which at least one semiconductor chip having a plurality of terminals is mounted, and a plurality of relay terminals electrically connected to the respective terminals of the semiconductor chip are disposed to surround a portion with the semiconductor chip mounted thereon from the outside in the vicinity of the portion, a second chip-mounting substrate which is laminated on the first chip-mounting substrate and on which at least one semiconductor chip is mounted, a plurality of relay terminals electrically connected to the respective terminals of the semiconductor chip are disposed to surround a portion with the semiconductor chip mounted thereon from the outside in the vicinity of the portion, and at least one of the semiconductor chips has a center offset from a center of a whole arrangement of the relay terminals.

8. 发明申请

US20120257242A1 INFORMATION PROCESSING APPARATUS, INFORMATION PROCESSING METHOD, AND STORAGE MEDIUM 有权
标题翻译：信息处理设备，信息处理方法和存储介质
公开(公告)号：US20120257242A1
公开(公告)日：2012-10-11
申请号：US13437388
申请日：2012-04-02
申请人： Takashi Imoto
发明人： Takashi Imoto
IPC分类号： G06K15/02
CPC分类号： G06F3/1222 , G06F3/1238 , G06F3/1239 , G06F3/1267 , G06F21/10 , G06F21/608
摘要： An information processing apparatus and method includes determining whether print data is limited in a number of times of printing, determining whether a setting of storing the print data in the information processing apparatus is valid, and stopping transmission of the print data in a case where it is determined that the print data is limited in the number of times of printing and it is determined that the setting is valid.
摘要翻译：一种信息处理装置和方法，包括：确定打印数据是否在多次打印中被限制，确定在信息处理装置中存储打印数据的设置是否有效，以及在其中的情况下停止打印数据的传送确定打印数据被限制在打印次数中，并且确定该设置有效。

9. 发明授权

US07932605B2 Semiconductor device and manufacturing method therefor 有权
标题翻译：半导体装置及其制造方法
公开(公告)号：US07932605B2
公开(公告)日：2011-04-26
申请号：US11889071
申请日：2007-08-08
申请人： Takashi Imoto , Chiaki Takubo
发明人： Takashi Imoto , Chiaki Takubo
IPC分类号： H01L23/52 , H01L23/48 , H01L29/40
CPC分类号： H01L24/34 , H01L21/486 , H01L23/49816 , H01L23/5389 , H01L24/37 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/81 , H01L25/105 , H01L2224/16225 , H01L2224/16227 , H01L2224/16237 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/37147 , H01L2224/37599 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/73204 , H01L2224/73265 , H01L2224/81192 , H01L2224/81801 , H01L2224/82 , H01L2224/83192 , H01L2224/8385 , H01L2224/85 , H01L2224/86 , H01L2224/92 , H01L2224/92247 , H01L2225/06568 , H01L2225/1035 , H01L2225/1041 , H01L2225/1058 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12041 , H01L2924/12042 , H01L2924/15311 , H01L2924/16152 , H01L2924/181 , H01L2924/3511 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： There is disclosed a semiconductor device comprising at least one semiconductor element, one chip mounting base being provided at least one first interconnection on one major surface thereof and at least one second interconnection on the other major surface thereof, and the semiconductor element being electrically connected to at least the one first interconnection and mounted on the one major surface, a sealing member being provided on the one major surface of the chip mounting base and covering the semiconductor element and the first interconnection, at least one third interconnection being provided on a surface of the sealing member, and at least one fourth interconnection being provided in the sealing member and the chip mounting base, and electrically connected to the first interconnection, the second interconnection, and the third interconnection.
摘要翻译：公开了一种包括至少一个半导体元件的半导体器件，一个芯片安装基座在其一个主表面上设置有至少一个第一互连件和在其另一个主表面上的至少一个第二互连件，并且该半导体元件电连接到至少一个第一互连并且安装在所述一个主表面上，密封构件设置在所述芯片安装基座的所述一个主表面上并且覆盖所述半导体元件和所述第一互连，至少一个第三互连设置在所述密封构件和至少一个第四互连件设置在所述密封构件和所述芯片安装基座中，并且电连接到所述第一互连，所述第二互连和所述第三互连。

10. 发明授权

US07608911B2 Semiconductor device package having a semiconductor element with a roughened surface 有权
标题翻译：具有具有粗糙表面的半导体元件的半导体器件封装
公开(公告)号：US07608911B2
公开(公告)日：2009-10-27
申请号：US12213766
申请日：2008-06-24
申请人： Takashi Imoto , Chiaki Takubo , Ryuji Hosokawa , Yoshihisa Imori , Takao Sato , Tetsuya Kurosawa , Mika Kiritani
发明人： Takashi Imoto , Chiaki Takubo , Ryuji Hosokawa , Yoshihisa Imori , Takao Sato , Tetsuya Kurosawa , Mika Kiritani
IPC分类号： H01L29/06
CPC分类号： H01L23/3142 , H01L23/3121 , H01L23/3178 , H01L23/5222 , H01L23/5329 , H01L24/48 , H01L24/73 , H01L2224/16225 , H01L2224/16227 , H01L2224/16235 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/00014 , H01L2924/10155 , H01L2924/10157 , H01L2924/10253 , H01L2924/12042 , H01L2924/15153 , H01L2924/1517 , H01L2924/15174 , H01L2924/15311 , H01L2924/1532 , H01L2924/16152 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor device is disclosed, which comprises a semiconductor element in which a laminated film composed of a plurality of layers including an insulating film is formed on a surface of a semiconductor substrate, and a portion of the laminated film is removed from the surface of the semiconductor substrate so that the semiconductor substrate is exposed at the portion, a mounting substrate on which the semiconductor element is mounted, and a resin layer which seals at least a surface side of the semiconductor element with resin.
摘要翻译：公开了一种半导体器件，其包括半导体元件，其中在半导体衬底的表面上形成由包括绝缘膜的多个层组成的层叠膜，并且将层压膜的一部分从半导体衬底，使得半导体衬底在该部分处露出，其上安装有半导体元件的安装衬底和用树脂密封半导体元件的至少表面侧的树脂层。

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