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1. 发明授权

US07700381B2 Semiconductor wafer with ID mark, equipment for and method of manufacturing semiconductor device from them 失效
标题翻译：具有ID标记的半导体晶圆，其半导体器件的制造方法和制造方法
公开(公告)号：US07700381B2
公开(公告)日：2010-04-20
申请号：US11350027
申请日：2006-02-09
申请人： Tsunetoshi Arikado , Masao Iwase , Soichi Nadahara , Yuso Udo , Yukihiro Ushiku , Shinichi Nitta , Moriya Miyashita , Junji Sugamoto , Hiroaki Yamada , Hajime Nagano , Katsujiro Tanzawa , Hiroshi Matsushita , Norihiko Tsuchiya , Katsuya Okumura
发明人： Tsunetoshi Arikado , Masao Iwase , Soichi Nadahara , Yuso Udo , Yukihiro Ushiku , Shinichi Nitta , Moriya Miyashita , Junji Sugamoto , Hiroaki Yamada , Hajime Nagano , Katsujiro Tanzawa , Hiroshi Matsushita , Norihiko Tsuchiya , Katsuya Okumura
IPC分类号： G01R31/26 , H01L21/66
CPC分类号： H01L23/544 , H01L2223/54406 , H01L2223/54413 , H01L2223/54433 , H01L2223/54493 , H01L2924/0002 , Y10S438/974 , H01L2924/00
摘要： A semiconductor wafer has a bevel contour formed along the periphery thereof, products formed on the wafer, and an ID mark formed on the bevel contour. The ID mark shows at least the properties, manufacturing conditions, and test results of the products.
摘要翻译：半导体晶片具有沿其周边形成的斜面轮廓，形成在晶片上的产品和形成在斜面轮廓上的ID标记。 ID标记至少显示产品的性能，制造条件和测试结果。

2. 发明申请

US20060131696A1 Semiconductor wafer with ID mark, equipment for and method of manufacturing semiconductor device from them 失效
公开(公告)号：US20060131696A1
公开(公告)日：2006-06-22
申请号：US11350027
申请日：2006-02-09
申请人： Tsunetoshi Arikado , Masao Iwase , Soichi Nadahara , Yuso Udo , Yukihiro Ushiku , Shinichi Nitta , Moriya Miyashita , Junji Sugamoto , Hiroaki Yamada , Hajime Nagano , Katsujiro Tanzawa , Hiroshi Matsushita , Norihiko Tsuchiya , Katsuya Okumura
发明人： Tsunetoshi Arikado , Masao Iwase , Soichi Nadahara , Yuso Udo , Yukihiro Ushiku , Shinichi Nitta , Moriya Miyashita , Junji Sugamoto , Hiroaki Yamada , Hajime Nagano , Katsujiro Tanzawa , Hiroshi Matsushita , Norihiko Tsuchiya , Katsuya Okumura
IPC分类号： H01L29/06 , H01L23/02
CPC分类号： H01L23/544 , H01L2223/54406 , H01L2223/54413 , H01L2223/54433 , H01L2223/54493 , H01L2924/0002 , Y10S438/974 , H01L2924/00
摘要： A semiconductor wafer has a bevel contour formed along the periphery thereof, products formed on the wafer, and an ID mark formed on the bevel contour. The ID mark shows at least the properties, manufacturing conditions, and test results of the products.

3. 发明授权

US07057259B2 Semiconductor wafer with ID mark, equipment for and method of manufacturing semiconductor device from them 失效
公开(公告)号：US07057259B2
公开(公告)日：2006-06-06
申请号：US10101337
申请日：2002-03-20
申请人： Tsunetoshi Arikado , Masao Iwase , Soichi Nadahara , Yuso Udo , Yukihiro Ushiku , Shinichi Nitta , Moriya Miyashita , Junji Sugamoto , Hiroaki Yamada , Hajime Nagano , Katsujiro Tanzawa , Hiroshi Matsushita , Norihiko Tsuchiya , Katsuya Okumura
发明人： Tsunetoshi Arikado , Masao Iwase , Soichi Nadahara , Yuso Udo , Yukihiro Ushiku , Shinichi Nitta , Moriya Miyashita , Junji Sugamoto , Hiroaki Yamada , Hajime Nagano , Katsujiro Tanzawa , Hiroshi Matsushita , Norihiko Tsuchiya , Katsuya Okumura
IPC分类号： H01L29/06
CPC分类号： H01L23/544 , H01L2223/54406 , H01L2223/54413 , H01L2223/54433 , H01L2223/54493 , H01L2924/0002 , Y10S438/974 , H01L2924/00
摘要： A semiconductor wafer has a bevel contour formed along the periphery thereof, products formed on the wafer, and an ID mark formed on the bevel contour. The ID mark shows at least the properties, manufacturing conditions, and test results of the products.

4. 发明申请

US20060281281A1 Method of inspecting semiconductor wafer 失效
公开(公告)号：US20060281281A1
公开(公告)日：2006-12-14
申请号：US11444301
申请日：2006-06-01
申请人： Katsujiro Tanzawa , Norihiko Tsuchiya , Junji Sugamoto , Yukihiro Ushiku
发明人： Katsujiro Tanzawa , Norihiko Tsuchiya , Junji Sugamoto , Yukihiro Ushiku
IPC分类号： H01L21/66 , H01L21/30
CPC分类号： H01L22/12 , G01N21/9501
摘要： A method of inspecting a semiconductor wafer, comprises removing a device structure film on the semiconductor wafer with a chemical solution to expose a crystal surface of the semiconductor wafer; coating a protected area, which is a part of the crystal surface of the semiconductor wafer, with a mask material for protecting the crystal surface of the semiconductor wafer; etching the semiconductor wafer selectively, thereby making a crystal defect in a non-protected area, which is a part of the crystal surface of the semiconductor wafer that is not coated with the mask material, appear after the crystal surface is coated with the mask material; removing the mask material after the selective etching; carrying out quantitative measurement of the protected area and the non-protected area using an optical defect inspection apparatus or a beam-type defect inspection apparatus; and calculating the number of crystal defects of the semiconductor wafer base on the result of the measurement.

5. 发明授权

US07531462B2 Method of inspecting semiconductor wafer 失效
标题翻译：检查半导体晶圆的方法
公开(公告)号：US07531462B2
公开(公告)日：2009-05-12
申请号：US11444301
申请日：2006-06-01
申请人： Katsujiro Tanzawa , Norihiko Tsuchiya , Junji Sugamoto , Yukihiro Ushiku
发明人： Katsujiro Tanzawa , Norihiko Tsuchiya , Junji Sugamoto , Yukihiro Ushiku
IPC分类号： H01L21/302
CPC分类号： H01L22/12 , G01N21/9501
摘要： A method of inspecting a semiconductor wafer, comprises removing a device structure film on the semiconductor wafer with a chemical solution to expose a crystal surface of the semiconductor wafer; coating a protected area, which is a part of the crystal surface of the semiconductor wafer, with a mask material for protecting the crystal surface of the semiconductor wafer; etching the semiconductor wafer selectively, thereby making a crystal defect in a non-protected area, which is a part of the crystal surface of the semiconductor wafer that is not coated with the mask material, appear after the crystal surface is coated with the mask material; removing the mask material after the selective etching; carrying out quantitative measurement of the protected area and the non-protected area using an optical defect inspection apparatus or a beam-type defect inspection apparatus; and calculating the number of crystal defects of the semiconductor wafer base on the result of the measurement.
摘要翻译：一种检查半导体晶片的方法，包括用化学溶液去除半导体晶片上的器件结构膜以暴露半导体晶片的晶体表面; 用保护半导体晶片的晶体表面的掩模材料涂覆作为半导体晶片的晶体表面的一部分的保护区域; 选择性地蚀刻半导体晶片，从而在未涂覆有掩模材料的半导体晶片的晶体表面的一部分的非保护区域中出现晶体缺陷，在晶体表面涂覆有掩模材料之后 ; 在选择性蚀刻之后去除掩模材料; 使用光学缺陷检查装置或光束型缺陷检查装置进行保护区域和非保护区域的定量测量; 并根据测量结果计算半导体晶片基底的晶体缺陷数。

6. 发明授权

US07314766B2 Semiconductor wafer treatment method, semiconductor wafer inspection method, semiconductor device development method and semiconductor wafer treatment apparatus 失效
标题翻译：半导体晶片处理方法，半导体晶片检查方法，半导体器件显影方法和半导体晶片处理装置
公开(公告)号：US07314766B2
公开(公告)日：2008-01-01
申请号：US10706090
申请日：2003-11-13
申请人： Junji Sugamoto , Norihiko Tsuchiya , Yukihiro Ushiku , Katsujiro Tanzawa
发明人： Junji Sugamoto , Norihiko Tsuchiya , Yukihiro Ushiku , Katsujiro Tanzawa
IPC分类号： H01L21/00
CPC分类号： H01L22/24 , H01L2924/0002 , H01L2924/00
摘要： A treatment method of a semiconductor wafer includes treating the semiconductor wafer in a first solution having at least one kind of an oxidative acid and an oxidizing agent and treating the semiconductor wafer in a second solution having at least one of HF and NH4F.
摘要翻译：半导体晶片的处理方法包括在具有至少一种氧化酸和氧化剂的第一溶液中处理半导体晶片，并且在具有HF和NH 4中的至少一种的第二溶液中处理半导体晶片 F。

7. 发明授权

US07221991B2 System and method for monitoring manufacturing apparatuses 失效
标题翻译：用于监控制造装置的系统和方法
公开(公告)号：US07221991B2
公开(公告)日：2007-05-22
申请号：US11068778
申请日：2005-03-02
申请人： Hiroshi Matsushita , Tomonobu Noda , Kenichi Kadota , Junji Sugamoto , Yukihiro Ushiku
发明人： Hiroshi Matsushita , Tomonobu Noda , Kenichi Kadota , Junji Sugamoto , Yukihiro Ushiku
IPC分类号： G06F19/00
CPC分类号： H01L22/20 , G01R31/2894 , G05B23/0248 , G05B2219/31357 , Y02P90/14
摘要： A control system for a manufacturing apparatus includes manufacturing information input unit acquiring time series data of apparatus parameters controlling manufacturing apparatuses; failure pattern classification module classifying in-plane distributions of failures of each of the wafers into failure patterns; an index calculation unit configured to statistically process the time series data by algorithms to calculate indices corresponding to the respective algorithms; an index analysis unit providing first and second frequency distributions of the indices categorized with and without the target failure pattern, to implement significance test between the first and second frequency distributions; and an abnormal parameter extraction unit extracting failure cause index of failure pattern by comparing value of the significance test with test reference value.
摘要翻译：一种制造装置的控制系统，包括制造信息输入单元，其获取控制制造装置的装置参数的时间序列数据; 故障模式分类模块将每个晶片的故障平面内分布分为故障模式; 索引计算单元，被配置为通过算法对所述时间序列数据进行统计处理，以计算与各个算法对应的索引; 索引分析单元，提供分类有和没有目标故障模式的索引的第一和第二频率分布，以实现第一和第二频率分布之间的显着性测试; 异常参数提取单元通过比较显着性检验值与检测参考值，提取失效原因指标的故障模式。

8. 发明申请

US20050194590A1 System and method for controlling manufacturing apparatuses 失效
标题翻译：用于控制制造装置的系统和方法
公开(公告)号：US20050194590A1
公开(公告)日：2005-09-08
申请号：US11068778
申请日：2005-03-02
申请人： Hiroshi Matsushita , Tomonobu Noda , Kenichi Kadota , Junji Sugamoto , Yukihiro Ushiku
发明人： Hiroshi Matsushita , Tomonobu Noda , Kenichi Kadota , Junji Sugamoto , Yukihiro Ushiku
IPC分类号： H01L21/66 , G01R31/26 , H01L21/02 , H01L23/58
CPC分类号： H01L22/20 , G01R31/2894 , G05B23/0248 , G05B2219/31357 , Y02P90/14
摘要： A control system for a manufacturing apparatus includes manufacturing information input unit acquiring time series data of apparatus parameters controlling manufacturing apparatuses; failure pattern classification module classifying in-plane distributions of failures of each of the wafers into failure patterns; an index calculation unit configured to statistically process the time series data by algorithms to calculate indices corresponding to the respective algorithms; an index analysis unit providing first and second frequency distributions of the indices categorized with and without the target failure pattern, to implement significance test between the first and second frequency distributions; and an abnormal parameter extraction unit extracting failure cause index of failure pattern by comparing value of the significance test with test reference value.
摘要翻译：一种制造装置的控制系统，包括制造信息输入单元，其获取控制制造装置的装置参数的时间序列数据; 故障模式分类模块将每个晶片的故障平面内分布分为故障模式; 索引计算单元，被配置为通过算法对所述时间序列数据进行统计处理，以计算与各个算法对应的索引; 索引分析单元，提供分类有和没有目标故障模式的索引的第一和第二频率分布，以实现第一和第二频率分布之间的显着性测试; 异常参数提取单元通过比较显着性检验值与检测参考值，提取失效原因指标的故障模式。

9. 发明授权

US06865513B2 Method for predicting life of rotary machine and determining repair timing of rotary machine 失效
标题翻译：预测旋转机寿命的方法，确定旋转机的修理时间
公开(公告)号：US06865513B2
公开(公告)日：2005-03-08
申请号：US10101720
申请日：2002-03-21
申请人： Yukihiro Ushiku , Tsunetoshi Arikado , Shuichi Samata , Takashi Nakao , Yuuichi Mikata
发明人： Yukihiro Ushiku , Tsunetoshi Arikado , Shuichi Samata , Takashi Nakao , Yuuichi Mikata
IPC分类号： F04D27/00 , F04B37/16 , F04B49/06 , F04B49/10 , F04B51/00 , G01M13/00 , H01L21/00 , G06F11/30
CPC分类号： F04B51/00 , F04B49/065 , F04D19/04 , F04D27/001 , G01M13/00
摘要： An apparatus for predicting life expectancy of a rotary machine includes: a load recipe input module acquiring loading conditions of a rotary machine; a characterizing feature input module obtaining characterizing feature data of a rotary machine; and a life expectancy prediction module calculating life expectancy of the rotary machine in conformity with the loading conditions and the characterizing feature datap.
摘要翻译：一种用于预测旋转机器的预期寿命的装置包括：负载配方输入模块，其获取旋转机器的负载条件; 特征特征输入模块获得旋转机器的特征特征数据; 以及根据加载条件和特征特征数据表计算旋转机器的预期寿命的预期寿命预测模块。

10. 发明授权

US06944572B2 Apparatus for predicting life of rotary machine and equipment using the same 失效
标题翻译：用于预测旋转机器和使用其的设备的寿命的装置
公开(公告)号：US06944572B2
公开(公告)日：2005-09-13
申请号：US10752816
申请日：2004-01-08
申请人： Yukihiro Ushiku , Tsunetoshi Arikado , Shuichi Samata , Takashi Nakao , Yuuichi Mikata
发明人： Yukihiro Ushiku , Tsunetoshi Arikado , Shuichi Samata , Takashi Nakao , Yuuichi Mikata
IPC分类号： F04D27/00 , F04B37/16 , F04B49/06 , F04B49/10 , F04B51/00 , G01M13/00 , H01L21/00 , G06F101/21
CPC分类号： F04B51/00 , F04B49/065 , F04D19/04 , F04D27/001 , G01M13/00
摘要： An apparatus for predicting life expectancy of a rotary machine includes: a load recipe input module acquiring loading conditions of a rotary machine; a characterizing feature input module obtaining characterizing feature data of a rotary machine; and a life expectancy prediction module calculating life expectancy of the rotary machine in conformity with the loading conditions and the characterizing feature data.
摘要翻译：一种用于预测旋转机器的预期寿命的装置包括：负载配方输入模块，其获取旋转机器的负载条件; 特征特征输入模块获得旋转机器的特征特征数据; 以及根据负载条件和特征特征数据计算旋转机器的预期寿命的预期寿命预测模块。

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